Abstract: Disclosed are a display substrate and preparation method thereof, and a display device. The display substrate includes a display area (100) and a bonding area (200). On a plane perpendicular to the display substrate, the bonding area (200) includes a base substrate (10), a bonding structure layer (70) disposed on the base substrate (10), and a bonding pad (80) disposed on the bonding structure layer (70). The bonding pad (80) is configured to be bonded to connect to a circuit board; and at least includes a first bonding pad layer (210) and a second bonding pad layer (220), the first bonding pad layer (210) is disposed on a side of the second bonding pad layer (220) away from the base substrate (10), at least one first concave-convex structure (310) is disposed on a surface of a side of the first bonding pad layer (210) away from the base substrate (10).

Abstract: A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots.

Abstract: A display panel and a driving baseplate, relate to the technical field of displaying. The display panel includes an active area and a peripheral area located on at least one side of the active area, and the display panel includes: a driving baseplate, including a substrate and a conducting ring embedded on a surface of one side of the substrate, wherein the conducting ring is located in the peripheral area; a light emitting device, located in the active area and disposed on a side of the driving baseplate close to the conducting ring; an isolation dam, located in the peripheral area and disposed on a side of the conducting ring away from the substrate, wherein the isolation dam overlaps with the conducting ring; and an encapsulation layer, disposed on sides of the light emitting device and the isolation dam away from the substrate.

Abstract: A display panel, a displaying device and a wearable device. The display panel includes a displaying region and a peripheral region surrounding the displaying region, a region of the peripheral region other than the bonding sub-region includes a first testing-unit group and a second testing-unit group, and each of the first testing-unit group and the second testing-unit group includes one or more circuit testing units; the displaying region includes a first lateral side and a second lateral side that extend in a first direction and face each other, the first direction refers to a direction from the bonding sub-region pointing to the displaying region; and a maximum distance from the first testing-unit group to the first lateral side in a direction perpendicular to the first direction is equal to a maximum distance from the second testing-unit group to the second lateral side in the direction perpendicular to the first direction.

Abstract: A display panel and a display apparatus. The display panel includes a backplane (10) and light-emitting devices (20). The backplane (10) includes: a base substrate (101); pixel driving circuits (102); a first insulating layer (103); conductive portions (104), wherein each of the conductive portions (104) is connected to a corresponding pixel driving circuit (102) via a first connector (CM1) penetrating through the first insulating layer (103); and a second insulating layer (105) located on the side of the first insulating layer (103) and the conductive portions (104) away from the base substrate (101). The light-emitting devices (20) are located on the side of the second insulating layer (105) away from the base substrate (101), wherein an anode (201) of at least one of the light-emitting devices (20) is connected to a corresponding conductive portion (104) via second connectors (CM2) penetrating through the second insulating layer (105).

Abstract: This disclosure relates to an organic electroluminescent structure and a fabrication method thereof, and a display device. The organic electroluminescent structure includes a base substrate; an anode layer formed on the base substrate, in which the anode layer comprises a plurality of anodes arranged at intervals; an organic light-emitting functional layer having a hole injection layer, in which the hole injection layer includes a plurality of hole injection blocks arranged at intervals, and each of the hole injection blocks is correspondingly formed on the second surface of one of the anodes; and a cathode layer formed at a side of the organic light-emitting functional layer facing away from the anode layer.

Abstract: A display substrate includes a display area and a bonding area located on one side of the display area; the display substrate includes a base substrate and a circuit structure layer disposed on the base substrate; the circuit structure layer of the display area is provided with a pixel driving circuit including multiple transistors, the display area further includes a light emitting structure layer and a package structure layer sequentially stacked on a side of the circuit structure layer away from the base substrate, the light emitting structure layer includes a light emitting device connected to the pixel driving circuit; a pad is provided in the circuit structure layer of the bonding area and configured to be bonded and connected to an external circuit board, a surface of the pad is disposed flush with a surface of the circuit structure layer around the pad and away from the base substrate.

Abstract: A display module has a bonding region, and includes a first bonding component and a second bonding component. The first bonding component includes first test pins and first function pins that are disposed in the bonding region and arranged in a first direction. The second bonding component includes second test pins and second function pins that are disposed in the bonding region and arranged in the first direction. The second test pins and the first test pins are coupled to constitute test pin pairs, the second function pins and the first function pins are coupled to constitute function pin pairs, and the test pin pairs and the function pin pairs constitute a pin row. The first bonding component further includes at least one first dummy pin disposed in the bonding region, and a first dummy pin is located on an outer side of the pin row in the first direction.

Abstract: A display panel, a method of manufacturing a display panel, and a display device are provided. The display panel includes: a substrate; a light-emitting device layer arranged on the substrate; a first thin film encapsulation layer including at least one organic layer; a color filter layer; a second thin film encapsulation layer including at least one organic layer; and an adhesive film layer arranged on at least one side of the color filter layer, wherein the adhesive film layer is in direct contact with the color filter layer, and the adhesive film layer and the color filter layer are stacked, and a material of the adhesive film layer has a viscosity greater than a viscosity of a material of the organic layer in each of the first thin film encapsulation layer and the second thin film encapsulation layer.

Abstract: A display panel includes an active area and a peripheral area surrounding the active area, and the display panel further includes: a substrate and a plurality of light emitting devices arranged on the substrate in array, wherein the plurality of light emitting devices are located at least in the active area; a conducting layer comprising a cathode ring and cathodes of the plurality of light emitting devices, wherein the cathode ring is located in the peripheral area, and the cathode ring surrounds the active area; and a lens layer located at a side of the light emitting devices away from the substrate, wherein the lens layer extends from the active area to the peripheral area; wherein an orthographic projection of the lens layer on the substrate is located within an area delineated by an outer contour of an orthographic projection of the cathode ring on the substrate.

Abstract: A display device, an electronic apparatus and a method for manufacturing the display device are disclosed. The display device includes an array substrate and a first thin film encapsulation layer disposed on the array substrate. The array substrate is a silicon based organic light-emitting diode array substrate, and the array substrate includes a silicon substrate and a light-emitting device disposed on the silicon substrate; a second thin film encapsulation layer disposed between the light-emitting device and the first thin film encapsulation layer; and a color filter layer disposed between the first thin film encapsulation layer and the second thin film encapsulation layer, at each edge of the first thin film encapsulation layer, an orthographic projection of the array substrate on a plane parallel to the array substrate extends beyond an orthographic projection of the first thin film encapsulation layer on the plane.

Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.

Abstract: The present disclosure relates to the field of display technologies and, in particular to a display panel and a display device. The display panel includes a circuit board assembly, a plurality of sub-pixels, a base substrate, and a plurality of connecting wires. The circuit board assembly includes a plurality of first bonding pads; a plurality of second bonding pads are disposed in the non-display area of the base substrate; the plurality of connecting wires connect the plurality of first bonding pads and the plurality of second bonding pads. Adjacent connecting wires have different maximum stretchable heights in a direction perpendicular to the base substrate.

Abstract: A display substrate and a manufacturing method thereof, and a display panel are provided. The display substrate includes a base substrate, a first electrode, a light-emitting functional layer, and a second electrode. The light-emitting functional layer includes a first functional layer and a second functional layer, an orthographic projection of an edge of the second functional layer on the base substrate is within an orthographic projection of an edge of the first functional layer on the base substrate, and an area of an orthographic projection of the second functional layer on the base substrate is smaller than an area of an orthographic projection of the first functional layer on the base substrate; and the second electrode covers and is in contact with at least one side surface of the light-emitting functional layer and a portion of a surface of the light-emitting functional layer away from the base substrate.

Abstract: A display device, an electronic apparatus and a method for manufacturing the display device are disclosed. The display device includes an array substrate and a first thin film encapsulation layer disposed on the array substrate. The array substrate is a silicon based organic light-emitting diode array substrate, and the array substrate includes a silicon substrate and a light-emitting device disposed on the silicon substrate; a second thin film encapsulation layer disposed between the light-emitting device and the first thin film encapsulation layer; and a color filter layer disposed between the first thin film encapsulation layer and the second thin film encapsulation layer, at each edge of the first thin film encapsulation layer, an orthographic projection of the array substrate on a plane parallel to the array substrate extends beyond an orthographic projection of the first thin film encapsulation layer on the plane.

Abstract: A display device and a method for manufacturing a display device are provided. The display device includes an array substrate and a cover plate. The array substrate is a silicon-based organic light-emitting diode array substrate. An orthographic projection of the array substrate in a plane parallel to the array substrate covers an orthographic projection of the cover plate in the plane, the orthographic projection of the array substrate includes a plurality of edges, the orthographic projection of the cover plate includes a plurality of edges, the plurality of edges of the array substrate are in one-to-one correspondence to the plurality of edges of the cover plate. At least two edges of the orthographic projection of the array substrate do not overlap with corresponding edges of the orthographic projection of the cover plate and are located outside the orthographic projection of the cover plate.

Abstract: A display panel, a method of manufacturing a display panel, and a display device are provided. The display panel includes: a substrate; a light-emitting device layer arranged on the substrate; a first thin film encapsulation layer including at least one organic layer; a color filter layer; a second thin film encapsulation layer including at least one organic layer; and an adhesive film layer arranged on at least one side of the color filter layer, wherein the adhesive film layer is in direct contact with the color filter layer, and the adhesive film layer and the color filter layer are stacked, and a material of the adhesive film layer has a viscosity greater than a viscosity of a material of the organic layer in each of the first thin film encapsulation layer and the second thin film encapsulation layer.

Abstract: The present disclosure relates to the field of display technologies and, in particular to a display panel and a display device. The display panel includes a circuit board assembly, a plurality of sub-pixels, a base substrate, and a plurality of connecting wires. The circuit board assembly includes a plurality of first bonding pads; a plurality of second bonding pads are disposed in the non-display area of the base substrate; the plurality of connecting wires connect the plurality of first bonding pads and the plurality of second bonding pads. Adjacent connecting wires have different maximum stretchable heights in a direction perpendicular to the base substrate.

Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.

Abstract: This disclosure relates to an organic electroluminescent structure and a fabrication method thereof, and a display device. The organic electroluminescent structure includes a base substrate; an anode layer formed on the base substrate, in which the anode layer comprises a plurality of anodes arranged at intervals; an organic light-emitting functional layer having a hole injection layer, in which the hole injection layer includes a plurality of hole injection blocks arranged at intervals, and each of the hole injection blocks is correspondingly formed on the second surface of one of the anodes; and a cathode layer formed at a side of the organic light-emitting functional layer facing away from the anode layer.