Patents by Inventor Chao-Hung Tseng

Chao-Hung Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110068249
    Abstract: A mold includes a substrate and a plurality of micro-structures. The micro-structures are disposed on the substrate. Each of the micro-structures includes a supporting layer and a convex top portion. The supporting layer is disposed on the substrate, wherein the material of the supporting layer is amorphous metal. The convex top portion is disposed on the supporting layer, wherein the material of the convex top portion is a thermoplastic polymer.
    Type: Application
    Filed: November 29, 2010
    Publication date: March 24, 2011
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Kun-Chih Pan, Chao-Hung Tseng, Chih-Hung CHU, Chia-Hsu Tu, Jen-Shun Lin
  • Publication number: 20100124605
    Abstract: A mold includes a substrate and a plurality of micro-structures. The micro-structures are disposed on the substrate. Each of the micro-structures includes a supporting layer and a convex top portion. The supporting layer is disposed on the substrate, wherein the material of the supporting layer is amorphous metal. The convex top portion is disposed on the supporting layer, wherein the material of the convex top portion is a thermoplastic polymer.
    Type: Application
    Filed: October 12, 2009
    Publication date: May 20, 2010
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Kun-Chih Pan, Chao-Hung Tseng, Chih-Hung Chu, Chia-Hsu Tu, Jen-Shun Lin
  • Publication number: 20060215268
    Abstract: A light diffraction plate includes a light transmissive layer, and at least one light diffraction layer which is formed on the light transmissive layer, and which has a plurality of light diffraction units. The light diffraction units are formed as protrusions or indentations, and are formed by hot pressing or embossing and curing.
    Type: Application
    Filed: March 28, 2005
    Publication date: September 28, 2006
    Inventors: Kinju Taya, Chao-Hung Tseng