Abstract: A safety driving detection and auxiliary system comprises a physiological sensing module, an alcohol detection module, a warning device and a computing device. The physiological sensing module is configured to obtain at least one piece of physiological information of a driver. The alcohol detection module is configured to detect an alcohol concentration of the driver. The warning device is configured to generate a warning signal. The computing device is connected to the physiological sensing module, the alcohol detection module and the warning device, and is configured to determine whether to actuate a vehicle controller according to the alcohol concentration of the driver, obtain a vehicle speed information from the vehicle controller, and actuate the warning device or/and control the vehicle controller at least according to the at least one piece of physiological information and the vehicle speed information.

Abstract: A wireless vehicle control device, disposed on a vehicle, includes a first communication unit, at least one second communication unit and a central management unit. The first communication unit is configured to detect a first communication signal of a portable electronic device. The at least one second communication unit is configured to detect a second communication signal of the portable electronic device, wherein a communication range of the at least one second communication unit is smaller than that of the first communication unit. The central management unit is configured to activate the at least one second communication unit to perform detection when determining that the first communication unit is paired with the portable electronic device according to the first communication signal, and control at least one vehicle lock according to the first communication signal when a distance corresponding to the second communication signal is not greater than a default distance.

Abstract: A light-emitting device comprises a substrate comprising a top surface and a sidewall; a semiconductor stack formed on the top surface of the substrate comprising a first semiconductor layer, an active layer and a second semiconductor layer; a dicing street surrounding the semiconductor stack and exposing the top surface of the substrate; a protective layer covering the semiconductor stack and the dicing street; a reflective layer comprising a Distributed Bragg Reflector structure and covering the protective layer; and a cap layer covering the reflective layer, wherein the reflective layer comprises an uneven portion adjacent to the sidewall of the substrate, and the uneven portion comprises an uneven thickness.

Abstract: An interconnect fabrication method is disclosed herein that utilizes a disposable etch stop hard mask over a gate structure during source/drain contact formation and replaces the disposable etch stop hard mask with a dielectric feature (in some embodiments, dielectric layers having a lower dielectric constant than a dielectric constant of dielectric layers of the disposable etch stop hard mask) before gate contact formation. An exemplary device includes a contact etch stop layer (CESL) having a first sidewall CESL portion and a second sidewall CESL portion separated by a spacing and a dielectric feature disposed over a gate structure, where the dielectric feature and the gate structure fill the spacing between the first sidewall CESL portion and the second sidewall CESL portion. The dielectric feature includes a bulk dielectric over a dielectric liner. The dielectric liner separates the bulk dielectric from the gate structure and the CESL.

Abstract: A method and structure for forming a semiconductor device includes etching back a source/drain contact to define a substrate topography including a trench disposed between adjacent hard mask layers. A contact etch stop layer (CESL) is deposited along sidewall and bottom surfaces of the trench, and over the adjacent hard mask layers, to provide the CESL having a snake-like pattern disposed over the substrate topography. A contact via opening is formed in a dielectric layer disposed over the CESL, where the contact via opening exposes a portion of the CESL within the trench. The portion of the CESL exposed by the contact via opening is etched to form an enlarged contact via opening and expose the etched back source/drain contact. A metal layer is deposited within the enlarged contact via opening to provide a contact via in contact with the exposed etched back source/drain contact.

Abstract: A semiconductor device includes a source/drain component of a transistor. A source/drain contact is disposed over the source/drain component. A source/drain via is disposed over the source/drain contact. The source/drain via contains copper. A first liner at least partially surrounds the source/drain via. A second liner at least partially surrounds the first liner. The first liner and the second liner are disposed between the source/drain contact and the source/drain via. The first liner and the second liner have different material compositions.

Abstract: A semiconductor structure includes a metal gate structure including a gate dielectric layer and a gate electrode, a conductive layer disposed on the gate electrode, and a gate contact disposed on the conductive layer. The conductive layer extends from a position below a top surface of the metal gate structure to a position above the top surface of the metal gate structure. The gate electrode includes at least a first metal, and the conductive layer includes at least the first metal and a second metal different from the first metal. Laterally the conductive layer is fully between opposing sidewalls of the metal gate structure.

Abstract: A battery module includes a housing, a cell set disposed inside the housing and at least one baffle assembly. The cell set and the housing defines at least one flame guiding channel. The baffle assembly is perpendicular to the flame guiding channel, and has at least slit communicating to the flame guiding channel, which generates routes of compression and expansion for cooling an airflow of a be expelled combustible gas.

Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: A method and structure for forming a semiconductor device includes etching back a source/drain contact to define a substrate topography including a trench disposed between adjacent hard mask layers. A contact etch stop layer (CESL) is deposited along sidewall and bottom surfaces of the trench, and over the adjacent hard mask layers, to provide the CESL having a snake-like pattern disposed over the substrate topography. A contact via opening is formed in a dielectric layer disposed over the CESL, where the contact via opening exposes a portion of the CESL within the trench. The portion of the CESL exposed by the contact via opening is etched to form an enlarged contact via opening and expose the etched back source/drain contact. A metal layer is deposited within the enlarged contact via opening to provide a contact via in contact with the exposed etched back source/drain contact.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: A method for signal optimization between a user equipment and a reconfigurable intelligence surface includes a phase optimization step having: generating at least one modified phase combination in the state that a performance index of a current phase combination is smaller than a preset performance threshold value; evaluating whether a corresponding performance index of the modified phase combination is not smaller than the preset performance threshold value or evaluating whether the performance index of the modified phase combination is larger than the corresponding performance index of the current phase combination, to determine an optimized phase combination, enabling a corresponding performance index to be not smaller than the preset performance threshold value or not smaller than the performance index of any modified phase combination in the phase optimization step; and replacing the current phase combination by the optimized phase combination to form an updated current phase combination.

Abstract: A fixed structure of solar panels and C-shaped steel includes a spacer disposed on a top surface of the C-shaped steel with two opposite sides each forming a positioning surface for solar panels abutting against so that solar panels are spaced apart and are positioned by the spacer. A fastening frame is disposed above the C-shaped steel while a pressing member is disposed under the C-shaped steel. The pressing member has a first end abutting against the C-shaped steel and a second end abutting against the solar panels. A bolt with a nut penetrates through the fastening frame and the pressing member. The pressing member, by locking the nut, abuts against the C-shaped steel and the solar panels so that the fastening frame and the C-shaped steel are in cooperation to clamp the solar panels for fastening.

Abstract: A plastic panel includes a middle portion. Two opposing sides of the middle portion are defined as a first engaging portion and a second engaging portion, respectively. Each engaging portion has a concave portion, a convex portion, a protruding portion and a recess portion. Two adjacent plastic panels can be firmly connected through their concave portions, convex portions, protruding portions and recess portions. Besides, two adjacent plastic panels facing up or facing down can be engaged and connected with each other.

Abstract: A waterproof and electricity-insulating support structure for solar panels includes a base frame having a top portion with two side portions disposed at two sides of the top portion. Each of the side portions connects with a bottom portion to be fixed on a steel frame forming a roof. A fastening member is fixed to the top portion of the base frame to form an assembling space for solar panels therebetween. A plurality of rubber strips for waterproofing and insulating from electricity are disposed between the side portions and the solar panels and between the fastening member and the solar panels.

Abstract: A waterproof assembly structure for solar panels arranged in rows and columns with a plurality of longitudinal intervals and lateral intervals therebetween includes a plurality of fastening frames disposed at the longitudinal intervals for fastening the solar panels and a plurality of waterproof frames disposed at the lateral intervals for waterproofing. Each of the waterproof frames includes a cover plate abutting against the solar panels for covering the lateral interval, an extending block provided on the cover plate passing through the lateral interval and a waterproof gasket disposed between the cover plate and the solar panels. A pulling member is connected to the extending block for forcing the cover plate to abut against the solar panels firmly by pulling the extending block.

Abstract: A waterproof and electricity-insulating support structure for solar panels includes a base frame having a top portion with two side portions disposed at two sides of the top portion. Each of the side portions connects with a bottom portion to be fixed on a steel frame forming a roof. A fastening member is fixed to the top portion of the base frame to form an assembling space for solar panels therebetween. A plurality of rubber strips for waterproofing and insulating from electricity are disposed between the side portions and the solar panels and between the fastening member and the solar panels.

Abstract: The method is applied to the recording device, and the recording device is connected to a set-top box. The error proof method includes following steps. In the beginning, whether a startup process of the set-top box has been finished is determined according to a video signal and an audio signal outputted from the set-top box. After the startup process of the set-top box is finished, the video signal outputted from the set-top box is analyzed to determine whether an image of the video signal is covered by an information window. If the image of the video signal is not covered by any information window, then a channel changing signal is transmitted to the set-top box, to change a channel of the set-top box to a reserved recording channel. After that, a television program of the reserved recording channel is recorded.

Abstract: In a manufacturing method of 3D patterned foam sheet, a foaming material is placed in a foaming mold for a foaming process, and the foaming mold has lines in a predetermined pattern formed on upper and lower walls of the foaming mold, such that after the foaming material is formed, the foaming sheet with the lines in a predetermined pattern can be produced, and matching molds engaged with each other can be used for an extrusion, and the pattern formed on the foam sheet is twisted, and a 3D stylish model with a shape matched to the shape of the mold is formed on the foam sheet.