Patents by Inventor Chao-Shun CHANG

Chao-Shun CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230174784
    Abstract: The present invention relates to a thermoplastic composition, a thermoplastic composite, and a method for producing the thermoplastic composite. In the method for producing the thermoplastic composite, a polymer, an acid-modified lignin with a specific element content and a compatibilizer with a specific melt flow index and a specific maleic anhydride content are used to produce the thermoplastic composite. Hydroxy groups of the acid-modified lignin react with maleic anhydride groups of the compatibilizer to generate ester bonds via an in-situ reaction catalyzed by acidic groups of the acid-modified lignin to enhance compatibility between the polymer and the lignin, thereby increasing a mechanical strength of the resulted thermoplastic composite.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 8, 2023
    Inventors: Kwang-Ming CHEN, Jung-Hung KAO, Kun-Pei HSIEH, Chao-Shun CHANG, Yen-Ting LIN, Hung-Jue SUE
  • Publication number: 20220204661
    Abstract: The present application relates to a polypropylene with high melt flow index and a method for producing the same, and meltblown fiber fabrics. A reacting mixture is firstly provided, and a polymerization process is performed to the reacting mixture in a slurry reaction system to obtain the polypropylene. The reacting mixture includes propylene monomers, Ziegler-Natta catalysts, organoaluminum compounds and electron donor. The polypropylene has high melt flow index and adjustable melting point and molecular weight distribution, such that it is used to produce the meltblown fiber fabrics.
    Type: Application
    Filed: October 18, 2021
    Publication date: June 30, 2022
    Inventors: Kwang-Ming CHEN, Kun-Pei HSIEH, Jung-Hung KAO, Chao-Shun CHANG, Hsing-Chun CHEN
  • Publication number: 20210388180
    Abstract: The present disclosure provides a copper nanowire composition. The a copper nanowire composition includes copper nanowire having associated alkylamine ligands with the structure HNR1R2. where R1 and R2 are independently hydrogen, alkyl or arylalkyl groups. The copper nanowire has an aspect ratio of at least 10. The associated alkylamine ligand is NR1R2 which contains at least 12 carbon atoms.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 16, 2021
    Inventors: Hung-Jue SUE, Chia-Ying TSAI, Kwang-Ming CHEN, Kun-Pei HSIEH, Chao-Shun CHANG, Ssu-Ping HUANG