Patents by Inventor Chao-Wei Chen

Chao-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171161
    Abstract: A frequency calibration (FCAL) circuit and a method for calibrating an oscillation frequency of a controllable oscillator are provided. The FCAL circuit includes the controllable oscillator, a divider, a time-to-digital converter (TDC) and a calibration logic. The controllable oscillator generates a controllable oscillation clock according to a calibration code. The divider divides the oscillation frequency of the controllable oscillation clock by a predetermined divisor to generate a divided clock. The TDC converts a first period between first edges of a reference clock and the divided clock into a first period code and converts a second period between second edges of the reference clock and the divided clock into a second period code. The calibration logic compares the first period code and the second period code to generate a comparison result for determining whether the first period is greater or less than the second period, and accordingly controls the calibration code.
    Type: Application
    Filed: July 18, 2023
    Publication date: May 23, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chien-Wei Chen, Kairen Fong, Chao-Ching Hung, Yu-Li Hsueh
  • Patent number: 11991853
    Abstract: A clip for securing one or more cables associated with a computing device includes a baseplate, a first wall, and a second wall. The first wall and the second wall extend from the baseplate. The first wall has a first inward projection at a distal end thereof. The second wall has a second inward projection at a distal end thereof. The first wall is generally parallel to the second wall. The first wall and the second wall are spaced apart from each other by an interior space configured to receive the one or more cables. The first inward projection and the second inward projection aid in preventing the one or more cables from moving outside of the interior space.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: May 21, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Chih-Wei Lin, Jui-Chung Lee, Hui-Ying Suk
  • Patent number: 11988246
    Abstract: An axial-rotation locking-mechanism assembly includes a handle, a locking assembly, and a shaft. The locking assembly includes a locking element and a cam mechanism. The shaft is operatively connected to the handle and the locking assembly. When the handle is rotated in a first direction, the shaft is rotated in a first direction and drives the cam mechanism to move the locking element in a first axial direction. When the handle is rotated in a second direction, the shaft is rotated in a second direction and drives the cam mechanism to move the locking element in a second axial direction. The second direction is the opposite of the first direction. The first axial direction is the opposite of the second direction.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: May 21, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Chih-Wei Lin, Che-Hung Lin
  • Patent number: 11968817
    Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
  • Publication number: 20240126003
    Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 18, 2024
    Applicant: Nano Precision Taiwan Limited
    Inventors: Hsin-Wei Chen, Wen-Yen Chiu, Chao-Hung Weng, Ming-Dah Liu
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20240113429
    Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.
    Type: Application
    Filed: August 16, 2023
    Publication date: April 4, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chia-Hung Chen, Chih-Wei Liao, Hau Yuen Tan, Hao-Hsiang Yang, Shih-Keng Huang
  • Publication number: 20240103520
    Abstract: A method of controlling movement of an autonomous mobile apparatus including a driving module, a processor, and a positioning module includes steps of: the processor moving the autonomous mobile apparatus at a default speed from a first location toward a second location along a straight path; the positioning module obtaining data related to a current location; when the processor determines that a distance between the current location and the second location is greater than a predetermined distance, the processor obtaining a deviating direction and a minimum distance of the current location relative to the straight path; the processor setting a movement speed and an angular velocity based on the deviating direction, a tolerant distance, the minimum distance, and the default speed; and the processor controlling the driving apparatus to move the autonomous mobile apparatus at the movement speed and turning the autonomous mobile apparatus at the angular velocity.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Inventors: Chien-Tung CHEN, Chung-Hou WU, Chao-Cheng CHEN, Wen-Wei CHIANG
  • Patent number: 11941410
    Abstract: Systems and methods for generating, distributing, and using performance mode BIOS configurations are disclosed. Each performance mode BIOS configuration can be a unique set of BIOS setting values that have been established to optimize a particular performance parameter or set of performance parameters, such as boot speed or operating system installation speed. Based on a given hardware configuration and/or set of performance parameters, one or more performance mode BIOS configurations can be packaged and transferred to a memory of a BMC in the form of one or more configuration payloads. The BIOS Setup Utility can display all configuration payloads, such as listed by the type of performance mode (e.g., “Boot Speed Performance Mode” and “OS Installation Performance Mode”), that are available in the BMC memory and allow a user to overwrite the memory containing the current BIOS configuration with a selected configuration payload.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: March 26, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Lung-Chih Chen, Tian-You Chen, Ting-Wei Chien, Chao-Kai Huang
  • Publication number: 20240096476
    Abstract: The present application provides a method for providing cognitive training by using a computing device. The method includes prompting a first target object for recognizing by a user; receiving a feedback response from the user by the computing device; determining a correctness of the feedback response by comparing the feedback response with a stored answer by the computing device; and adjusting a level or a type of a second target object based on a guideline associated with the correctness of the feedback response. The second target object is provided for recognizing by the user after the first target object is provided. In addition, the present application also provides a computing device for providing cognitive training and a non-transitory computer-readable recording medium capable of providing cognitive training.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventor: CHAO-WEI CHEN
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240087967
    Abstract: An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically connected to the semiconductor substrate, and the conductive pads each have a contact region and a testing region, where in each of the conductive pads, an edge of the contact region is in contact with an edge of the testing region. The passivation layer is located on the semiconductor substrate, where the conductive pads are located between the semiconductor substrate and the passivation layer, and the testing regions and the contact regions of the conductive pads are exposed by the passivation layer. The conductive vias are respectively located on the contact regions of the conductive pads.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen
  • Patent number: 11921307
    Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The movable part includes a connecting assembly configured to position the optical element.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: March 5, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Hsi Wang, Chao-Chang Hu, Chih-Wei Weng, Kuen-Wang Tsai, Tzu-Ying Chen
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Publication number: 20240072411
    Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicant: Pegatron Corporation
    Inventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Publication number: 20240060113
    Abstract: A method for preserving and processing fetal nucleic acids located within maternal plasma is disclosed, wherein a sample of maternal blood containing fetal nucleic acids is treated to reduce both cell lysis of the maternal blood cells and deoxyribonuclease (DNase) and ribonuclease (RNase) activity within the fetal nucleic acids. The treatment of the sample aids in increasing the amount of fetal nucleic acids that can be identified and tested while maintaining the structure and integrity of the fetal nucleic acids.
    Type: Application
    Filed: April 25, 2023
    Publication date: February 22, 2024
    Inventors: M Rohan Fernando, Kate Chao-Wei Chen
  • Patent number: 11634747
    Abstract: A method for preserving and processing fetal nucleic acids located within maternal plasma is disclosed, wherein a sample of maternal blood containing fetal nucleic acids is treated to reduce both cell lysis of the maternal blood cells and deoxyribonuclease (DNase) and ribonuclease (RNase) activity within the fetal nucleic acids. The treatment of the sample aids in increasing the amount of fetal nucleic acids that can be identified and tested while maintaining the structure and integrity of the fetal nucleic acids.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: April 25, 2023
    Assignee: STRECK LLC
    Inventors: M. Rohan Fernando, Kate Chao-Wei Chen