Patents by Inventor Chao-Liang TSENG

Chao-Liang TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency amplifier system and heat dissipation device thereof
    Patent number: 10110172
    Abstract: In a radio frequency (RF) amplifier system and a heat dissipation device thereof, the RF amplifier system includes an RF amplifier and a heat dissipation device. The RF amplifier includes an RF power element. The heat dissipation device includes a heat conduction board, a plurality of heat pipes and fins. The heat conduction board is thermally conductively coupled to the RF power element, and one end of the heat pipe is thermally conductively coupled to the heat conduction board. The fins are arranged in parallel and spaced from each other. The other end of each of the heat pipes is inserted through the fins. The heat of the RF power element is conducted to the heat conduction board and the heat pipe, and then the heat is quickly conducted to the fins to be dissipated away quickly, and the RF power element can quickly reach a stable temperature.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: October 23, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Ke-Cheng Lin, Chi Hsu, Chao-Liang Tseng, Chi-An Chang
  • RADIO FREQUENCY AMPLIFIER SYSTEM AND HEAT DISSIPATION DEVICE THEREOF
    Publication number: 20170250659
    Abstract: In a radio frequency (RF) amplifier system and a heat dissipation device thereof, the RF amplifier system includes an RF amplifier and a heat dissipation device. The RF amplifier includes an RF power element. The heat dissipation device includes a heat conduction board, a plurality of heat pipes and fins. The heat conduction board is thermally conductively coupled to the RF power element, and one end of the heat pipe is thermally conductively coupled to the heat conduction board. The fins are arranged in parallel and spaced from each other. The other end of each of the heat pipes is inserted through the fins. The heat of the RF power element is conducted to the heat conduction board and the heat pipe, and then the heat is quickly conducted to the fins to be dissipated away quickly, and the RF power element can quickly reach a stable temperature.
    Type: Application
    Filed: September 21, 2016
    Publication date: August 31, 2017
    Inventors: Ke-Cheng LIN, Chi HSU, Chao-Liang TSENG, Chi-An CHANG