Patents by Inventor Chao Ping Hsieh
Chao Ping Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128635Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.Type: ApplicationFiled: December 24, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
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Patent number: 11951233Abstract: Provided are methods of producing an acellular organ. The method includes the steps of, subjecting an organ derived from an animal to a static supercritical fluid (SCF) treatment followed by a dynamic SCF treatment. Optionally, the method of the present disclosure further includes a hypertonic and a hypotonic treatments prior to the static SCF treatment, and/or a neutralizing treatment after the dynamic SCF treatment. Also disclosed herein are acellular organs produced by the present method.Type: GrantFiled: September 11, 2019Date of Patent: April 9, 2024Assignee: ACRO BIOMEDICAL COMPANY. LTD.Inventors: Dar-Jen Hsieh, Chao-Yi Wei, Chao-Chin Chao, Jer-Cheng Kuo, Yi-Ping Lai, Srinivasan Periasamy
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Patent number: 11936238Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.Type: GrantFiled: June 15, 2022Date of Patent: March 19, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Hsin-Chih Chen, Hung-Chieh Lin, Chao-Lung Kuo, Yi-Ping Hsieh, Chien-Shien Lee
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Patent number: 9703058Abstract: The present invention provides a package framework for a photoelectric conversion module, in which a photoelectric device is mounted on a printed circuit board such as a rigid-flex PCB and a HDI (High Density Interconnect) PCB, and then is connected, via a flexible printed circuit board, to a traditional printed circuit board having a driver chip or a digital signal processing integrated circuit disposed thereon. The present invention can prevent signal transmission interference caused by using bond wire, and can also maintain the stability of mechanical structure.Type: GrantFiled: January 20, 2016Date of Patent: July 11, 2017Assignee: NATIONAL APPLIED RESEARCH LABORATORIESInventors: Chao-Ping Hsieh, Yin-Cheng Chang, Ta-Yeh Lin, Da-Chiang Chang
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Publication number: 20170131494Abstract: The present invention provides a package framework for a photoelectric conversion module, in which a photoelectric device is mounted on a printed circuit board such as a rigid-flex PCB and a HDI (High Density Interconnect) PCB, and then is connected, via a flexible printed circuit board, to a traditional printed circuit board having a driver chip or a digital signal processing integrated circuit disposed thereon. The present invention can prevent signal transmission interference caused by using bond wire, and can also maintain the stability of mechanical structure.Type: ApplicationFiled: January 20, 2016Publication date: May 11, 2017Inventors: Chao-Ping HSIEH, Yin-Cheng CHANG, Ta-Yeh LIN, Da-Chiang CHANG
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Patent number: 9519010Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.Type: GrantFiled: October 3, 2014Date of Patent: December 13, 2016Assignee: MPI CORPORATIONInventors: Chun-Chi Wang, Chia-Tai Chang, Ya-Yun Cheng, Wei-Cheng Ku, Chao-Ping Hsieh
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Publication number: 20150022227Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.Type: ApplicationFiled: October 3, 2014Publication date: January 22, 2015Inventors: Chun-Chi WANG, Chia-Tai CHANG, Ya-Yun CHENG, Wei-Cheng KU, Chao-Ping HSIEH
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Patent number: 8884640Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.Type: GrantFiled: April 18, 2012Date of Patent: November 11, 2014Assignee: MPI CorporationInventors: Chun-Chi Wang, Chia-Tai Chang, Ya-Yun Cheng, Wei-Cheng Ku, Chao-Ping Hsieh
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Patent number: 8816713Abstract: A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.Type: GrantFiled: July 20, 2012Date of Patent: August 26, 2014Assignee: MPI CorporationInventors: Wei-Cheng Ku, Chih-Hao Ho, Chen-Kuo Kao, Chao-Ping Hsieh
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Patent number: 8542027Abstract: A probe card is provided. The probe card can serialize, analogize and divide a digital signal by a analog-to-digital converter (ADC), a digital-to-analog converter (DAC), and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss.Type: GrantFiled: March 17, 2010Date of Patent: September 24, 2013Assignee: MPI CorporationInventors: Young-Huang Chou, Wei-Cheng Ku, Wen-Pin Su, Jun-Liang Lai, Chao-Ping Hsieh, Ping-Hsiao Liao
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Publication number: 20130021053Abstract: A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.Type: ApplicationFiled: July 20, 2012Publication date: January 24, 2013Inventors: Wei-Cheng KU, Chih-Hao Ho, Chen-Kuo Kao, Chao-Ping Hsieh
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Publication number: 20120274347Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.Type: ApplicationFiled: April 18, 2012Publication date: November 1, 2012Inventors: Chun-Chi Wang, Chia-Tai Chang, Ya-Yun Cheng, Wei-Cheng Ku, Chao-Ping Hsieh
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Publication number: 20120242360Abstract: Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe.Type: ApplicationFiled: March 20, 2012Publication date: September 27, 2012Inventors: Keng-Yi Huang, Chao-Ping Hsieh, Wei-Cheng Ku, Chih-Hao Ho
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Publication number: 20100237886Abstract: A probe card is provided. The probe card can serialize, analogise and divide a digital signal by a parallel-to-serial converter, a parallel-to-serial converter, and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss.Type: ApplicationFiled: March 17, 2010Publication date: September 23, 2010Applicant: MPI CORPORATIONInventors: Young Huang Chou, Wei Cheng Ku, Wen Pin Su, Jun Liang Lai, Chao Ping Hsieh, Ping Hsiao Liao