Patents by Inventor Chao-Sheng Tseng

Chao-Sheng Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a polymer-based capacitive ultrasonic transducer
    Patent number: 7673375
    Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: March 9, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Wei Chang, Da-Chen Pang, Chao-Sheng Tseng
  • METHOD OF FABRICATING A POLYMER-BASED CAPACITIVE ULTRASONIC TRANSDUCER
    Publication number: 20090126183
    Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.
    Type: Application
    Filed: January 5, 2009
    Publication date: May 21, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Wei Chang, Da-Chen Pang, Chao-Sheng Tseng
  • Method of fabricating a polymer-based capacitive ultrasonic transducer
    Publication number: 20070013266
    Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.
    Type: Application
    Filed: August 29, 2005
    Publication date: January 18, 2007
    Inventors: Ming-Wei Chang, Da-Chen Pang, Chao-Sheng Tseng