Abstract: A circuitry applied to an electronic device having a Universal Serial Bus (USB) type-C connector is provided. The circuitry includes a transceiver circuit, a physical layer circuit and a processing circuit. In operations of the circuitry, the transceiver circuit is coupled to the USB type-C connector. The physical layer circuit is configured to directly utilize a plurality of first signals from the USB type-C connector as at least one portion of Ethernet signals, and process the first signals to generate a plurality of processed first signals. The processing circuit is configured to process the processed first signals to generate an output signal.

Abstract: A performance management method and an electronic device are provided. The method is applied to the electronic device with a system processor and includes: sensing a temperature of the electronic device and determining whether the temperature is greater than a first temperature setting value; when the temperature is not greater than the first temperature setting value, initiating a frequency increasing procedure; when the temperature is greater than the first temperature setting value, determining whether the temperature is greater than a second temperature setting value, where the second temperature setting value is greater than the first temperature setting value; when the temperature is greater than the first temperature setting value and is not greater than the second temperature setting value, initiating a first frequency reducing procedure; and when the temperature is greater than the second temperature setting value, initiating a second frequency reducing procedure or turning off the system processor.

Abstract: The present invention discloses an AVS scanning method, wherein the AVS scanning method includes the steps of: mounting a system on chip (SoC) on a printed circuit board (PCB), and connecting the SoC to a storage unit; enabling the SoC to read a boot code from the storage unit, and executing the boot code to perform an AVS scanning operation on the SoC to determine a plurality of target supply voltages respectively corresponding to a plurality of operating frequencies of the SoC to establish an AVS look-up table; and storing the AVS look-up table into the SoC or the storage unit.

Abstract: A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.

Abstract: A method for processing a multi-media signal and an associated multi-media device are provided. The method includes: receiving a first audio signal within the multi-media signal from a display device through a first transmission interface of a multi-media device; converting the first audio signal into a second audio signal applicable to a second transmission interface of the multi-media device; and outputting the second audio signal to an audio device through the second transmission interface for playback.

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus includes a control device that can operate with the circuit board, and includes a ball pad array. The ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, which are arranged in the same pad arrangement region. At least a portion of the power ball pads and at least a portion of the ground ball pads are arranged in an alternate manner. The circuit board includes a solder pad array corresponding to the ball pad array of the control device so as to be disposed with the control device.

Abstract: A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.

Abstract: A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.

Abstract: Disclosed are a device conducive to reduction of parasitic inductance and a method for circuit design and assembly; the device and method cause less parasitic inductance and are good for circuit performance. The device includes an integrated circuit of ball grid array packaging (BGA IC), a printed circuit board (PCB), and an electronic component. The BGA IC includes solder balls including at least one target ball. The PCB is electrically connected to the BGA IC via the solder balls. The electronic component is set between the BGA IC and the PCB and electrically connected to the at least one target ball, in which the height of the electronic component is lower than the stand-off height of each of the solder balls.

Abstract: A control device and a circuit board are provided. The control device can operate with the circuit board, and includes a ball pad array. The ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, which are arranged in the same pad arrangement region. At least a portion of the power ball pads and at least a portion of the ground ball pads are arranged in an alternate manner. The circuit board includes a solder pad array corresponding to the ball pad array of the control device so as to be disposed with the control device.

Abstract: A media streaming device is provided that includes a media streaming module, a super capacitor and a protection module. The media streaming module provides the media stream. The super capacitor has a first terminal coupled to a power-supplying path and a second terminal coupled to a ground terminal. The protection module includes a current limiter and a disabling unit. The current limiter receives a power signal and performs current-limiting to generate a fixed-current power to charge the super capacitor and supply power to the media streaming module through the power-supplying path. The current limiter further detects a voltage of the first terminal of the super capacitor. The disabling unit disables the media streaming module when the voltage of the first terminal of the super capacitor is not higher than a voltage threshold value, and enables the media streaming module when the voltage is higher than the voltage threshold value.

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.

Abstract: An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

Abstract: A Universal Serial Bus (USB) converter circuit includes: a High Definition Multimedia Interface (HDMI) transceiver circuit, a signal converting circuit and a USB receptacle, wherein the HDMI transceiver circuit arranged to transmit/receive a HDMI signal, wherein the HDMI transceiver circuit includes at least a video signal and a plurality of processing signals; the signal converting circuit coupled to the HDMI transceiver circuit is arranged to execute a converting operation to processing a conversion between the plurality of processing signals and A USB signal; and the USB receptacle coupled to the signal converting circuit includes a USB signal pin and a set of video signal pin, wherein the USB signal is transmitted/received with an electronic device through the USB pin, and the video signal is transmitted/received with the electronic device through the set of video signal pin.

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.

Abstract: An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

Abstract: A Universal Serial Bus (USB) converter circuit includes: a High Definition Multimedia Interface (HDMI) transceiver circuit, a signal converting circuit and a USB receptacle, wherein the HDMI transceiver circuit arranged to transmit/receive a HDMI signal, wherein the HDMI transceiver circuit includes at least a video signal and a plurality of processing signals; the signal converting circuit coupled to the HDMI transceiver circuit is arranged to execute a converting operation to processing a conversion between the plurality of processing signals and A USB signal; and the USB receptacle coupled to the signal converting circuit includes a USB signal pin and a set of video signal pin, wherein the USB signal is transmitted/received with an electronic device through the USB pin, and the video signal is transmitted/received with the electronic device through the set of video signal pin.

Abstract: A pluggable electronic device is provided, where the pluggable electronic device is used to connect to a display, the pluggable electronic device is used to generate data complied with a first standard or a second standard, and to transmit the data to the display. The pluggable electronic device includes: a control circuit for generating audio/video signals and control signals; a selection signal generating circuit for generating a selection signal according a determining result indicating whether the pluggable electronic device is connected to an external power source or not; a multiplexer, for receiving the audio/video signals and the control signals, and selectively generating the audio/video signals and the control signals complied with the first standard or the second standard according to the selection signal; and a connector for transmitting the audio/video signals and the control signals from the multiplexer to the display.

Abstract: A pluggable electronic device is provided, where the pluggable electronic device is used to connect to a display, the pluggable electronic device is used to generate data complied with a first standard or a second standard, and to transmit the data to the display. The pluggable electronic device includes: a control circuit for generating audio/video signals and control signals; a selection signal generating circuit for generating a selection signal according a determining result indicating whether the pluggable electronic device is connected to an external power source or not; a multiplexer, for receiving the audio/video signals and the control signals, and selectively generating the audio/video signals and the control signals complied with the first standard or the second standard according to the selection signal; and a connector for transmitting the audio/video signals and the control signals from the multiplexer to the display.

Abstract: The present invention discloses a signal receiver and a method thereof. The signal receiver utilizes a switch unit to regulate a loop-through, where the complete function of the loop-through is accomplished even during a sleep mode, which reduces power consumption of the signal receiver.