Patents by Inventor Chao-Jung Chang
Chao-Jung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961514Abstract: An acoustic event detection system may employ one or more recurrent neural networks (RNNs) to extract features from audio data, and use the extracted features to determine the presence of an acoustic event. The system may use self-attention to emphasize features extracted from portions of audio data that may include features more useful for detecting acoustic events. The system may perform self-attention in an iterative manner to reduce the amount of memory used to store hidden states of the RNN while processing successive portions of the audio data. The system may process the portions of the audio data using the RNN to generate a hidden state for each portion. The system may calculate an interim embedding for each hidden state. An interim embedding calculated for the last hidden state may be normalized to determine a final embedding representing features extracted from the input data by the RNN.Type: GrantFiled: December 10, 2021Date of Patent: April 16, 2024Assignee: Amazon Technologies, Inc.Inventors: Chia-Jung Chang, Qingming Tang, Ming Sun, Chao Wang
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Publication number: 20240071408Abstract: A system may include a first acoustic event detection (AED) component configured to detect a predetermined set of acoustic events, and include a second AED component configured to detect custom acoustic events that a user configures a device to detect. The first and second AED components are configured to perform task-specific processing, and may receive as input the same acoustic feature data corresponding to audio data that potentially represents occurrence of one or more events. Based on processing by the first and second AED components, a device may output data indicating that one or more acoustic events occurred, where the acoustic events may be a predetermined acoustic event and/or a custom acoustic event.Type: ApplicationFiled: September 8, 2023Publication date: February 29, 2024Inventors: Qingming Tang, Chieh-Chi Kao, Qin Zhang, Ming Sun, Chao Wang, Sumit Garg, Rong Chen, James Garnet Droppo, Chia-Jung Chang
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Publication number: 20050202763Abstract: A method and system for delivering a mixed slurry for use chemical mechanical polishing operation. A first slurry may be mixed with a second slurry to provide a mixed slurry thereof. A flow rate and a mixing ratio associated with the mixed slurry can be controlled to provide an accurate flow rate control and adjustable mixing ratio thereof. The first slurry and the second slurry may be mixed in-line utilizing an in-line mixing mechanism to provide a mixed slurry thereof. Alternatively, the first and second slurries may be pre-mixed utilizing a pre-mixing mechanism to provide a mixed slurry there.Type: ApplicationFiled: March 9, 2004Publication date: September 15, 2005Inventors: Ping-Hsu Chen, Chao-Jung Chang, Jui-Cheng Lo, Yu-Liang Lin, Shang-Ting Tsai, Ping Chuang
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Patent number: 6926584Abstract: A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controller operably connected to a slurry pump provided in a slurry flow conduit which delivers the polishing slurry to the CMP apparatus. A bubble trap and a flowmeter provided in the slurry flow conduit downstream of the slurry pump are operably connected to the PID controller, and the CMP apparatus is located downstream of the flowmeter.Type: GrantFiled: October 9, 2002Date of Patent: August 9, 2005Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chao-Jung Chang, Ping-Hsu Chen, Chin-Hsin Peng, Jui-Cheng Lo, Chien-Kuo Lu, Chien-Ling Huang
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Patent number: 6884149Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.Type: GrantFiled: April 27, 2004Date of Patent: April 26, 2005Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen, Yu-Liang Lin, Yu-Huei Chen, Ai-Sen Liu, Syun-Ming Jang
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Patent number: 6860723Abstract: A system for controlling and monitoring a rate of flow of a fluid, such as a CMP slurry, comprising a pump for pumping the slurry; a flow meter for monitoring the rate of flow of the slurry; and a controller operably connected to the flow meter and the pump. The controller receives signals from the flow meter indicating the rate of flow of the slurry and controls the operational speed of the pump responsive to the flow meter signals. A degasser equipped with a level sensor may be further provided in the system for removing gas bubbles from the slurry.Type: GrantFiled: October 9, 2002Date of Patent: March 1, 2005Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Ben-Shu Chen, Chao-Jung Chang, Jui-Cheng Lo, Chin-Hsin Peng, Chien-Kuo Lu
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Publication number: 20040203322Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.Type: ApplicationFiled: April 27, 2004Publication date: October 14, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen, Yu-Liang Lin, Yu-Huei Chen, Ai-Sen Liu, Syun-Ming Jang
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Patent number: 6729935Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.Type: GrantFiled: June 13, 2002Date of Patent: May 4, 2004Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen, Yu-Liang Lin, Yu-Huei Chen, Ai-Sen Liu, Syun-Ming Jang
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Publication number: 20040071555Abstract: A system for controlling and monitoring a rate of flow of a fluid, such as a CMP slurry, comprising a pump for pumping the slurry; a flow meter for monitoring the rate of flow of the slurry; and a controller operably connected to the flow meter and the pump. The controller receives signals from the flow meter indicating the rate of flow of the slurry and controls the operational speed of the pump responsive to the flow meter signals. A degasser equipped with a level sensor may be further provided in the system for removing gas bubbles from the slurry.Type: ApplicationFiled: October 9, 2002Publication date: April 15, 2004Applicant: Taiwan Semiconductor manufacturing Co., Ltd.Inventors: Ping-Hsu Chen, Chao-Jung Chang, Henry Lo, Chin-Hsin Peng, Chien-Kuo Lu
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Publication number: 20040072503Abstract: A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controller operably connected to a slurry pump provided in a slurry flow conduit which delivers the polishing slurry to the CMP apparatus. A bubble trap and a flowmeter provided in the slurry flow conduit downstream of the slurry pump are operably connected to the PID controller, and the CMP apparatus is located downstream of the flowmeter.Type: ApplicationFiled: October 9, 2002Publication date: April 15, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chao-Jung Chang, Ping-Hsu Chen, Chin-Hsin Peng, Henry Lo, Chien-Kuo Lu, Chien-Ling Huang
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Publication number: 20030232575Abstract: A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a laser light source, such that the laser light comes into contact with the slurry during the chemical mechanical polishing operation. The laser light can then be detected, after the laser light comes into contact with the slurry to thereby monitor the quality of the slurry utilized during the chemical mechanical polishing operation. The laser light that comes into contact with the slurry can be also be utilized to monitor a mixing ratio associated with the slurry.Type: ApplicationFiled: June 13, 2002Publication date: December 18, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen, Yu-Liang Lin, Yu-Huei Chen, Ai-Sen Liu, Syun-Ming Jang
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Publication number: 20030211743Abstract: A method for preventing deposition of abrasive particles included in a surfactant containing slurry along flow pathways in a chemical mechanical polishing (CMP) slurry delivery system including providing a CMP delivery system having one or more flow pathways for delivering a surfactant containing slurry to at least one polishing station the surfactant containing slurry including abrasive particles; providing at least a fluid contact portion of the one or more flow pathways including at least flow pathway feed lines with a dipole inactive material for contacting the surfactant containing slurry; and, controllably delivering the surfactant containing slurry along the flow pathway feed lines to the at least one polishing station to perform a CMP process.Type: ApplicationFiled: May 7, 2002Publication date: November 13, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chao-Jung Chang, Ping-Hsu Chen, Jui-Cheng Lo, Ping Chuang