Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.

Abstract: This invention relates to a phenolic resin composition comprising: a) about 50 wt % to about 95 wt % of one or more alkylphenol-aldehyde resins and b) about 5 wt % to about 50 wt % of an antioxidant composition. This invention also relates to a process of reducing hysteresis and/or improving scorch in a phenolic resin. This invention also relates to a process of recycling by-products of a reaction between an alkyl acrylate and an alkylphenol compound.

Abstract: A photosensitive chip includes a photosensitive region, a non-photosensitive region and an adhesive layer. The non-photosensitive region protrudes from a periphery of the photosensitive region to surround the photosensitive region. The adhesive layer covers the non-photosensitive region to absorb light and reduce an intensity of light reflected from the adhesive layer. The disclosure also provides a lens module having the photosensitive chip, and an electronic device having the lens module.

Abstract: A lens module with enhanced absorption of stray light includes a sensor and a mounting bracket. The sensor includes a photosensitive area and a non-photosensitive area arranged surrounding the photosensitive area. The sensor is received in the mounting bracket and a window is defined in the mounting bracket. An annular flange extends from an inner wall of the window towards a center axis of the window. The annular flange includes a reflecting surface facing away from the inner wall of the window and tilted towards the sensor. The photosensitive area is exposed in a through hole of the annular flange. Diffusing reflection structures are formed on the reflecting surface and are configured to diffuse light incident on the non-photosensitive area away from the photosensitive area.

Abstract: A camera module includes a base, a circuit board bearing the base, and a metal plate bearing the circuit board and the base. The base includes a receiving portion and a bearing portion. The bearing portion surrounds the receiving portion. The bearing portion defines a cutout to receive an electronic component of the circuit board.

Abstract: A circuit board assembly for a twin-camera module to avoid any heat-induced misalignments in manufacture is disclosed, to improve the production yield of the camera module. The circuit board assembly comprises at least two daughter boards and at least one first flexible printed circuit board. Each of the flexible printed circuit boards connects to adjacent two of the daughter boards. The disclosure also provides the twin-camera module comprising the circuit board assembly, and an electronic device comprising the camera module.

Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.

Abstract: A optical projector device less vulnerable to deformation of projected light by generated heat includes a printed circuit board, a light source, and an optical module. The heat-generating light source emits a laser beam, the optical module being mounted on the printed circuit board and surrounding the light source. The optical module comprises a lens holder, a collimating optical element received in the lens holder, and a diffractive optical element away from the light source. The lens holder comprises an outer lens holder and an inner lens holder fixed in the outer lens holder, and the diffractive optical element is received in the inner lens holder, this arrangement enables the dissipation of any heat-expansion force away from these elements.

Abstract: A co-wound resistor with a low parasitic inductance includes a first resistive strip having an input and a second resistive strip having an output. The second resistive strip has a similar shape as the first resistive strip. The second resistive strip is co-wound in a same direction as the first resistive strip. The second resistive strip and the first resistive strip are configured to generate a mutual inductance that cancels an inductance of the first resistive strip and the second resistive strip. The first interconnect coupling the first resistive strip to the second resistive strip. The first resistive strip, the second resistive strip and the first interconnect are on a same level.

Abstract: A capacitor has reduced misalignment in the interconnect layers and lower capacitance variance. The capacitor includes a first endcap having a first section and a second section orthogonal to the first section. The capacitor includes a first set of conductive fingers orthogonally coupled to the first section. The capacitor includes a third set of conductive fingers orthogonally coupled to the second section of the endcap and a second endcap parallel to the first section of the endcap. The capacitor includes a second set of conductive fingers orthogonally coupled to a second endcap and interdigitated with the first set of conductive fingers at a first interconnect layer. The capacitor includes a third endcap parallel to the second section of the first endcap and a fourth set of conductive fingers orthogonally coupled to the third endcap and interdigitated with the third set of conductive fingers at the first interconnect layer.

Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.

Abstract: A depth-perceiving lens module with enhanced heat-dissipating properties comprises a circuit board, an infrared emitter, and an infrared receiver. The circuit board is provided with at least one positioning hole. The infrared emitter is detachably disposed on a side of the circuit board and electrically connected to the circuit board, the infrared emitter comprises a mounting body and an emitting body. The mounting body wraps at least part of the emitting body, at least part of the mounting body is disposed in the positioning hole and fixed to the circuit board. The infrared receiver is detachably disposed on one side of the circuit board and electrically connected to the circuit board, to receive the reflection of the infrared light from the light emitter.

Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.

Abstract: A resistor-capacitor (RC) delay circuit includes a first capacitor at a first level, a resistor at a second level and a second capacitor at a third level. The second capacitor is electrically connected in parallel with the first capacitor. The second capacitor has a footprint within a footprint of the first capacitor. The resistor is coupled in shunt with the first capacitor and the second capacitor.

Abstract: Certain aspects of the present disclosure provide an integrated circuit (IC) that includes at least one of a via-based vertical capacitor structure or a via-based vertical resistor structure. The IC includes a substrate oriented in a horizontal plane, electrically conductive layers disposed above the substrate, and electrically insulative layers disposed above the substrate and interposed between the plurality of electrically conductive layers. At least one of the vertical capacitor structure or the vertical resistor structure is disposed in the electrically conductive layers and the electrically insulative layers.

Abstract: An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.

Abstract: A camera module with reduced light leakage includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. A step is defined at the printed circuit board. The step passes through the first surface and at least one side surface. A flange is defined on the mounting bracket. The flange is received and fixed in the step and this structure places less reliance on the strength and opacity of the particular adhesive used.

Abstract: Certain aspects of the present disclosure provide a metal-on-metal (MoM) capacitor with metal layers, each layer having two different electrical conductors with orthogonally-arranged conductive arteries and orthogonally-oriented conductive fingers. One exemplary MoM capacitor generally includes a plurality of metal layers, wherein a first metal layer in the plurality of metal layers comprises a first electrical conductor providing a first node of the MoM capacitor and a second electrical conductor providing a second node of the MoM capacitor. According to aspects, the first electrical conductor comprises a first plurality of conductive fingers and the second electrical conductor comprises a second plurality of conductive fingers. Further, conductive fingers of the first plurality of conductive fingers are interdigitated with conductive fingers of the second plurality of conductive fingers.

Abstract: A low cost capacitor (e.g., metal-insulator-metal (MIM) capacitor) is included in the back-end-of-line layers for effective routing and area savings. The capacitor has a first electrode (e.g., a first terminal of the capacitor) including a conductive back-end-of-line (BEOL) layer and a second electrode (e.g., a second terminal of the capacitor) including a nitride-based metal. The capacitor also has an etch stop layer (e.g., a dielectric of the capacitor) between the first electrode and the second electrode.

Abstract: Methods, systems, and devices for a finger metal-on-metal (FMOM) capacitor including a negative capacitance material are described. In one examples, a FMOM capacitor may include a first electrode and a second electrode. The FMOM capacitor may include a dielectric layer coating a first sidewall of the first electrode and a second sidewall of a second electrode. A portion of the first sidewall may be substantially parallel to a portion of the second sidewall. The FMOM capacitor may also include a negative capacitance material disposed in a channel between the first sidewall of the first electrode and the second sidewall of the second electrode. The negative capacitance material may extend in a direction that is substantially parallel to the portion of the first sidewall and the portion of the second sidewall.