Patents by Inventor Chao-Yang Hsiao

Chao-Yang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL PRESSURE SENSOR AND APPLICATION THEREOF
    Publication number: 20230358529
    Abstract: The invention provides an optical pressure sensor. The light-emitting module emits a detection light, and the light-receiving module receives a reflected light reflected by an object. When the distance between the object and the light-receiving module changes due to external pressure, the intensity of reflected light changes. The control module compares the intensity difference of the signal to determines the pressing state.
    Type: Application
    Filed: June 14, 2022
    Publication date: November 9, 2023
    Inventors: WEI-TING LIN, SHENG-CHENG LEE, CHAO-YANG HSIAO
  • Optical sensor package assembly
    Publication number: 20230309245
    Abstract: The present invention provides an optical sensor package assembly. The light shield is arranged in the groove of a package housing above the photosensitive chip. The connection wires between the substrate, the light emitting unit and the photosensitive chip can be printed or disposed on the surface of the substrate. Further, a distance between the photosensitive element and the chip edge is designed to reduce or avoid side leakage interference.
    Type: Application
    Filed: March 22, 2023
    Publication date: September 28, 2023
    Inventors: Sheng-Cheng Lee, Wen-Sheng Lin, Chao-Yang Hsiao, Chih-Wei Lin, Chen-Hua Hsi, Yueh-Hung Ho
  • CHIP RELIABILITY TEST ASSEMBLY
    Publication number: 20230258710
    Abstract: The present invention proposes a chip reliability test assembly, which comprises a motherboard and a daughter board. The motherboard is used to support the chips during an aging acceleration process at high temperature. The daughter board is used to measure the electricity of chip after the aging acceleration process. Each chip holder is removable off the motherboard. The daughter board does not go through the aging acceleration process and can be reusable.
    Type: Application
    Filed: June 9, 2022
    Publication date: August 17, 2023
    Inventors: CHAO-YANG HSIAO, SHENG-CHENG LEE, WEN-SHENG LIN, CHIH-WEI LIN, CHEN-HUA HSI, YUEH-HUNG HO
  • ADAPTIVE PROXIMITY SENSING DEVICE
    Publication number: 20230102603
    Abstract: The present invention provides an adaptive proximity sensing device, which can adjust the lighting power of a light-emitting element according to the sensed intensity to extends the sensing range. Further, the device can normalize the final sensed intensity to return the normal sensed intensity. Moreover, the uses a linear model of the normal sensed intensity and the distance, so the device can quickly determine the distance of the object.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 30, 2023
    Inventors: CHEN-HUA HSI, CHAO-YANG HSIAO, SHENG-CHENG LEE, WEN-SHENG LIN, CHIH-WEI LIN, YUEH-HUNG HOU
  • USB connector and contact array thereof
    Patent number: 8172585
    Abstract: Disclosed herein is a contact array of a universal serial bus (USB) connector including a first signal differential pair, a second signal differential pair and a third signal differential pair, wherein the second signal differential pair is disposed between the first and third signal differential pairs, and at least one power contact or ground contact is disposed between the first and second signal differential pairs, or between the second and third signal differential pairs.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: May 8, 2012
    Assignee: Chant Sincere Co., Ltd.
    Inventors: Wen-Ta Chiu, Ming-Hui Yen, Yeh-Hsi Lin, Chao-Yang Hsiao, Jhih-Ming Tu, Chang-Fa Yang, Ping-Chih Chen
  • USB CONNECTOR AND CONTACT ARRAY THEREOF
    Publication number: 20100159751
    Abstract: Disclosed herein is a contact array of a universal serial bus (USB) connector including a first signal differential pair, a second signal differential pair and a third signal differential pair, wherein the second signal differential pair is disposed between the first and third signal differential pairs, and at least one power contact or ground contact is disposed between the first and second signal differential pairs, or between the second and third signal differential pairs.
    Type: Application
    Filed: November 20, 2009
    Publication date: June 24, 2010
    Applicant: CHANT SINCERE CO., LTD.
    Inventors: Wen-Ta CHIU, Ming-Hui YEN, Yeh-Shi LIN, Chao-Yang HSIAO, Jhih-Ming TU, Chang-Fa YANG, Ping-Chih CHEN
  • Lead arrangement and chip package using the same
    Publication number: 20070102794
    Abstract: A lead arrangement applied to the leadframe of a chip package is provided. The lead arrangement includes at least a pair of differential signal leads and at least a non-differential signal lead. The pair of differential signal leads includes a first differential signal lead and a second differential signal lead. The non-differential signal lead is disposed between the first differential signal lead and the second differential signal lead.
    Type: Application
    Filed: April 24, 2006
    Publication date: May 10, 2007
    Inventors: Chao-Yang Hsiao, Hsing-Chou Hsu