Patents by Inventor Chao-Wen Lu

Chao-Wen Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190368510
    Abstract: A cross flow fan includes a fan frame and a rotor having a hub, a shaft connected with the hub at its rotation center, a plurality of blades, and a disk structure connected with the blades and hub within the fan frame. The fan frame has a frame wall having a lateral flow inlet to the rotor and a lateral flow outlet from the rotor, a base carrying the rotor and frame wall, a cover on one side of the frame wall opposite to the base, and a partition structure disposed between the blades and an inner wall surface of the frame wall. A normal line of the lateral flow inlet and a normal line of the lateral flow outlet are not parallel to an extension direction of the shaft. The blades directly face the lateral flow inlet and the lateral flow outlet along radial directions of the shaft.
    Type: Application
    Filed: August 19, 2019
    Publication date: December 5, 2019
    Inventors: Tsung-Ying LEE, Shih-Han CHEN, Chao-Wen LU
  • Fan
    Patent number: 10436223
    Abstract: A fan includes a fan frame and a rotor having a hub, a shaft connected with the hub at its rotation center, blades, and a disk structure connected with the blades and hub within the fan frame. The fan frame has a frame wall having inlet and outlet surfaces, a base carrying the rotor and frame wall, a cover on one side of the frame wall opposite to the base, and a tongue structure between the base and cover. The normal lines of the inlet and outlet surfaces are not parallel to the extension direction of the shaft. The distance between the virtual line segment of the outlet surface and shaft is the shortest distance between the shaft and outlet surface. The extended line from the center of the groove opening of the tongue structure intersects the imaginary plane where the virtual line segment and shaft are located.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: October 8, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Tsung-Ying Lee, Shih-Han Chen, Chao-Wen Lu
  • Publication number: 20190296607
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes a plurality of axial induced coil units and a circuit board. The axial induced coil units are respectively preformed as a plurality of stator magnetic pole units, and are coupled to the circuit board. At least one of the coil units includes a coil and insulation material. The insulation material is block-shaped and covers at least a portion of the coil, and the central axis of the coil is parallel to the shaft of the rotor.
    Type: Application
    Filed: June 11, 2019
    Publication date: September 26, 2019
    Inventors: Chin-Chun LAI, Kun-Fu CHUANG, Chao-Wen LU
  • Patent number: 10412867
    Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.
    Type: Grant
    Filed: January 6, 2019
    Date of Patent: September 10, 2019
    Assignee: 3Y POWER TECHNOLOGY (TAIWAN), INC.
    Inventors: Shao-Feng Lu, Chuan-Kai Wang, Yi-Chen Kuan, Chung-Yu Lan, Jen-Ming Hsu, Chao-Wen Fu
  • Patent number: 10381309
    Abstract: A package structure includes a first redistribution layer, a second redistribution layer, at least one semiconductor chip, an insulating encapsulation, a protection layer, and at least one connecting module. The at least one semiconductor chip is located between and electrically connected to the first redistribution layer and the second redistribution layer. The insulating encapsulation encapsulates the at least one semiconductor chip. The protection layer is disposed on and partially covers the first redistribution layer, wherein the first redistribution layer is located between the at least one semiconductor chip and the protection layer.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: August 13, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu, Kai-Chiang Wu, Albert Wan
  • Publication number: 20190246529
    Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.
    Type: Application
    Filed: January 6, 2019
    Publication date: August 8, 2019
    Inventors: Shao-Feng Lu, Chuan-Kai Wang, Yi-Chen Kuan, Chung-Yu Lan, Jen-Ming Hsu, Chao-Wen Fu
  • Publication number: 20190185623
    Abstract: A modified nylon 66 fiber including a first monomer derived from adipic acid and hexamethylenediamine, a second monomer derived from a diacid or a diamine having a long carbon chain, a third monomer derived from a diacid or a diamine having a aromatic ring, and a fourth monomer derived from a cyclic diacid or a cyclic diamine is provided. The second monomer has 6 to 36 carbon atoms. The third monomer has 8 to 14 carbon atoms. The fourth monomer has 6 to 10 carbon atoms. Based on a total weight of the modified nylon 66 fiber, a content of the first monomer is 78 wt % to 94.8 wt %, a content of the second monomer is 0.1 wt % to 1 wt %, a content of the third monomer is 5 wt % to 20 wt %, a content of the fourth monomer is 0.1 wt % to 1 wt %.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 20, 2019
    Applicant: Taiwan Textile Research Institute
    Inventors: Tzu-Chung Lu, Chin-Wen Chen, Wei-Hsiang Lin, Chao-Huei Liu, Po-Hsun Huang, Wei-Jen Lai
  • Publication number: 20190157206
    Abstract: A package structure includes a first redistribution layer, a second redistribution layer, at least one semiconductor chip, an insulating encapsulation, a protection layer, and at least one connecting module. The at least one semiconductor chip is located between and electrically connected to the first redistribution layer and the second redistribution layer. The insulating encapsulation encapsulates the at least one semiconductor chip. The protection layer is disposed on and partially covers the first redistribution layer, wherein the first redistribution layer is located between the at least one semiconductor chip and the protection layer.
    Type: Application
    Filed: April 30, 2018
    Publication date: May 23, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu, Kai-Chiang Wu, Albert Wan
  • Publication number: 20190078573
    Abstract: A fan device is provided, including a housing, a circuit board, a plurality of driving coils, at least one magnetic member, and a metal member. The housing includes a first surface, a second surface corresponding to the first surface, and a hollow protruding portion protruding from the first surface. The circuit board is disposed on the first surface, and the driving coils are disposed on the circuit board. The magnetic member is disposed corresponding to the driving coils. The metal member is disposed on the second surface and corresponds to the magnetic member. A method for manufacturing the fan device is also provided.
    Type: Application
    Filed: April 13, 2018
    Publication date: March 14, 2019
    Inventor: Chao-Wen LU
  • Patent number: 10145628
    Abstract: A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: December 4, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Chao-Wen Lu
  • Patent number: 10128034
    Abstract: A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: November 13, 2018
    Assignee: Delta Electronics, Inc.
    Inventors: Chao-Wen Lu, Chun-Chih Wang, Ding-Wei Chiu, Chung-Hung Tang
  • Publication number: 20180266434
    Abstract: A fan includes a motor base, a bearing, an impeller, a stator and a magnetic element. The motor base has a bearing stand in a center portion thereof. The bearing is accommodated within the bearing stand. The impeller includes a metallic case, a hub, plural blades and a rotating shaft. The metallic case has a top wall and a sidewall. The hub is sheathed around the metallic case. The blades are disposed around an outer periphery of the hub. The rotating shaft is inserted into a central opening of the top wall and penetrated through the bearing stand, wherein no raised ring structure is formed in the top wall of the metallic case, and the rotating shaft and the metallic case are jointed together by a laser welding process. The magnetic element is disposed on an inner wall of the metallic case and aligned with the stator.
    Type: Application
    Filed: May 18, 2018
    Publication date: September 20, 2018
    Inventors: Chiu-Kung Chen, Chao-Wen Lu
  • Publication number: 20180221790
    Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.
    Type: Application
    Filed: March 30, 2018
    Publication date: August 9, 2018
    Inventor: Chao-Wen LU
  • Patent number: 10040001
    Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: August 7, 2018
    Assignee: Delta Electronics, Inc.
    Inventor: Chao-Wen Lu
  • Patent number: 9903415
    Abstract: A motor includes a shaft, a rotor shell, a bushing, a bearing, and a thrust plate. The rotor shell is connected with the shaft. The bushing has an accommodating space. The bearing is disposed in the accommodating space, and the shaft is disposed through the bearing. The thrust plate is connected with the shaft, and is disposed between a bottom of the accommodating space and a bottom of the bearing. At least one surface of the thrust plate is formed with a plurality of grooves tapering off from an edge to a center.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: February 27, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Hsien Yeh, Chih-Wei Chan, Chao-Wen Lu
  • Publication number: 20180026495
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
    Type: Application
    Filed: March 23, 2017
    Publication date: January 25, 2018
    Inventors: Chao-Wen LU, Che-Wei LEE, Chung-Chiao TAN
  • Publication number: 20180026494
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes a plurality of axial induced coil units and a circuit board. The axial induced coil units are respectively preformed as a plurality of stator magnetic pole units, and are coupled to the circuit board. At least one of the coil units includes a coil and insulation material. The insulation material is block-shaped and covers at least a portion of the coil, and the central axis of the coil is parallel to the shaft of the rotor.
    Type: Application
    Filed: February 23, 2017
    Publication date: January 25, 2018
    Inventors: Chin-Chun LAI, Kun-Fu CHUANG, Chao-Wen LU
  • Patent number: 9846461
    Abstract: A heat dissipating apparatus includes a frame, an elastic body, a magnetic member and a coil. The frame has an opening. The elastic body is disposed on the frame, and the frame and the elastic body define a space. The magnetic member is located corresponding to the space and disposed at one side of the elastic body. The coil is located corresponding to the periphery of the space and disposed on the frame. An electronic device with the heat dissipating apparatus is also disclosed.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: December 19, 2017
    Assignee: Delta Electronics, Inc.
    Inventors: Chung-Hung Tang, Shih-Chou Chen, Chun-Lung Chiu, Chao-Wen Lu, Chun-Nan Lin, Fu-Mei Hsu
  • Patent number: 9777734
    Abstract: A thin type fan includes an impeller and a motor. The impeller includes a hub and a blade structure disposed around the hub. The motor includes a stator structure, a magnetic assembly, a bearing structure and a rotational shaft. The motor drives the impeller to rotate. The magnetic assembly is disposed within the hub and around the stator structure. The magnetic assembly includes a magnet and a magnetically permeable shell. The bearing structure includes a bearing seat and a single ball bearing. The single ball bearing is disposed in the bearing seat and forms an accommodating space, and the rotational shaft is disposed in the accommodating space.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: October 3, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Wen Lu, Chun-Chih Wang
  • Patent number: 9745990
    Abstract: A fan frame includes a first frame and a second frame. The first frame includes at least a first sidewall and a first connecting element, wherein the first connecting element is disposed on the first sidewall. The second frame includes at least a second sidewall and a second connecting element, wherein the second connecting element is disposed on the second sidewall and at least partially overlapped with the first connecting element. The second connecting element includes a first end and a second end in a first direction, wherein the first end and the second end are bent toward the first connecting element, respectively, for grasping the first connecting element. As a result, the accuracy error and the precision error are avoided, the stresses are internally counterbalanced, and the deformation of the fan frame is avoided.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: August 29, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Wen Lu, Chun-Chih Wang, Ding-Wei Chiu