Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.

Abstract: A feeding apparatus includes a substrate, an annular grounded metal sheet having a first opening and a second opening, a rectangular grounded metal sheet extending from the annular grounded metal sheet toward an interior according to a configuration of a septum polarizer of a waveguide, a first parasitic grounded metal sheet extending from a side of the rectangular grounded metal sheet along a first direction, a second parasitic grounded metal sheet extending from another side of the rectangular grounded metal sheet along a second direction, a first feeding metal sheet extending from the first opening toward the interior and including a first portion, a second portion and a third portion and a second feeding metal sheet extending from the second opening toward the interior and including a fourth portion, a fifth portion and a sixth portion.

Abstract: A feeding apparatus includes a substrate, an annular grounded metal sheet having a first opening and a second opening, a rectangular grounded metal sheet extending from the annular grounded metal sheet toward an interior according to a configuration of a septum polarizer of a waveguide, a first parasitic grounded metal sheet extending from a side of the rectangular grounded metal sheet along a first direction, a second parasitic grounded metal sheet extending from another side of the rectangular grounded metal sheet along a second direction, a first feeding metal sheet extending from the first opening toward the interior and including a first portion, a second portion and a third portion and a second feeding metal sheet extending from the second opening toward the interior and including a fourth portion, a fifth portion and a sixth portion.

Abstract: A feed horn for a Low Noise Block down converter is disclosed. The feed horn includes a conical body for gathering satellite signals and a connector coupled to the conical body for coupling the feed horn to a waveguide of the Low Noise Block down converter to transmit the satellite signals to the waveguide. The conical body includes a plurality of corrugations, one of the plurality of corrugations includes a plurality of first openings, and a plurality of second openings, each of the plurality of second openings is formed between the two adjacent first openings, wherein the plurality of first openings and the plurality of second openings are used as slits to induce an interference effect to adjust a beam pattern of the feed horn.

Abstract: A feed horn for a Low Noise Block down converter is disclosed. The feed horn includes a conical body for gathering satellite signals and a connector coupled to the conical body for coupling the feed horn to a waveguide of the Low Noise Block down converter to transmit the satellite signals to the waveguide. The conical body includes a plurality of corrugations, one of the plurality of corrugations includes a plurality of first openings, and a plurality of second openings, each of the plurality of second openings is formed between the two adjacent first openings, wherein the plurality of first openings and the plurality of second openings are used as slits to induce an interference effect to adjust a beam pattern of the feed horn.

Abstract: An exemplary condenser microphone includes a printed circuit board, a first via, a second via, and a number of through holes. The first and second vias are formed in the printed circuit board for the signal line and ground line respectively passing therethrough. The through holes are formed surrounding the first and second vias. Inner walls of the through holes are coated with a conductive material.

Abstract: An exemplary condenser microphone includes a printed circuit board, a first via, a second via, and a number of through holes. The first and second vias are formed in the printed circuit board for the signal line and ground line respectively passing therethrough. The through holes are formed surrounding the first and second vias. Inner walls of the through holes are coated with a conductive material.