Patents by Inventor Chao-Nien Huang

Chao-Nien Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10468010
    Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: November 5, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Liang-Yu Wu
  • Patent number: 10453436
    Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: October 22, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
  • Patent number: 10437297
    Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 8, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen
  • Publication number: 20190301489
    Abstract: A cooling fan assembly is provided which includes a fan housing and an axial fan. The fan housing has a shroud panel with cutout portions along the airflow path of the axial fan. Fixed members separate the cutout portions. Flap members are attached to the fixed members so that the flap members can pivot between an open position and a closed position. The flap members are pushed by airflow from the axial fan into an open position when the fan is operational. When the fan is non-operational or when air begins to enter the fan in the reverse direction of the axial fan's airflow path, the flap members are configured to move to a closed position. In the closed position, air cannot flow through the reverse direction of the axial fan's airflow path.
    Type: Application
    Filed: April 3, 2018
    Publication date: October 3, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Ching-Yu CHEN, Kuan-Hsiang LIAO
  • Publication number: 20190296486
    Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.
    Type: Application
    Filed: August 8, 2018
    Publication date: September 26, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Kuen-Hsien WU, Kuo-Wei LEE
  • Publication number: 20190286199
    Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 19, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Ching-Yu CHEN
  • Patent number: 10412851
    Abstract: A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: September 10, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Chih-Wei Lin
  • Publication number: 20190239386
    Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.
    Type: Application
    Filed: May 21, 2018
    Publication date: August 1, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Ching-Yu CHEN, Tsung-Ta LI
  • Publication number: 20190234647
    Abstract: A fan assembly is disclosed to prevent reverse air flow when the fan stops working. The assembly has a fan module including an intake end, a motor casing and a motor propelling a fan. A louver module has a plurality of slats having an open position to allow air flow and a closed position to block air flow. The louver module is coupled to the motor casing to provide a seal between the louver module and the motor casing.
    Type: Application
    Filed: May 7, 2018
    Publication date: August 1, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Kuen-Hsien WU
  • Patent number: 10368464
    Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: July 30, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Publication number: 20190219058
    Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan assembly that includes an inlet side and an outlet side. The fan assembly also includes an inlet fan guard connector located at the inlet side of the fan assembly and an outlet fan guard connector located at the outlet side of the fan assembly. The fan assembly also includes a lever housings located between the inlet fan guard connector and the outlet fan guard connector and a slots oriented between the lever housings and the inlet fan guard connector and the outlet fan guard connector, the plurality of slots configured to secure an additional modular component.
    Type: Application
    Filed: May 31, 2018
    Publication date: July 18, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN
  • Publication number: 20190223317
    Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.
    Type: Application
    Filed: March 29, 2018
    Publication date: July 18, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Yung-Hsiang LU
  • Publication number: 20190159361
    Abstract: An apparatus is provided that includes a first distal end and a second distal end. The apparatus also includes a first connecting member located at the first distal end and a second connecting member located at the second distal end. The apparatus also includes at least one bracket secured within the apparatus at the first and second connecting members. The bracket includes a flow guiding depressions and micro pores. The apparatus also includes a plate configured to abut the bracket within the apparatus. The first and second connecting members are configured to connect the apparatus within a server device.
    Type: Application
    Filed: April 10, 2018
    Publication date: May 23, 2019
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Chih-Wei LIN
  • Patent number: 10295767
    Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 21, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Publication number: 20150123151
    Abstract: A light-emitting structure includes a transparent substrate; a first transparent conductive layer formed on the transparent substrate and having a first top surface and a second top surface substantially coplanar with the first top surface; a first light-emitting stack formed on the first top surface; and a first electrode directly formed on the second top surface.
    Type: Application
    Filed: January 12, 2015
    Publication date: May 7, 2015
    Inventors: Min-Hsun HSIEH, Kuen-Ru CHUANG, Shu-Wen SUNG, Chia-Cheng LIU, Chao-Nien HUANG, Shane-Shyan WEY, Chih-Chiang LU, Ming-Jiunn JOU
  • Patent number: 8932885
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: January 13, 2015
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Kuen-Ru Chuang, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou
  • Patent number: 8344353
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: January 1, 2013
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Kuen-Ru Chuang, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou
  • Publication number: 20110220873
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Application
    Filed: May 24, 2011
    Publication date: September 15, 2011
    Applicant: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Keun-Ru Chuang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang
  • Patent number: 7061110
    Abstract: An ohmic contact of semiconductor and its manufacturing method are disclosed. The present invention provides a low resistivity ohmic contact so as to improve the performance and reliability of the semiconductor device. This ohmic contact is formed by first coating a transition metal and a noble metal on a semiconductor material; then heat-treating the transition metal and the noble metal in an oxidizing environment to oxidize the transition metal. In other words, this ohmic contact primarily includes a transition metal oxide and a noble metal. The oxide in the film can be a single oxide, or a mixture of various oxides, or a solid solution of various oxides. The metal of the film can be a single metal, or various metals or an alloy thereof. The structure of the film can be a mixture or a laminate or multilayered including oxide and metal. The layer structure includes at least one oxide layer and one metal layer, in which at least one oxide layer is contacting to semiconductor.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: June 13, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Jin-Kuo Ho, Charng-Shyang Jong, Chao-Nien Huang, Chin-Yuan Chen, Chienchia Chiu, Chenn-shiung Cheng, Kwang Kuo Shih
  • Patent number: RE42422
    Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: June 7, 2011
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Kuen-Ru Chuang, Shu-Wen Sung, Chia-Cheng Liu, Chao-Nien Huang, Shane-Shyan Wey, Chih-Chiang Lu, Ming-Jiunn Jou