Patents by Inventor Chao-Tung Chung

Chao-Tung Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8157412
    Abstract: A light emitting diode substrate assembly has a metal substrate, a circuit board, multiple chip strings, an annular wall and an encapsulant. The circuit board is mounted on the top surface of the substrate and has multiple through holes and multiple current conducting lines. The chip strings are mounted on the substrate and respectively in the through hole in the circuit board. Each chip string has at least one light emitting diode chip connected electrically to two corresponding current conducting lines on the circuit board with bonding wires. Accordingly, the heat generating during the operation of the chips can be efficiently dissipated from the substrate.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: April 17, 2012
    Assignee: Shin Zu Shing Co., Ltd.
    Inventors: Shun-Tian Lin, Chao-Tung Chung
  • Publication number: 20110128731
    Abstract: A light emitting diode substrate assembly has a metal substrate, a circuit board, multiple chip strings, an annular wall and an encapsulant. The circuit board is mounted on the top surface of the substrate and has multiple through holes and multiple current conducting lines. The chip strings are mounted on the substrate and respectively in the through hole in the circuit board. Each chip string has at least one light emitting diode chip connected electrically to two corresponding current conducting lines on the circuit board with bonding wires. Accordingly, the heat generating during the operation of the chips can be efficiently dissipated from the substrate.
    Type: Application
    Filed: December 1, 2009
    Publication date: June 2, 2011
    Applicant: SHIN ZU SHING CO., LTD.
    Inventors: Shun-Tian Lin, Chao-Tung Chung