Abstract: An optical system is provided. The optical system is used for disposing on an electronic device. The optical system includes a movable portion, a fixed portion, a first driving assembly, and a support module. The movable portion is used for connecting to an optical module. The fixed portion is affixed on the electronic device, and the movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion through the support module.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: The present invention relates to the treatment of herpes simplex virus (HSV) infection using an anti-HSV antibody. In particular, the anti-HSV antibody specifically binds to the glycoprotein D (gD) of herpes simplex virus-1 (HSV-1) and herpes simplex virus-2 (HSV-2). The treatment of the present invention is effective against drug-resistant and/or recurrent HSV infection.

Abstract: A metal clad substrate is disclosed. The metal clad substrate includes a metal baseplate, a metal layer, and a thermally conductive bonding layer disposed therebetween. The thermally conductive bonding layer includes a lower adhesive layer, a fiber-containing layer, and an upper adhesive layer. An upper side and a lower side of the upper adhesive layer contacts the metal layer and the fiber-containing layer, respectively. An upper side and a lower side of the lower adhesive layer contacts the fiber-containing layer and the metal baseplate, respectively. Each of the metal layer and the metal baseplate has a thickness of 0.3 mm - 15 mm. The fiber-containing layer includes a polymer as well as a heat conductive filler and a short fiber evenly dispersed in the polymer. The short fiber is in shape of a string and has a length of 5 µm-210 µm.

Abstract: A functional module is applied in a front light module of a display device. The functional module includes a composite cover structure having a first plate and a second plate and a reflective display panel. The second plate is located between the first plate and the reflective display panel. At least one medium layer is located between the first plate of the composite cover structure and the reflective display panel. The refractive index of the medium layer is greater than or equal to 1 and is smaller than 1.474.

Abstract: A functional module is applied in a front light module of a display device. The functional module includes a composite cover structure having a first plate and a second plate and a reflective display panel. The second plate is located between the first plate and the reflective display panel. At least one medium layer is located between the first plate of the composite cover structure and the reflective display panel. The refractive index of the medium layer is greater than or equal to 1 and is smaller than 1.474.

Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.

Abstract: According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.

Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10?2 g/m2-day.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10?2 g/m2-day.

Abstract: According to an embodiment of the present disclosure, a flexible electronic device may include a unit structure including a substrate unit and a wiring structure. The substrate unit has slits to divide connecting portions between respective ends of two slits and wiring regions arranged outwardly from at least one unit center sequentially. The wiring structure is disposed on the substrate unit and includes wirings distributed in the wiring regions. Each wiring includes circumferential portions and radial portions connected between the circumferential portions. The radial portion connected to a first end of each circumferential portion extends toward the unit center from the first end. Each circumferential portion includes a first section and a second section. The first section is closer to the first end and has greater anti-stretching ability than the second section.

Abstract: According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.

Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

Abstract: A reflector element is provided for a lighting device and includes a light transmission/reflection component that includes a light conductor containing therein light diffusion particles. The light transmission/reflection component includes a light entrance section, a light transmission/reflection section, and a light emission section. The reflector element is coupled to a light-emitting diode (LED) lighting unit, or a heat dissipation element, or a cover. The light entrance section of the reflector element is set in front of the LED lighting unit and the light transmission/reflection section is set at an opposite side to the light entrance section in order to redirect an incident light to the light emission section. Due to the effect provided by the light diffusion particles for refraction, light is uniformly distributed and emitted through the cover.

Abstract: Disclosed is an assembly of light-emitting units, which is applicable to a lighting device that comprises a plurality of light-emitting elements respectively mounted to heat dissipation units. The light-emitting elements give off light beams that project outward through a light-transmitting hood. One surface of the light-transmitting hood is provided with a light diffusion layer featuring light refraction. As such, the light beams emitting from the light-emitting elements are made converging on a light incidence area, which, together with the feature of light spreading of the light-transmitting hood, can spread off and thus homogenize the light beams to form a surface source, and can also concentrate the light energy of the lighting device to enhance the brightness. The lighting device can be applied to any lighting facility.