Abstract: A semiconductor structure is provided. The semiconductor structure includes a functional cell region including an n-type functional transistor and a p-type functional transistor. The semiconductor structure also includes a first power transmission cell region including a first cutting feature and a first contact rail in the first cutting feature. The semiconductor structure also includes a first power rail electrically connected to a source terminal of the p-type functional transistor and the first contact rail of the first power transmission cell region. The semiconductor structure also includes a second power transmission cell region adjacent to the first power transmission cell and including a second cutting feature and second contact rail in the second cutting feature. The semiconductor structure also includes an insulating strip extending from the first cutting feature to the second cutting feature in a first direction.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a substrate having one or more devices formed thereon, one or more bonding pads disposed over the substrate, and a first passivation layer disposed over the one or more bonding pads. The first passivation layer includes a first passivation sublayer having a first dielectric material, a second passivation sublayer disposed over the first passivation sublayer, and the second passivation sublayer has a second dielectric material different from the first dielectric material. The first passivation layer further includes a third passivation sublayer disposed over the second passivation sublayer, and the third passivation sublayer has a third dielectric material different from the second dielectric material. At least two of the first, second, and third passivation sublayers each includes a nitride.

Abstract: The present application relates to a polypropylene with high melt flow index and a method for producing the same, and meltblown fiber fabrics. A reacting mixture is firstly provided, and a polymerization process is performed to the reacting mixture in a slurry reaction system to obtain the polypropylene. The reacting mixture includes propylene monomers, Ziegler-Natta catalysts, organoaluminum compounds and electron donor. The polypropylene has high melt flow index and adjustable melting point and molecular weight distribution, such that it is used to produce the meltblown fiber fabrics.

Abstract: A communication method and communication system using two-dimensional primary synchronization signals are provided. The communication system includes a base station and a user equipment. The communication method includes: providing a two-dimensional synchronization array collection having a zero correlation zone; generating plural primary synchronization signals (PSSs) in accordance with the two-dimensional synchronization array collection; generating a synchronization signal block (SSB) in accordance with the primary synchronization signals, in which the synchronization signal block is adapted for new radio (NR) technology, and each one of the primary synchronization signals corresponds to plural orthogonal frequency division multiplexing (OFDM) symbols and plural subcarrier signals; and performing a communication operation by using the synchronization signal block.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: Disclosed herein is a phage-displayed single-chain variable fragment (scFv) library, which comprises a plurality of phage-displayed scFvs characterized with a specific sequence in each CDR. The present phage-displayed scFv library is useful in selecting an antibody fragment exhibiting a binding affinity and specificity to mesothelin (MSLN). Also disclosed herein are a recombinant antibody specific to MSLN, an immunoconjugate comprising the recombinant antibody, and uses thereof in treating cancers.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a substrate having one or more devices formed thereon, one or more bonding pads disposed over the substrate, and a first passivation layer disposed over the one or more bonding pads. The first passivation layer includes a first passivation sublayer having a first dielectric material, a second passivation sublayer disposed over the first passivation sublayer, and the second passivation sublayer has a second dielectric material different from the first dielectric material. The first passivation layer further includes a third passivation sublayer disposed over the second passivation sublayer, and the third passivation sublayer has a third dielectric material different from the second dielectric material. At least two of the first, second, and third passivation sublayers each includes a nitride.

Abstract: A rekeyable lock includes a lock casing formed with a lock cylinder hole, a pin replacing hole and a plurality of first pin holes; a lock cylinder rotatably arranged in the lock cylinder hole and formed with a plurality of second pin holes; a pin set including a plurality of first pins respectively accommodated in the first pin holes, and a plurality of second pins respectively accommodated in the second pin holes; and a pin cover arranged in the pin replacing hole and including a cover body formed with a groove, and a sliding block arranged in the groove and slidable relative to the cover body. When the sliding block is located at a predetermined position, the sliding block and the cover body are configured to respectively abut against an inner wall of the lock casing to fix the pin cover in the pin replacing hole.

Abstract: A method for signal optimization between a user equipment and a reconfigurable intelligence surface includes a phase optimization step having: generating at least one modified phase combination in the state that a performance index of a current phase combination is smaller than a preset performance threshold value; evaluating whether a corresponding performance index of the modified phase combination is not smaller than the preset performance threshold value or evaluating whether the performance index of the modified phase combination is larger than the corresponding performance index of the current phase combination, to determine an optimized phase combination, enabling a corresponding performance index to be not smaller than the preset performance threshold value or not smaller than the performance index of any modified phase combination in the phase optimization step; and replacing the current phase combination by the optimized phase combination to form an updated current phase combination.

Abstract: A lockset includes a lock cylinder, a lock casing, a first lock member, a second lock member and an anti-theft member. The lock cylinder includes a key hole and a first lock slot. The lock casing includes a second lock slot. The first lock member is accommodated in the first lock slot. The second lock member is accommodated in the second lock slot. The anti-theft member is sandwiched in between the first lock member and the second lock member. When two ends of the anti-theft member are respectively located in the first lock slot and the second lock slot, the lock cylinder and the lock casing are locked. When a contact surface between the anti-theft member and the first lock member or the second lock member is aligned with a rotation interface between the lock cylinder and the lock casing, the lock cylinder and the lock casing are unlocked.

Abstract: A lock core device based on matching the cross-sectional shape of a multiple key and a corresponding lock key, the lock contains a keyway, and the outer contour of the keyway is configured as a first section contour and a second section contour after superimposition, and its' a union outer contour. By adapting to existing keys with various cross-sectional profiles, the lock cylinder does not need to be manufactured separately according to the cross-sectional profile of the key, thus effectively reducing its manufacturing and inventory costs; A method for configuring a lock ball slot so that, in response to the deviation of the position of the teeth of the keys with different cross-sectional profiles, the teeth of the keys with different cross-sectional profiles can correspond to the lock ball slot for unlocking, thus ensuring stability and effectiveness during unlocking.

Abstract: Semiconductor devices are provided. The semiconductor device includes a substrate, an interconnect structure, and a conductive pad structure. The interconnect structure is over the substrate and includes a top metal layer. The conductive pad structure is over the interconnect structure and includes a lower barrier film, an upper barrier film, and an aluminum-containing layer. The lower barrier film is on the top metal layer. The upper barrier film is on the lower barrier film and has an amorphous structure. The aluminum-containing layer is on the upper barrier film. The lower barrier film and the upper barrier film are made of a same material, and a nitrogen atomic percentage of the upper barrier film is higher than a nitrogen atomic percentage of the lower barrier film.

Abstract: A micro light-emitting diode display device includes a circuit substrate, a first light-emitting element, a second light-emitting element, a third light-emitting element, and a conductive layer. The first light-emitting element, the second light-emitting element, and the third light-emitting element are disposed on the circuit substrate and have a first electrode and a second electrode, respectively. The first electrode of the first light-emitting element, the first electrode of the second light-emitting element, and the first electrode of the third light-emitting element are electrically connected to the circuit substrate. The second electrode of the first light-emitting element and the second electrode of the second light-emitting element are a continuous semiconductor material layer. The second electrode of the third light-emitting element is separated from the second electrode of the first light-emitting element and the second electrode of the second light-emitting element.

Abstract: A mold for manufacturing an artificial shuttlecock from a semi-finished shuttlecock includes a male mold and a female mold. The male mold includes a cone frustum and a plurality of first annular grooves. The semi-finished shuttlecock is placed on an outside of the cone frustum. The first annular grooves are disposed apart on the outside of the cone frustum. The female mold includes a tapered slot, a plurality of second annular grooves and an injection channel. The second annular grooves are disposed apart on an inner surface of the tapered slot. When the semi-finished shuttlecock and the male mold are placed into the female mold, each of the first annular grooves corresponds to each of the second annular grooves to form a plurality of molded grooves. The injection channel communicates with the second annular grooves, and the molded grooves communicate with the injection channel through the second annular grooves.

Abstract: A mold for manufacturing an artificial shuttlecock from a semi-finished shuttlecock includes a male mold and a female mold. The male mold includes a cone frustum and a plurality of first annular grooves. The semi-finished shuttlecock is placed on an outside of the cone frustum. The first annular grooves are disposed apart on the outside of the cone frustum. The female mold includes a tapered slot, a plurality of second annular grooves and an injection channel. The second annular grooves are disposed apart on an inner surface of the tapered slot. When the semi-finished shuttlecock and the male mold are placed into the female mold, each of the first annular grooves corresponds to each of the second annular grooves to form a plurality of molded grooves. The injection channel communicates with the second annular grooves, and the molded grooves communicate with the injection channel through the second annular grooves.

Abstract: The screw remover includes a head portion and a tail portion. The tail portion is coaxial to the head portion and is a frustum. A terminal face is formed at an end of the tail portion remote from the head portion. A diameter of the tail portion is reducing from toward the terminal face. At least one thread is formed on a peripheral face of the tail portion and spirally extends around an axis of the tail portion. At least one groove is formed on the peripheral face of the tail portion and traverses the at least one thread. An end of the at least one groove extends to the terminal face. Thereby, the screw can be rotated to remove by a driving tool when the tail portion is inserted into the screw and the head portion is connected to the driving tool.

Abstract: An aluminum-cobalt-chromium-iron-nickel-silicon alloy has atomic percentages of 4-12 at % aluminum, 15-25 at % cobalt, 25-35 at % chromium, 4-8 at % iron, 15-25 at % nickel, 10-25 at % silicon, wherein the atomic percentage of aluminum plus silicon is between 18-32 at %. The disclosure applies the alloy design to develop a low-aluminum Al—Co—Cr—Fe—Ni—Si alloy composition, and has high-temperature hardness, high wear resistance, corrosion resistance and high temperature oxidation resistance.

Abstract: An aluminum-cobalt-chromium-iron-nickel-silicon alloy has atomic percentages of 4-12 at % aluminum, 15-25 at % cobalt, 25-35 at % chromium, 4-8 at % iron, 15-25 at % nickel, 10-25 at % silicon, wherein the atomic percentage of aluminum plus silicon is between 18-32 at %. The disclosure applies the alloy design to develop a low-aluminum Al—Co—Cr—Fe—Ni—Si alloy composition, and has high-temperature hardness, high wear resistance, corrosion resistance and high temperature oxidation resistance.

Abstract: A tool holder contains: a connector and a fixer. The connector includes at least one body, and each of the at least one body has a first side plate, a second side plate, and a connection plate. The first side plate has a first fitting portion, and the second side plate has a second fitting portion. The first fitting portion and the second fitting portion define a square fitting zone, and the first side plate further has a first locking projection. Between the first fitting portion and the second fitting portion is defined a cavity so that the first fitting portion and the second fitting portion deform inwardly, and so that the first locking projection retract into the fitting zone. The fixer is housed in the cavity of the connector to limit an inward deformation of the first fitting portion and the second fitting portion.

Abstract: A 3D printing device having a main body, a forming platform, an infrared thermometer, a heater, a thermocouple and a calibrator is provided. A forming chamber is defined in the main body. The forming platform is accommodated in the forming chamber, and a top surface thereof forms a bottom of the forming chamber. A reference surface is defined in the forming chamber, and the reference surface has an infrared radiance approximate to the powder. The infrared thermometer in the main body is disposed above and toward the reference surface. The heater is disposed in the main body to conductively heat the reference surface. The thermocouple is arranged adjacent to the reference surface. The calibrator is electrically connected to the infrared thermometer and the thermocouple to compare respective measured temperatures of the reference surface, and thereby determine if the infrared thermometer should be cleared.