Patents by Inventor Chao-Wei Chiu
Chao-Wei Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126003Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.Type: ApplicationFiled: October 16, 2023Publication date: April 18, 2024Applicant: Nano Precision Taiwan LimitedInventors: Hsin-Wei Chen, Wen-Yen Chiu, Chao-Hung Weng, Ming-Dah Liu
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Publication number: 20240107682Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.Type: ApplicationFiled: April 21, 2023Publication date: March 28, 2024Inventors: Chao-Wei Chiu, Chih-Chiang Tsao, Jen-Jui Yu, Hsuan-Ting Kuo, Hsiu-Jen Lin, Ching-Hua Hsieh
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Publication number: 20240096740Abstract: Provided is a package structure including a first redistribution layer (RDL) structure, a die, a circuit substrate, and a first thermoelectric cooler. The RDL) structure has a first side and a second side opposite to each other. The die is disposed on the first side of the first RDL structure. The circuit substrate is bonded to the second side of the first RDL structure through a plurality of first conductive connectors. The first thermoelectric cooler is between the first RDL structure and the circuit substrate, wherein the first thermoelectric cooler includes at least a N-type doped region and at least a P-type doped region.Type: ApplicationFiled: January 9, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chao-Wei Chiu, Chao-Wei Li, Hsiu-Jen Lin, Ching-Hua Hsieh
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071952Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.Type: ApplicationFiled: January 10, 2023Publication date: February 29, 2024Inventors: Chih-Chiang Tsao, Hsuan-Ting Kuo, Chao-Wei Chiu, Hsiu-Jen Lin, Ching-Hua Hsieh
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240063081Abstract: A package structure including a semiconductor die, an encapsulant, a redistribution structure, and a through insulating via is provided. The first redistribution structure includes an insulating layer and a circuit layer. The semiconductor die is disposed on the first redistribution structure. The semiconductor die includes a semiconductor base, through semiconductor vias, a dielectric layer, and bonding connectors. Through semiconductor vias penetrate through the semiconductor base. The dielectric layer is disposed on a backside of the semiconductor base. The dielectric layer of the semiconductor die is bonded with the insulating layer of the first redistribution structure. The bonding connectors are embedded in the dielectric layer and connected to the through semiconductor vias. The bonding connectors of the semiconductor die are bonded with bonding pads of the circuit layer. The encapsulant is disposed on the first redistribution structure and encapsulates the semiconductor die.Type: ApplicationFiled: August 17, 2022Publication date: February 22, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Fung Chang, Sheng-Feng Weng, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Chiu, Chao-Wei Li, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20230369094Abstract: A method of handling a workpiece includes the following steps. A workpiece is placed on a chuck body, wherein the workpiece includes a tape carrier extending beyond a periphery of the chuck body and a workpiece body disposed on the tape carrier, and the chuck body includes a seal ring surrounding the periphery of the chuck body; the tape carrier is clamped outside the chuck body, wherein the tape carrier leans against the seal ring and an enclosed space is formed between the chuck body, the tape carrier and the seal ring; and a vacuum seal is formed by evacuating gas from the enclosed space to pull the periphery of the workpiece toward the chuck body.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh, Chia-Shen Cheng
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Patent number: 11791192Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.Type: GrantFiled: September 3, 2020Date of Patent: October 17, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh, Chia-Shen Cheng
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Publication number: 20230282555Abstract: A package structure includes a first package, a second package, a conductive spacer, and a flux portion. The first package includes a semiconductor die. The second package is stacked to the first package. The conductive spacer is disposed between and electrically couples the first package and the second package. The flux portion is disposed between and electrically couples the first package and the conductive spacer, where the flux portion includes a first portion and a second portion separating from the first portion by a gap, and the first portion and the second portion are symmetric about an extending direction of the gap. The gap is overlapped with the conductive spacer.Type: ApplicationFiled: March 2, 2022Publication date: September 7, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chiang Tsao, Chao-Wei Chiu, Jen-Jui Yu, Hsiu-Jen Lin, Ching-Hua Hsieh
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Patent number: 11664300Abstract: A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.Type: GrantFiled: December 26, 2019Date of Patent: May 30, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Cheng-Shiuan Wong, Hsiu-Jen Lin, Ching-Hua Hsieh
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Publication number: 20230014450Abstract: A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.Type: ApplicationFiled: July 16, 2021Publication date: January 19, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao, Chao-Wei Chiu
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Publication number: 20220359356Abstract: A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.Type: ApplicationFiled: July 21, 2022Publication date: November 10, 2022Inventors: Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Cheng-Shiuan Wong, Hsiu-Jen Lin, Ching-Hua Hsieh
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Publication number: 20210225684Abstract: A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.Type: ApplicationFiled: September 3, 2020Publication date: July 22, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh, Chia-Shen Cheng
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Publication number: 20210202358Abstract: A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.Type: ApplicationFiled: December 26, 2019Publication date: July 1, 2021Inventors: Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Cheng-Shiuan Wong, Hsiu-Jen Lin, Ching-Hua Hsieh