Abstract: The present application provides an inertial sensor, which comprising an anchor point, a first sensing proof mass, and a second sensing proof mass. The first sensing proof mass and the second sensing proof mass are connected with the anchor point by a corresponding flexible member. Each of the first sensing proof mass and the second sensing proof mass is provided with a groove to create mass imbalance on two sides of the flexible member for sensing accelerations in an out-of-plane direction. By mounting electrodes in a plane direction and in the grooves, in-plane accelerations orthogonal to each other are sensed.

Abstract: The present application provides a three-axis gyroscope, which comprises a substrate on which a first plate element, a second plate element, a third plate element, a first drive module, and a second drive module are disposed. The first driving module, the first plate element, the second plate element, the third plate element and the second driving module are disposed in an axial direction. Thereby, problems caused by use of frames and coupling flexible structures of three-axis gyroscopes available now may be solved effectively.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, a first driving assembly, and a positioning element. The movable portion is movably disposed on the fixed portion and comprising an optical element. The optical element moves in a first direction. The first driving assembly is at least partially disposed on the fixed portion. The positioning element is rotatably disposed on the fixed portion or the movable portion. When the first driving assembly is not activated, the positioning element is used to limit the position of the movable portion relative to the fixed portion to a limit position, and the positioning element comprises a main body and a limiting portion extending from the main body in a second direction that is perpendicular to the first direction. The limiting portion passes through the optical element.

Abstract: The present disclosure provides an optical element driving mechanism, which includes a first movable part, a fixed assembly, a first driving assembly, a second movable part, a second driving assembly and a locking assembly. The first movable part is configured to connect an optical element. The first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly, and the second driving assembly is configured to drive the second movable part to move relative to the first movable part and the fixed assembly. The locking assembly is configured to fix the first movable part at a first position relative to the fixed assembly.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a functional cell region including an n-type functional transistor and a p-type functional transistor. The semiconductor structure also includes a first power transmission cell region including a first cutting feature and a first contact rail in the first cutting feature. The semiconductor structure also includes a first power rail electrically connected to a source terminal of the p-type functional transistor and the first contact rail of the first power transmission cell region. The semiconductor structure also includes a second power transmission cell region adjacent to the first power transmission cell and including a second cutting feature and second contact rail in the second cutting feature. The semiconductor structure also includes an insulating strip extending from the first cutting feature to the second cutting feature in a first direction.

Abstract: An optical element driving mechanism for corresponding to an optical module, the optical element driving mechanism including a fixed portion, a movable portion, and a first driving assembly. The fixed portion has an aperture. The movable portion is for connecting to an optical element and is movable relative to the fixed portion. The first driving assembly is for driving the movable portion to move relative to the fixed portion. The fixed portion has an elongated structure, and the fixed portion further comprises a first end. The fixed portion further comprising a second end, wherein the first end and the second end are arranged along a first direction. A shortest distance between the optical sensing element and the first end is shorter than a shortest distance between the optical sensing element and the second end.

Abstract: The present invention provides a PTX3 monoclonal antibody or antibody Fab fragment thereof and use thereof. The aforementioned monoclonal antibody or antibody Fab fragment thereof specifically inhibit or slow down the binding of PTX3 to the PTX3 receptor, and may be used for a kit and method for detecting PTX3, and a pharmaceutical composition which inhibits or slows down diseases or symptoms associated with PTX3 and PTX3 receptor binding, and a use thereof.

Abstract: Devices and methods of manufacture and use of a fiber bundle is presented. In embodiments the fiber bundle comprises a substrate material and optical fiber openings that extend from a first side of the substrate material to a second side of the substrate material, wherein the optical fiber openings at the first side of the substrate material are shifted either horizontally or vertically from the second side of the substrate material.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: A memory device is provided. The memory device includes a memory cell array having a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of columns include a first plurality of memory cells connected to a first bit line and a second bit line. A pre-charge circuit is connected to the memory cell array. The pre-charge circuit pre-charges each of the first bit line and the second bit line from a first end. A pre-charge assist circuit is connected to the memory cell array. The pre-charge assist circuit pre-charges each of the first bit line and the second bit line from a second end, the second end being opposite the first end.

Abstract: A method, comprising: providing an adjustable distributor assembly disposed within a showerhead configured to provide selectively adjustable openings through which a cleaning material passes; determining an initial value of a configurable parameter of an adjustable distributor assembly; performing an amount/thickness measurement of a layer including polymeric residues and metal oxide deposits at a cleaning surface of a wafer by a monitoring device; determining whether a variation in the amount/thickness measurement is within an acceptable range; and in response to the variation in the amount/thickness measurement that is not within the acceptable range, automatically adjusting the configurable parameter of the adjustable distributor assembly to set the variation in the amount/thickness measurement within the acceptable range so that the cleaning material that passes through the selectively adjustable openings of the adjustable distributor assembly reduces metal oxide deposits.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: A memory device is provided. The memory device includes a memory cell array having a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of columns include a first plurality of memory cells connected to a first bit line and a second bit line. A pre-charge circuit is connected to the memory cell array. The pre-charge circuit pre-charges each of the first bit line and the second bit line from a first end. A pre-charge assist circuit is connected to the memory cell array. The pre-charge assist circuit pre-charges each of the first bit line and the second bit line from a second end, the second end being opposite the first end.

Abstract: A method, comprising: providing an adjustable distributor assembly disposed within a showerhead configured to provide selectively adjustable openings through which a cleaning material passes; determining an initial value of a configurable parameter of an adjustable distributor assembly; performing an amount/thickness measurement of a layer including polymeric residues and metal oxide deposits at a cleaning surface of a wafer by a monitoring device; determining whether a variation in the amount/thickness measurement is within an acceptable range; and in response to the variation in the amount/thickness measurement that is not within the acceptable range, automatically adjusting the configurable parameter of the adjustable distributor assembly to set the variation in the amount/thickness measurement within the acceptable range so that the cleaning material that passes through the selectively adjustable openings of the adjustable distributor assembly reduces metal oxide deposits.

Abstract: An optical element driving mechanism has an optical axis, and includes a fixed portion, a movable element, a plurality of blades, and a driving assembly. The fixed portion has an opening. The movable element is movable relative to the fixed portion. The blades are connected to the movable element. The driving assembly drives the movable element to move relative to the fixed portion. The driving assembly drives the movable element to change an overlap area of the blade and the opening.

Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: A method includes connecting a photonic package to a substrate, wherein the photonic package includes a waveguide and an edge coupler that is optically coupled to the waveguide; connecting a semiconductor device to the substrate adjacent the photonic package; depositing a first protection material on a first sidewall of the photonic package that is adjacent the edge coupler; encapsulating the photonic package and the semiconductor device with an encapsulant; performing a first sawing process through the encapsulant and the substrate, wherein the first sawing process exposes the first protection material; and removing the first protection material to expose the first sidewall of the photonic package.

Abstract: Some embodiments relate to an integrated circuit including a plurality of floating diffusion regions ohmically connected to a common contact via a patterned conductive layer, obviating a need for individual contacts for each floating diffusion region. The integrated circuit includes a semiconductor substrate and an interconnect structure disposed over the semiconductor substrate. The interconnect structure includes a plurality of dielectric layers and a conductive layer that are stacked over one another in alternating fashion. A contact electrode is disposed over and in direct (e.g., direct and ohmic) contact with the conductive layer. The conductive layer is directly (e.g., directly and ohmically) connected to a respective surface of each of a plurality of floating diffusion regions. The respective surfaces connected by the conductive layer are co-planar with one another. Each floating diffusion region can be associated with a respective pixel of an array of pixels of an image sensor.

Abstract: A radio frequency (RF) communication assembly includes an RF communication circuit and a compensator apparatus. The compensator apparatus receives an input including an I-component of a pre-compensated signal, a Q-component of the pre-compensated signal, and encoded operating conditions of the RF communication circuit. The RF communication circuit includes RF circuit components causing signal impairments. The compensator apparatus perform neural network computing on the input, and the RF communication assembly generates a compensated output signal that compensates for at least a portion of the signal impairments.