Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: Devices and methods of manufacture and use of a fiber bundle is presented. In embodiments the fiber bundle comprises a substrate material and optical fiber openings that extend from a first side of the substrate material to a second side of the substrate material, wherein the optical fiber openings at the first side of the substrate material are shifted either horizontally or vertically from the second side of the substrate material.

Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.

Abstract: A context-based adaptive binary arithmetic coding (CABAC) decoder includes a bin decode circuit and a context update circuit. The bin decode circuit supports decoding of multiple bins in one cycle. The multiple bins include a first bin and a second bin. The bin decode circuit generates a bin value of the first bin according to a first set of multiple contexts, a first range and a first offset, and generates one bin value of the second bin according to a second set of multiple contexts, a second range and a second offset. The context update circuit updates the first set of multiple contexts in response to the bin value of the first bin, to generate a first set of multiple updated contexts, and updates the second set of multiple contexts in response to said one bin value of the second bin, to generate a second set of multiple updated contexts.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: A semiconductor device includes a gate structure on a substrate, a first spacer on a sidewall of the gate structure, a second spacer on a sidewall of the first spacer, a third spacer on a sidewall of the second spacer, and first and second stacks of an epitaxial layer and a cap layer respectively disposed at first and second sides of the gate structure. Preferably, a part of the second spacer comprises an I-shape, the cap layer includes a planar top surface and an inclined sidewall, the cap layer contacts the second spacer and the third spacer directly, and the cap layer includes a vertical sidewall connected to the inclined sidewall.

Abstract: A method includes connecting a photonic package to a substrate, wherein the photonic package includes a waveguide and an edge coupler that is optically coupled to the waveguide; connecting a semiconductor device to the substrate adjacent the photonic package; depositing a first protection material on a first sidewall of the photonic package that is adjacent the edge coupler; encapsulating the photonic package and the semiconductor device with an encapsulant; performing a first sawing process through the encapsulant and the substrate, wherein the first sawing process exposes the first protection material; and removing the first protection material to expose the first sidewall of the photonic package.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A controller of a buck-boost conversion circuit and a mode switching method thereof are provided. The controller control operations of multiple switches of the buck-boost conversion circuit to convert an input voltage into an output voltage and provide an output current. The controller includes a slope compensation circuit, a control loop, and a mode switching circuit. The slope compensation circuit generates a slope compensation signal according to a mode switching signal of a current cycle. The control loop is coupled to the slope compensation circuit and the switches respectively, and is configured to generate multiple switch control signals according to the slope compensation signal, a feedback voltage related to the output voltage, and a current sense signal related to the output current to control the operations of the switches respectively. The mode switching circuit is coupled to the slope compensation circuit and the control loop.

Abstract: A metal clad substrate is disclosed. The metal clad substrate includes a metal baseplate, a metal layer, and a thermally conductive bonding layer disposed therebetween. The thermally conductive bonding layer includes a lower adhesive layer, a fiber-containing layer, and an upper adhesive layer. An upper side and a lower side of the upper adhesive layer contacts the metal layer and the fiber-containing layer, respectively. An upper side and a lower side of the lower adhesive layer contacts the fiber-containing layer and the metal baseplate, respectively. Each of the metal layer and the metal baseplate has a thickness of 0.3 mm - 15 mm. The fiber-containing layer includes a polymer as well as a heat conductive filler and a short fiber evenly dispersed in the polymer. The short fiber is in shape of a string and has a length of 5 µm-210 µm.

Abstract: A functional module is applied in a front light module of a display device. The functional module includes a composite cover structure having a first plate and a second plate and a reflective display panel. The second plate is located between the first plate and the reflective display panel. At least one medium layer is located between the first plate of the composite cover structure and the reflective display panel. The refractive index of the medium layer is greater than or equal to 1 and is smaller than 1.474.

Abstract: A functional module is applied in a front light module of a display device. The functional module includes a composite cover structure having a first plate and a second plate and a reflective display panel. The second plate is located between the first plate and the reflective display panel. At least one medium layer is located between the first plate of the composite cover structure and the reflective display panel. The refractive index of the medium layer is greater than or equal to 1 and is smaller than 1.474.

Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.

Abstract: According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.

Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10?2 g/m2-day.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10?2 g/m2-day.

Abstract: According to an embodiment of the present disclosure, a flexible electronic device may include a unit structure including a substrate unit and a wiring structure. The substrate unit has slits to divide connecting portions between respective ends of two slits and wiring regions arranged outwardly from at least one unit center sequentially. The wiring structure is disposed on the substrate unit and includes wirings distributed in the wiring regions. Each wiring includes circumferential portions and radial portions connected between the circumferential portions. The radial portion connected to a first end of each circumferential portion extends toward the unit center from the first end. Each circumferential portion includes a first section and a second section. The first section is closer to the first end and has greater anti-stretching ability than the second section.