Patents by Inventor Chao Pu
Chao Pu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130202Abstract: A display panel includes an active area and a peripheral area surrounding the active area, and the display panel further includes: a substrate and a plurality of light emitting devices arranged on the substrate in array, wherein the plurality of light emitting devices are located at least in the active area; a conducting layer comprising a cathode ring and cathodes of the plurality of light emitting devices, wherein the cathode ring is located in the peripheral area, and the cathode ring surrounds the active area; and a lens layer located at a side of the light emitting devices away from the substrate, wherein the lens layer extends from the active area to the peripheral area; wherein an orthographic projection of the lens layer on the substrate is located within an area delineated by an outer contour of an orthographic projection of the cathode ring on the substrate.Type: ApplicationFiled: October 18, 2022Publication date: April 18, 2024Applicants: Yunnan Invensight Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Chao Pu, Shengji Yang, Junyan Yang, Xiaochuan Chen, Kuanta Huang, Pengcheng Lu, Dachao Li, Rongrong Shi, Junbo Wei, Xiao Bai, Bo Yang
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Patent number: 11950486Abstract: A display device, an electronic apparatus and a method for manufacturing the display device are disclosed. The display device includes an array substrate and a first thin film encapsulation layer disposed on the array substrate. The array substrate is a silicon based organic light-emitting diode array substrate, and the array substrate includes a silicon substrate and a light-emitting device disposed on the silicon substrate; a second thin film encapsulation layer disposed between the light-emitting device and the first thin film encapsulation layer; and a color filter layer disposed between the first thin film encapsulation layer and the second thin film encapsulation layer, at each edge of the first thin film encapsulation layer, an orthographic projection of the array substrate on a plane parallel to the array substrate extends beyond an orthographic projection of the first thin film encapsulation layer on the plane.Type: GrantFiled: August 27, 2019Date of Patent: April 2, 2024Assignee: BOE Technology Group Co., Ltd.Inventors: Chao Pu, Shengji Yang, Kuanta Huang, Pengcheng Lu, Xiaochuan Chen
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Patent number: 11871625Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.Type: GrantFiled: March 27, 2020Date of Patent: January 9, 2024Assignee: BOE Technology Group Co., Ltd.Inventors: Pengcheng Lu, Shengji Yang, Kuanta Huang, Xiaochuan Chen, Yage Song, Yanming Wang, Hui Wang, Dongdong Duan, Jiantong Li, Xiao Bai, Yunlong Li, Shuai Tian, Zhijian Zhu, Yu Ao, Junbo Wei, Chao Pu, Yuanlan Tian
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Patent number: 11805686Abstract: The present disclosure relates to the field of display technologies and, in particular to a display panel and a display device. The display panel includes a circuit board assembly, a plurality of sub-pixels, a base substrate, and a plurality of connecting wires. The circuit board assembly includes a plurality of first bonding pads; a plurality of second bonding pads are disposed in the non-display area of the base substrate; the plurality of connecting wires connect the plurality of first bonding pads and the plurality of second bonding pads. Adjacent connecting wires have different maximum stretchable heights in a direction perpendicular to the base substrate.Type: GrantFiled: March 27, 2020Date of Patent: October 31, 2023Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Chao Pu, Shengji Yang, Kuanta Huang, Pengcheng Lu, Xiaochuan Chen
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Patent number: 11805677Abstract: A display substrate and a manufacturing method thereof, and a display panel are provided. The display substrate includes a base substrate, a first electrode, a light-emitting functional layer, and a second electrode. The light-emitting functional layer includes a first functional layer and a second functional layer, an orthographic projection of an edge of the second functional layer on the base substrate is within an orthographic projection of an edge of the first functional layer on the base substrate, and an area of an orthographic projection of the second functional layer on the base substrate is smaller than an area of an orthographic projection of the first functional layer on the base substrate; and the second electrode covers and is in contact with at least one side surface of the light-emitting functional layer and a portion of a surface of the light-emitting functional layer away from the base substrate.Type: GrantFiled: August 27, 2019Date of Patent: October 31, 2023Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Chao Pu, Shengji Yang, Pengcheng Lu, Kuanta Huang, Junbo Wei, Li Liu
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Publication number: 20230180582Abstract: A display device, an electronic apparatus and a method for manufacturing the display device are disclosed. The display device includes an array substrate and a first thin film encapsulation layer disposed on the array substrate. The array substrate is a silicon based organic light-emitting diode array substrate, and the array substrate includes a silicon substrate and a light-emitting device disposed on the silicon substrate; a second thin film encapsulation layer disposed between the light-emitting device and the first thin film encapsulation layer; and a color filter layer disposed between the first thin film encapsulation layer and the second thin film encapsulation layer, at each edge of the first thin film encapsulation layer, an orthographic projection of the array substrate on a plane parallel to the array substrate extends beyond an orthographic projection of the first thin film encapsulation layer on the plane.Type: ApplicationFiled: August 27, 2019Publication date: June 8, 2023Applicant: BOE Technology Group Co., Ltd.Inventors: Chao Pu, Shengji Yang, Kuanta Huang, Pengcheng Lu, Xiaochuan Chen
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Patent number: 11563192Abstract: A display device and a method for manufacturing a display device are provided. The display device includes an array substrate and a cover plate. The array substrate is a silicon-based organic light-emitting diode array substrate. An orthographic projection of the array substrate in a plane parallel to the array substrate covers an orthographic projection of the cover plate in the plane, the orthographic projection of the array substrate includes a plurality of edges, the orthographic projection of the cover plate includes a plurality of edges, the plurality of edges of the array substrate are in one-to-one correspondence to the plurality of edges of the cover plate. At least two edges of the orthographic projection of the array substrate do not overlap with corresponding edges of the orthographic projection of the cover plate and are located outside the orthographic projection of the cover plate.Type: GrantFiled: August 16, 2019Date of Patent: January 24, 2023Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Junbo Wei, Shengji Yang, Chao Pu, Kuanta Huang, Pengcheng Lu, Xiaochuan Chen
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Publication number: 20220209178Abstract: A display panel, a method of manufacturing a display panel, and a display device are provided. The display panel includes: a substrate; a light-emitting device layer arranged on the substrate; a first thin film encapsulation layer including at least one organic layer; a color filter layer; a second thin film encapsulation layer including at least one organic layer; and an adhesive film layer arranged on at least one side of the color filter layer, wherein the adhesive film layer is in direct contact with the color filter layer, and the adhesive film layer and the color filter layer are stacked, and a material of the adhesive film layer has a viscosity greater than a viscosity of a material of the organic layer in each of the first thin film encapsulation layer and the second thin film encapsulation layer.Type: ApplicationFiled: December 4, 2020Publication date: June 30, 2022Inventors: Chao Pu, Shengji Yang, Pengcheng Lu, Kuanta Huang, Xiaochuan Chen, Junbo Wei
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Publication number: 20220140053Abstract: The present disclosure relates to the field of display technologies and, in particular to a display panel and a display device. The display panel includes a circuit board assembly, a plurality of sub-pixels, a base substrate, and a plurality of connecting wires. The circuit board assembly includes a plurality of first bonding pads; a plurality of second bonding pads are disposed in the non-display area of the base substrate; the plurality of connecting wires connect the plurality of first bonding pads and the plurality of second bonding pads. Adjacent connecting wires have different maximum stretchable heights in a direction perpendicular to the base substrate.Type: ApplicationFiled: March 27, 2020Publication date: May 5, 2022Inventors: Chao PU, Shengji YANG, Kuanta HUANG, Pengcheng LU, Xiaochuan CHEN
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Publication number: 20220115484Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.Type: ApplicationFiled: March 27, 2020Publication date: April 14, 2022Inventors: Pengcheng LU, Shengji YANG, Kuanta HUANG, Xiaochuan CHEN, Yage SONG, Yanming WANG, Hui WANG, Dongdong DUAN, Jiantong LI, Xiao BAI, Yunlong LI, Shuai TIAN, Zhijian ZHU, Yu AO, Junbo WEI, Chao PU, Yuanlan TIAN
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Publication number: 20220102669Abstract: This disclosure relates to an organic electroluminescent structure and a fabrication method thereof, and a display device. The organic electroluminescent structure includes a base substrate; an anode layer formed on the base substrate, in which the anode layer comprises a plurality of anodes arranged at intervals; an organic light-emitting functional layer having a hole injection layer, in which the hole injection layer includes a plurality of hole injection blocks arranged at intervals, and each of the hole injection blocks is correspondingly formed on the second surface of one of the anodes; and a cathode layer formed at a side of the organic light-emitting functional layer facing away from the anode layer.Type: ApplicationFiled: January 5, 2021Publication date: March 31, 2022Inventors: Li LIU, Pengcheng LU, Shengji YANG, Kui ZHANG, Rongrong SHI, Chao PU
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Publication number: 20210408432Abstract: A display device and a method for manufacturing a display device are provided. The display device includes an array substrate and a cover plate. The array substrate is a silicon-based organic light-emitting diode array substrate. An orthographic projection of the array substrate in a plane parallel to the array substrate covers an orthographic projection of the cover plate in the plane, the orthographic projection of the array substrate includes a plurality of edges, the orthographic projection of the cover plate includes a plurality of edges, the plurality of edges of the array substrate are in one-to-one correspondence to the plurality of edges of the cover plate. At least two edges of the orthographic projection of the array substrate do not overlap with corresponding edges of the orthographic projection of the cover plate and are located outside the orthographic projection of the cover plate.Type: ApplicationFiled: August 16, 2019Publication date: December 30, 2021Applicant: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Junbo WEI, Shengji YANG, Chao PU, Kuanta HUANG, Pengcheng LU, Xiaochuan CHEN
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Publication number: 20210066402Abstract: A display substrate and a manufacturing method thereof, and a display panel are provided. The display substrate includes a base substrate, a first electrode, a light-emitting functional layer, and a second electrode. The light-emitting functional layer includes a first functional layer and a second functional layer, an orthographic projection of an edge of the second functional layer on the base substrate is within an orthographic projection of an edge of the first functional layer on the base substrate, and an area of an orthographic projection of the second functional layer on the base substrate is smaller than an area of an orthographic projection of the first functional layer on the base substrate; and the second electrode covers and is in contact with at least one side surface of the light-emitting functional layer and a portion of a surface of the light-emitting functional layer away from the base substrate.Type: ApplicationFiled: August 27, 2019Publication date: March 4, 2021Inventors: Chao PU, Shengji YANG, Pendcheng LU, Kuanta HUANG, Junbo Wei, Li Liu
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Publication number: 20190039110Abstract: Rather than using a conventional stamping forming process with steels having high ultimate tensile strength and relatively low initial yield, tubular hydroforming techniques are introduced to synergize with BIW part forming, or forming of other load bearing parts. Such steels can have ultimate tensile strengths of greater than 1000 MPa and initial yields of less than 360 MPa In some embodiments, the steels have elongation of at least 40%. Such steels can include retained austenite.Type: ApplicationFiled: August 1, 2018Publication date: February 7, 2019Inventors: Chao Pu, Yueqian Jia, Feng Zhu, Yu-Wei Wang