Abstract: A light-emitting device comprises a substrate; a first light-emitting unit and a second light-emitting unit formed on the substrate, each of the first light-emitting unit and the second light-emitting unit comprises a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first light-emitting unit comprises a first semiconductor mesa and a first surrounding part surrounding the first semiconductor mesa, and the second light-emitting unit comprises a second semiconductor mesa and a second surrounding part surrounding the second semiconductor mesa; a trench formed between the first light-emitting unit and the second light-emitting unit and exposing the substrate; a first insulating layer comprising a first opening on the first surrounding part and a second opening on the second semiconductor layer of the second light-emitting unit; and a connecting electrode comprising a first connecting part on the first

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: The disclosure provides a speech processing method and a device thereof. The method includes: acquiring a speech sampling signal frame in a mixed-excitation linear prediction (MELP) speech coding system and estimating signal quality of the speech sampling signal frame; determining, based on the signal quality, a specific linear prediction coding (LPC) order used by an LPC circuit; controlling the LPC circuit to convert the speech sampling signal frame into a line spectrum pair parameter based on the specific LPC order; replacing a speech signal spectrum of the speech sampling signal frame with the line spectrum pair parameter to generate a predicted speech signal; and performing a speech coding operation and a signal synthesizing operation of the MELP speech coding system based on the predicted speech signal.

Abstract: The disclosure provides a speech processing method and a device thereof. The method includes: acquiring a speech sampling signal frame in a mixed-excitation linear prediction (MELP) speech coding system and estimating signal quality of the speech sampling signal frame; determining, based on the signal quality, a specific linear prediction coding (LPC) order used by an LPC circuit; controlling the LPC circuit to convert the speech sampling signal frame into a line spectrum pair parameter based on the specific LPC order; replacing a speech signal spectrum of the speech sampling signal frame with the line spectrum pair parameter to generate a predicted speech signal; and performing a speech coding operation and a signal synthesizing operation of the MELP speech coding system based on the predicted speech signal.

Abstract: A storage bag air extractor having a monitoring function includes: a housing; a power input unit used for inputting a DC power source; a power switch; a voltage boosting circuit; a current detecting unit used for detecting a current; a controlling unit used for receiving an analog voltage value outputted by the current detecting unit and converted into a digital voltage value, wherein a voltage threshold value is determined after a calculating operation; a motor switch used for performing a switching operation according to a level of the voltage threshold value; a motor used for performing an air extracting operation to a storage bag externally connected; and at least one indicating unit capable of displaying a flash lighting signal or a constant lighting signal with respect to the analog voltage value, after being converted, being smaller or greater than the voltage threshold voltage.