Patents by Inventor CHAO-TSUNG TSOU

CHAO-TSUNG TSOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Taiko wafer ring cut process method
    Patent number: 11551923
    Abstract: A Taiko wafer ring cut process method is provided. The Taiko wafer ring cut process method includes the following steps. A Taiko wafer is disposed on the platform. The Taiko wafer is performing by laser ring cutting so that a Taiko ring and an edge portion of the Taiko wafer are separated from a wafer portion of the Taiko wafer. The wafer portion of the Taiko wafer is adhered to a frame.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: January 10, 2023
    Assignee: PHOENIX SILICON INTERNATIONAL CORP.
    Inventors: Chien-Hsiung Huang, Chao-Tsung Tsou, Cheng-Yen Lin
  • TAIKO WAFER RING CUT PROCESS METHOD
    Publication number: 20220230869
    Abstract: A Taiko wafer ring cut process method is provided. The Taiko wafer ring cut process method includes the following steps. A Taiko wafer is disposed on the platform. The Taiko wafer is performing by laser ring cutting so that a Taiko ring and an edge portion of the Taiko wafer are separated from a wafer portion of the Taiko wafer. The wafer portion of the Taiko wafer is adhered to a frame.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Inventors: CHIEN-HSIUNG HUANG, CHAO-TSUNG TSOU, CHENG-YEN LIN
  • CRUCIBLE AND VAPOR DEPOSITION APPARATUS
    Publication number: 20220228250
    Abstract: A crucible includes a crucible body and at least one protrusion. The crucible body has a containing groove. The protrusion is disposed on an outer wall surface of the crucible body. The protrusion protrudes outward from the outer wall of the crucible body. A vapor deposition apparatus includes a metal base and a crucible. The crucible is disposed in the metal base. The crucible includes a crucible body and at least one protrusion. The crucible body has a containing groove, and the containing groove is used for adding a vapor deposition material. The protrusion is disposed on an outer wall surface of the crucible body. The protrusion protrudes outward from the outer wall of the crucible body, and the protrusion abuts the inner wall of the metal base.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Inventors: CHIEN-HSIUNG HUANG, CHAO-TSUNG TSOU, CHENG-YEN LIN
  • Manufacturing process of wafer thinning
    Patent number: 10026603
    Abstract: A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 17, 2018
    Assignee: PHOENIX SILICON INTERNATIONAL CORP.
    Inventors: Shih-Ching Yang, Chien-Hsiung Huang, Chao-Tsung Tsou, Cheng-Yen Lin
  • MANUFACTURING PROCESS OF WAFER THINNING
    Publication number: 20170372885
    Abstract: A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.
    Type: Application
    Filed: September 1, 2016
    Publication date: December 28, 2017
    Inventors: SHIH-CHING YANG, CHIEN-HSIUNG HUANG, CHAO-TSUNG TSOU, CHENG-YEN LIN