Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A mold includes a substrate and a plurality of micro-structures. The micro-structures are disposed on the substrate. Each of the micro-structures includes a supporting layer and a convex top portion. The supporting layer is disposed on the substrate, wherein the material of the supporting layer is amorphous metal. The convex top portion is disposed on the supporting layer, wherein the material of the convex top portion is a thermoplastic polymer.

Abstract: A mold includes a substrate and a plurality of micro-structures. The micro-structures are disposed on the substrate. Each of the micro-structures includes a supporting layer and a convex top portion. The supporting layer is disposed on the substrate, wherein the material of the supporting layer is amorphous metal. The convex top portion is disposed on the supporting layer, wherein the material of the convex top portion is a thermoplastic polymer.

Abstract: A light diffraction plate includes a light transmissive layer, and at least one light diffraction layer which is formed on the light transmissive layer, and which has a plurality of light diffraction units. The light diffraction units are formed as protrusions or indentations, and are formed by hot pressing or embossing and curing.