Abstract: An electrophoretic display system and a developing method are provided. The electrophoretic display system includes an electronic device storing a control ware, a first electrophoretic display device coupled to the electronic device and a first application program interface (API) provided by the control ware. A first application program loads a first image data into the control ware, and calls the first application program interface. The control ware obtains a first driver of a first communication protocol of the first electrophoretic display device according to the first API. The control ware encapsulates the first image data with a first data encapsulating format according to the first driver. The control ware transmits the encapsulated first image data to the first electrophoretic display device according to the first communication protocol.

Abstract: A driving method of a display panel is provided. The display panel includes first signal lines, second signal lines, pixel structures, first signal line driving circuits, and second signal line driving circuits. The first signal line driving circuits divide the first signal lines into first signal line groups and sequentially enable the first signal lines of the first signal line groups. In one of the first signal line groups, when one first signal line adjacent to another first signal line group is enabled, the second signal line driving circuits provide a first data signal to each of the second signal lines; and when the rest of the first signal lines are enabled, the second signal line driving circuits provide a second data signal to each of the second signal lines. The first data signal and the second data signal have different waveforms to display a predetermined gray scale.

Abstract: An electrophoretic display system and a developing method are provided. The electrophoretic display system includes an electronic device storing a control ware, a first electrophoretic display device coupled to the electronic device and a first application program interface (API) provided by the control ware. A first application program loads a first image data into the control ware, and calls the first application program interface. The control ware obtains a first driver of a first communication protocol of the first electrophoretic display device according to the first API. The control ware encapsulates the first image data with a first data encapsulating format according to the first driver. The control ware transmits the encapsulated first image data to the first electrophoretic display device according to the first communication protocol.

Abstract: A polylactic acid resin composition includes about 100 parts by weight of a polylactic acid resin, about 0.001 to about 3 parts by weight of a nucleating agent and about 3 to about 70 parts by weight of a filler. The polylactic acid resin composition can be processed into a biodegradable molded article or other product having a high impact strength and a high heat deflection temperature.

Abstract: A driving method of a display panel is provided. The display panel includes first signal lines, second signal lines, pixel structures, first signal line driving circuits, and second signal line driving circuits. The first signal line driving circuits divide the first signal lines into first signal line groups and sequentially enable the first signal lines of the first signal line groups. In one of the first signal line groups, when one first signal line adjacent to another first signal line group is enabled, the second signal line driving circuits provide a first data signal to each of the second signal lines; and when the rest of the first signal lines are enabled, the second signal line driving circuits provide a second data signal to each of the second signal lines. The first data signal and the second data signal have different waveforms to display a predetermined gray scale.

Abstract: An electrophoresis display includes a temperature sensor, a memory, a central processing unit and a display unit. The temperature sensor senses and outputs a present temperature. The memory stores a temperature characteristic table. The central processing unit is electrically coupled to the temperature sensor and the memory. The central processing unit receives the present temperature and reads the temperature characteristic table for matching the present temperature with the temperature characteristic table to obtain and output a drive level or timing. The display unit is electrically coupled to the central processing unit for receiving the drive level or timing and displaying according to the drive level.

Abstract: A leadless lead-frame mainly includes a chip paddle and a plurality of leads. The chip paddle has chip disposal areas, and a grounding area surrounding the chip disposal area. The grounding area has a recession with a recession-bottom and a recession-wall connecting to the recession-bottom. An angle is formed between the recession-wall and the recession-bottom, and the angle is less than 90 degrees. The leads surround the chip paddle. The chip paddle has a cavity and the cavity has a cavity-bottom serving as the chip disposal area, and the depth of the cavity is equal to half of the thickness of the chip paddle.

Abstract: A chip package structure includes a substrate having a cavity, wherein the substrate includes a plurality of first contacts and second contacts disposed on a surface thereof, and the first contacts are located within the cavity and the second contacts are located outside the cavity. The substrate further includes a through hole located at the bottom of the cavity. A first chip is disposed in the cavity, wherein the first chip is electrically connected to the first contacts. A second chip is disposed above the cavity, wherein the second chip is electrically connected to the second contacts. A third chip is disposed in the through hole, wherein the third chip is attached to the first chip. An encapsulant is filled in the cavity to encapsulate the first chip and the second chip.

Abstract: A leadless lead-frame mainly includes a chip paddle and a plurality of leads. The chip paddle has chip disposal areas, and a grounding area surrounding the chip disposal area. The grounding area has a recession with a recession-bottom and a recession-wall connecting to the recession-bottom. An angle is formed between the recession-wall and the recession-bottom, and the angle is less than 90 degrees. The leads surround the chip paddle. The chip paddle has a cavity and the cavity has a cavity-bottom serving as the chip disposal area, and the depth of the cavity is equal to half of the thickness of the chip paddle.

Abstract: A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The lead frame includes a chip paddle and a plurality of leads surrounding the chip paddle wherein the chip paddle has a cavity serving as a chip disposal area and a grounding area surrounding the cavity, and at least there is one recession formed on the grounding area. Besides, the chip is disposed in the cavity so that the back surface of the chip faces the chip paddle and attached onto the chip paddle via the silver paste. Moreover, the chip is electrically connected to the leads. As mentioned above, the grounding area has at least one recession formed therein, so the contact area of the leadless lead-frame with the encapsulation will be increased to enhance the attachment of the encapsulation to the leadless lead-frame.

Abstract: A method for manufacturing a plurality of leadless semiconductor packages is disclosed. A provided metal carrier has a plurality of packaging units with contact pads and a plurality of separating streets between the packaging units. A plurality of chips are disposed on the corresponding packaging units of the metal carrier and are electrically connected to the contact pads. A plurality of encapsulants are formed on the corresponding packaging units to encapsulate the chips but exposing the separating streets. After the metal carrier is etched away, the encapsulants connected by mold runner bars can be easily separated without sawing or punching.

Abstract: A chip package structure including a substrate, a first chip, a second chip, a third chip and an encapsulant is provided. The substrate has a cavity, a plurality of first contacts and second contacts disposed on a surface thereof, wherein the first contacts are located within the cavity and the second contacts are located outside the cavity, the substrate further includes a through hole located at the bottom of the cavity. The first chip is disposed in the cavity and is electrically connected to the first contacts. The second chip is disposed above the cavity and is electrically connected to the second contacts. The third chip is disposed in the through hole and is attached to the first chip. The encapsulant is filled in the cavity to encapsulate the first chip and the second chip. Moreover, the second chip, the third chip or the through hole is optional.

Abstract: A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The lead frame includes a chip paddle and a plurality of leads surrounding the chip paddle wherein the chip paddle has a cavity serving as a chip disposal area and a grounding area surrounding the cavity, and at least there is one recession formed on the grounding area. Besides, the chip is disposed in the cavity so that the back surface of the chip faces the chip paddle and attached onto the chip paddle via the silver paste. Moreover, the chip is electrically connected to the leads. As mentioned above, the grounding area has at least one recession formed therein, so the contact area of the leadless lead-frame with the encapsulation will be increased to enhance the attachment of the encapsulation to the leadless lead-frame.

Abstract: A method for manufacturing a lightweight foamed ceramic body from components comprising: (a) at least one expandable volcanic mineral; (b) at least one alkaline earth metal oxide, hydroxide, or carbonate, (c) at least one inorganic binder and (d) a foaming stabilizer, the method comprising: (1) sintering and expanding a mixture of components (a) to (d); (2) mixing the sintered and expanded material with water; (3) grinding the mixture of sintered and expanded material with water to form a ground mixture; (4) drying said ground mixture to form a dried mixture; (5) crushing said dried mixture to form a fine powder; (6) shaping said powder into a desired form to form a powder form; and (7) sintering said powder form. The ceramic material is preferably manufactured in a tunnel-type kiln. The resulting foamed ceramic is not only light in weight, but excellent in insulating properties due to its discrete cell of closed cellular structure. The foamed ceramic is useful in structural and building materials.