Abstract: Provided is a package structure including a first redistribution layer (RDL) structure, a die, a circuit substrate, and a first thermoelectric cooler. The RDL) structure has a first side and a second side opposite to each other. The die is disposed on the first side of the first RDL structure. The circuit substrate is bonded to the second side of the first RDL structure through a plurality of first conductive connectors. The first thermoelectric cooler is between the first RDL structure and the circuit substrate, wherein the first thermoelectric cooler includes at least a N-type doped region and at least a P-type doped region.

Abstract: The present invention relates to the treatment of herpes simplex virus (HSV) infection using an anti-HSV antibody. In particular, the anti-HSV antibody specifically binds to the glycoprotein D (gD) of herpes simplex virus-1 (HSV-1) and herpes simplex virus-2 (HSV-2). The treatment of the present invention is effective against drug-resistant and/or recurrent HSV infection.

Abstract: A vacuum suction wall-climbing robot including a body, a vacuum pump and at least four leg mechanisms is disclosed. Each leg mechanism includes a foot unit and a limb unit connecting the foot unit and the body. The foot unit includes a plurality of suction sets connected to the vacuum pump through a pipe. Each suction set includes a sucker able to create a vacuum state within a contact area through the operation of the vacuum pump, and a sheet valve arranged between the pipe and the sucker, which automatically closes the connection between the pipe and the sucker when the vacuum state between the sucker and the contact area becomes a non-vacuum state.