Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Abstract: The present disclosure relates to a method for storage or transportation of graphene oxide. The method for storage or transportation of graphene oxide comprises the steps of: carrying out wet spinning of a graphene oxide spinning solution to a coagulating bath to obtain graphene oxide pellets; drying the obtained graphene oxide pellets; storing or transporting the dried graphene oxide pellets; and redispersing the stored or transported graphene oxide pellets.

Abstract: The present disclosure relates to a method for storage or transportation of graphene oxide. The method for storage or transportation of graphene oxide comprises the steps of: carrying out wet spinning of a graphene oxide spinning solution to a coagulating bath to obtain graphene oxide pellets; drying the obtained graphene oxide pellets; storing or transporting the dried graphene oxide pellets; and redispersing the stored or transported graphene oxide pellets.

Abstract: A panel module for a computer enclosure includes a main panel, a linkage member, a cover panel, and a resilient limiting member. The main panel has a cover region and an opening provided in the cover region. The linkage member is connected pivotally to the main and cover panels. The cover panel is movable relative to the main panel to be closed upon or flipped away from the cover region. The linkage member is disposed at a closed position when the cover panel is closed. The limiting member is interposed between the main panel and the linkage member to limit the linkage member to the closed position, and enables the linkage member to be automatically restored to the closed position when the cover panel is to be closed, thereby permitting easy and proper closing of the cover panel.

Abstract: A panel module for a computer enclosure includes a main panel, a linkage member, a cover panel, and a resilient limiting member. The main panel has a cover region and an opening provided in the cover region. The linkage member is connected pivotally to the main and cover panels. The cover panel is movable relative to the main panel to be closed upon or flipped away from the cover region. The linkage member is disposed at a closed position when the cover panel is closed. The limiting member is interposed between the main panel and the linkage member to limit the linkage member to the closed position, and enables the linkage member to be automatically restored to the closed position when the cover panel is to be closed, thereby permitting easy and proper closing of the cover panel.