Patents by Inventor Chao-Wei Ko

Chao-Wei Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor memory package structure and semiconductor memory system
    Patent number: 11508415
    Abstract: A semiconductor memory package structure includes at least one semiconductor die and a lead group. The at least one semiconductor die includes a chip enable terminal. The lead group is configured to electrically connect the chip enable terminal to an external circuit board and includes a first pin and a second pin coupled to the chip enable terminal. The at least one semiconductor die and the lead group are formed as an integral entity using an insulating material.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: November 22, 2022
    Assignee: Transcend Information, Inc.
    Inventors: Bing-Lian Lin, Chao-Wei Ko
  • SEMICONDUCTOR MEMORY PACKAGE STRUCTURE AND SEMICONDUCTOR MEMORY SYSTEM
    Publication number: 20220293137
    Abstract: A semiconductor memory package structure includes at least one semiconductor die and a lead group. The at least one semiconductor die includes a chip enable terminal. The lead group is configured to electrically connect the chip enable terminal to an external circuit board and includes a first pin and a second pin coupled to the chip enable terminal. The at least one semiconductor die and the lead group are formed as an integral entity using an insulating material.
    Type: Application
    Filed: March 15, 2021
    Publication date: September 15, 2022
    Inventors: Bing-Lian Lin, Chao-Wei Ko