Patents by Inventor Chao-Kai Hsu

Chao-Kai Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240112665
    Abstract: An active noise control (ANC) circuit is used for generating an anti-noise signal, and has a plurality of filters including at least one first filter and at least one second filter. The at least one first filter generates at least one first filter output, wherein each of the at least one first filter has at least one non-static filter and at least one static filter connected in a series fashion. The at least one second filter generates at least one second filter output, wherein each of the at least one second filter has at least one adaptive filter. The anti-noise signal is jointly controlled by the at least one first filter output and the at least one second filter output. The at least one first filter and the at least one second filter are connected in a parallel fashion.
    Type: Application
    Filed: May 21, 2023
    Publication date: April 4, 2024
    Applicant: Airoha Technology Corp.
    Inventors: Chao-Ling Hsu, Li-Wen Chi, Shih-Kai He
  • Publication number: 20220000807
    Abstract: Methods for treating a wound or promote wound healing are provided, comprising the step of administering a composition including an effective amount of ?-1 adrenergic receptor antagonist to a subject in need thereof. Also provided is apparatus for wound healing, comprising a dressing and a composition including an effective amount of ?-1 adrenergic receptor antagonist.
    Type: Application
    Filed: September 21, 2021
    Publication date: January 6, 2022
    Inventors: Chun-Wei Lu, Jong-Hwei Su Pang, Yu-Shien Ko, Wen-Hung Chung, Chao-Kai Hsu
  • Patent number: 11154518
    Abstract: Methods for treating a wound or promote wound healing are provided, comprising the step of administering a composition including an effective amount of ?-1 adrenergic receptor antagonist to a subject in need thereof. Also provided is apparatus for wound healing, comprising a dressing and a composition including an effective amount of ?-1 adrenergic receptor antagonist.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: October 26, 2021
    Assignees: CHANG GUNG MEMORIAL HOSPITAL, LINKOU, CHANG GUNG UNIVERSITY, NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chun-Wei Lu, Jong-Hwei Su Pang, Yu-Shien Ko, Wen-Hung Chung, Chao-Kai Hsu
  • Publication number: 20200206164
    Abstract: Methods for treating a wound or promote wound healing are provided, comprising the step of administering a composition including an effective amount of ?-1 adrenergic receptor antagonist to a subject in need thereof. Also provided is apparatus for wound healing, comprising a dressing and a composition including an effective amount of ?-1 adrenergic receptor antagonist.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 2, 2020
    Inventors: Chun-Wei LU, Jong-Hwei SU PANG, Yu-Shien KO, Wen-Hung CHUNG, Chao-Kai HSU
  • Patent number: 9345431
    Abstract: A method and an optical system for evaluating the spatial distribution of the concentrations of components in tissue are disclosed. The novel detecting probe included in the optical system comprises plural optical fiber sets, each optical fiber set respectively comprises at least one source optical fiber and at least one detector optical fiber, the source optical fiber connects with the multi-wavelength light source, the source optical fiber delivers light from the multi-wavelength light source onto a tested tissue; and the angle between one optical fiber set and another optical fiber set is greater than 0° and less than and not equal to 180°. Through the optical system of the present invention, the spatial distribution of the concentrations of components such as water, hemoglobin, melanin, lipid, and collagen in the tested tissue can be derived by an equation (I) defined in the present specification.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: May 24, 2016
    Assignee: National Cheng Kung University
    Inventors: Sheng-Hao Tseng, Chao-Kai Hsu, Shih-Yu Tzeng, Nan-Yu Cheng
  • Publication number: 20160011191
    Abstract: A detection kit applied for detecting a body fluid sample of an organism includes a sampling device and a detecting device. The sampling device includes a sampling unit and a filtering unit detachably covering the sampling unit. The sampling unit collects the body fluid sample that is filtered by the filtering unit. The detecting device includes at least one reaction zone including a fiber substrate and a detecting reagent immobilized to the fiber substrate. The reaction zone is disposed as the fiber substrate contacts the body fluid sample collected by the sampling unit. The fiber substrate absorbs the body fluid sample collected by the sampling unit, so that the body fluid sample reacts with the detecting reagent for the detection. A detection method for detecting a body fluid sample is also disclosed. This invention is advantageous for simplified pretreatment, less amount of the reagent and rapid analysis.
    Type: Application
    Filed: December 2, 2014
    Publication date: January 14, 2016
    Inventors: Chung-Yao YANG, Chao-Kai HSU, Chao-Min CHENG
  • Publication number: 20150293117
    Abstract: A detection device applied for detecting body fluids includes a substrate and a plurality of antigens of type XVII collagen. The substrate includes at least one reaction portion. The reaction portion includes a fiber-based material. Antigens of type XVII collagen are disposed on the fiber-based material. The present invention further provides a detection method and a detection strip for detecting body fluids. The present invention is advantageous for easy operation, lower amount of reagents and rapid analysis.
    Type: Application
    Filed: October 16, 2014
    Publication date: October 15, 2015
    Inventors: Chao-Kai HSU, Hsin-Yu HUANG, Hiroshi SHIMIZU, Chao-Min CHENG
  • Patent number: 8915634
    Abstract: A plane light source including a circuit substrate, a plurality of sets of side-view light-emitting devices (LEDs), and a diffusive light-guiding layer is provided. The side-view LEDs are arranged in array over the circuit substrate and are electrically connected with the circuit substrate. The diffusive light-guiding layer covers the side-view LEDs, wherein the diffusive light-guiding layer includes a plurality of diffusive light-guiding units arranged in array and connected to each other. Each of the diffusive light-guiding units is respectively corresponded to illumination coverage of one set of side-view LEDs. Each set of side-view LEDs at least includes two side-view LEDs for emitting light respectively along two different directions and towards into one single diffusive light-guiding units.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: December 23, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Kai Hsu, Yu-Hua Chen, Wei-Chung Lo
  • Publication number: 20140206957
    Abstract: A method and an optical system for evaluating the spatial distribution of the concentrations of components in tissue are disclosed. The novel detecting probe included in the optical system comprises plural optical fiber sets, each optical fiber set respectively comprises at least one source optical fiber and at least one detector optical fiber, the source optical fiber connects with the multi-wavelength light source, the source optical fiber delivers light from the multi-wavelength light source onto a tested tissue; and the angle between one optical fiber set and another optical fiber set is greater than 0° and less than and not equal to 180°. Through the optical system of the present invention, the spatial distribution of the concentrations of components such as water, hemoglobin, melanin, lipid, and collagen in the tested tissue can be derived by an equation (I) defined in the present specification.
    Type: Application
    Filed: July 17, 2013
    Publication date: July 24, 2014
    Inventors: Sheng-Hao TSENG, Chao-Kai HSU, Shih-Yu TZENG, Nan-Yu CHENG
  • Patent number: 8777437
    Abstract: A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: July 15, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
  • Patent number: 8636381
    Abstract: A flexible light source module including a flexible substrate, a flexible light guide film and a plurality of point light sources is provided. The flexible light guide film including light-guiding portions is disposed on the point light sources. Each of the light-guiding portions includes a light incident surface and a light emitting surface. The light incident surface includes light incident sub-surfaces. The light emitting surface includes light emitting sub-surfaces, and the one closest to the geometric center of the light-guiding portion is a first light emitting sub-surface. The absolute values of the tangent slopes of the first light emitting sub-surface are ascending with approaching the geometric center of the light-guiding portion. The light beams emitted from the point light sources exit out of the flexible light source module via the flexible light guide film so that the flexible light source module provides a uniform planar light source.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 28, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chen-Yang Huang, Tsai-Lin Tai, Chao-Kai Hsu
  • Publication number: 20130128610
    Abstract: A plane light source including a circuit substrate, a plurality of sets of side-view light-emitting devices (LEDs), and a diffusive light-guiding layer is provided. The side-view LEDs are arranged in array over the circuit substrate and are electrically connected with the circuit substrate. The diffusive light-guiding layer covers the side-view LEDs, wherein the diffusive light-guiding layer includes a plurality of diffusive light-guiding units arranged in array and connected to each other. Each of the diffusive light-guiding units is respectively corresponded to illumination coverage of one set of side-view LEDs. Each set of side-view LEDs at least includes two side-view LEDs for emitting light respectively along two different directions and towards into one single diffusive light-guiding units.
    Type: Application
    Filed: August 21, 2012
    Publication date: May 23, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Kai Hsu, Yu-Hua Chen, Wei-Chung Lo
  • Publication number: 20120140464
    Abstract: A flexible light source module including a flexible substrate, a flexible light guide film and a plurality of point light sources is provided. The flexible light guide film including light-guiding portions is disposed on the point light sources. Each of the light-guiding portions includes a light incident surface and a light emitting surface. The light incident surface includes light incident sub-surfaces. The light emitting surface includes light emitting sub-surfaces, and the one closest to the geometric center of the light-guiding portion is a first light emitting sub-surface. The absolute values of the tangent slopes of the first light emitting sub-surface are ascending with approaching the geometric center of the light-guiding portion. The light beams emitted from the point light sources exit out of the flexible light source module via the flexible light guide film so that the flexible light source module provides a uniform planar light source.
    Type: Application
    Filed: December 30, 2010
    Publication date: June 7, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen-Yang Huang, Tsai-Lin Tai, Chao-Kai Hsu
  • Patent number: 7871836
    Abstract: The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: January 18, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Cheng Yang, Chao-Kai Hsu, Jing-Yao Chang
  • Patent number: 7763895
    Abstract: A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: July 27, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
  • Publication number: 20100163897
    Abstract: A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.
    Type: Application
    Filed: April 13, 2009
    Publication date: July 1, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
  • Publication number: 20090311810
    Abstract: The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.
    Type: Application
    Filed: August 25, 2009
    Publication date: December 17, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Cheng Yang, Chao-Kai Hsu, Jing-Yao Chang
  • Patent number: 7626208
    Abstract: A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: December 1, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Cheng Yang, Chao-Kai Hsu, Jing-Yao Chang
  • Publication number: 20090152741
    Abstract: A chip structure including a chip, a first dielectric layer and at least one first conductive layer is provided. The chip has an active surface, a backside and at least one bonding pad disposed on the active surface. The first dielectric layer is disposed on the active surface and has at least one first opening, wherein the first opening correspondingly exposes the bonding pad. The first conductive layer covers an inner wall of the first opening and the bonding pad so as to form a concave structure in the first opening. When the chip structure is bonded to a substrate, the solder bump of the substrate is inlaid into the concave structure of the chip. Moreover, a fabrication process of the chip structure, a flip chip package structure and a fabrication process thereof, a package structure of a light emitting/receiving device and a chip stacked structure are also provided.
    Type: Application
    Filed: August 15, 2008
    Publication date: June 18, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tao-Chih Chang, Chao-Kai Hsu
  • Publication number: 20090116244
    Abstract: A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.
    Type: Application
    Filed: March 11, 2008
    Publication date: May 7, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen