Abstract: A handheld electronic device including a first body, a second body, a linkage mechanism, and a stand is provided. The second body is slidingly disposed on the first body. The linkage mechanism is disposed between the first body and the second body. The linkage mechanism has a driven end and a drive end, wherein the driven end is driven by the first body and the second body. The stand is slidingly disposed between the first body and the second body and is driven by the drive end of the linkage mechanism. When the second body moves away the first body along an operation direction, the drive end drives the stand to move along the operation direction and the stand is exposed by the first body. The handheld electronic device then achieves a standing function through the stand.

Abstract: The present invention relates to an illuminant human interface device, and more particularly to a housing structure assembly. A housing structure assembly for carrying an input device includes a housing structure, a light source and an input device. The housing structure includes an input device carrying area and a light-transmissive layer. The light-transmissive layer has a light incident plane and a light exit plane, and the light exit plane is located in the input device carrying area. The light source is adjacent to the light incident plane, and the light source emits a light ray. The light ray enters the light-transmissive layer through the light incident plane and then exits the housing structure through the light exit plane. The input device is located on the light exit plane. The housing structure for carrying the input device provides a backlight for the input device after being combined with the light source, thus reducing the repair and replacement costs of the input device.

Abstract: A light-emitting touch keyboard includes a reflecting sheet, a touch element, a plurality of scattering/reflecting points, and at least one light emitting element. The touch element includes at least one transparent material layer. A light ray emitted by the light emitting element penetrates the transparent material layer, and then is reflected outside the touch element by the reflecting sheet and the plurality of scattering/reflecting points.

Abstract: This invention discloses a bit-stuffing method for crosstalk avoidance in high-speed buses, which comprises the steps of inputting a plurality of data bit streams in parallel to a data input buffer; the data input buffer sequentially inputting data bits of the data bit streams to a bit-switching unit, and the bit-switching unit switching the data bits to generate bit-switched data; parallelly inputting the bit-switched data to a bit-stuffing encoding unit; the bit-stuffing encoding unit performing bit-stuffing encoding on the bit-switched data to generate encoded data bits and inputting the encoded data bits to an encoded data buffer; and the encoded data buffer outputting the encoded data to a high-speed bus. The encoded data bits passed through the high-speed bus are decoded using a bit-removing method to recover the data bit streams.

Abstract: A handheld electronic device including a first body, a second body, a linkage mechanism, and a stand is provided. The second body is slidingly disposed on the first body. The linkage mechanism is disposed between the first body and the second body. The linkage mechanism has a driven end and a drive end, wherein the driven end is driven by the first body and the second body. The stand is slidingly disposed between the first body and the second body and is driven by the drive end of the linkage mechanism. When the second body moves away the first body along an operation direction, the drive end drives the stand to move along the operation direction and the stand is exposed by the first body. The handheld electronic device then achieves a standing function through the stand.

Abstract: A method for generating multiple windows frames, an electronic device thereof, and a computer program product using the method are provided. In the present method, first, a touch trajectory generated by continuously touching a touch panel of the electronic device is detected, wherein the center of the touch panel is a display area, and a non-display area surrounds the display area. Then, whether the touch trajectory is started from one side of the non-display area and passed through the display area to be extended to another side of the non-display area is determined. If so, the display area is split according to the touch trajectory to display at least two windows frames. As a result, an intuitional and convenient method for generating multiple windows frames in the display area is provided, and the operation of the electronic device is made very convenient.

Abstract: A mobile device having a user interface supporting multiple windows is disclosed. The user interface is suitable for use in any device having a handheld form factor, such as a mobile phone or mobile Internet device. The user interface includes two windows that are displayed on the mobile device's screen. The mobile device may be configured to switch between a single window mode and a dual window mode. The device may also be configured to launch applications in either mode. It may be configured to switch between modes automatically or in response to a user command. The windows may also be re-oriented in response to a change in the device's orientation or to a user's command.

Abstract: A method and an apparatus for dynamically adjusting a viewing angle of a screen are provided. The method is suitable for dynamically adjusting a viewing range of a screen of a handheld electronic device, wherein the viewing angle of the screen is adjustable. The method is as follows. First, a shifting value of a target deviating from the viewing range of the screen is detected by a sensor. Next, the viewing range of the screen is dynamically adjusted according to the shifting value, so as to cover the target within the viewing range of the screen. Accordingly, the snooping for the content of a frame displayed on the screen by others can be prevented and a user can view the frame displayed on the screen more conveniently.

Abstract: An electronic device includes a housing, a first display unit, a second display unit, a sensing input unit and a processor. The first display unit and the second display unit are both disposed on the housing. The sensing input unit is coupled to the first display unit and the second display unit, and is used for sensing and receiving a user input. The user input enables a transferring behavior of displaying a second object in the second display unit according to a first object displayed in the first display unit. The processor is coupled to the first display unit, the second display unit and the sensing input unit, and is used for controlling the second display unit according to the user input to display the second object.

Abstract: An electronic device includes a housing, a main display unit, an auxiliary display module and a processor. The main display unit and the auxiliary display module are both disposed on the housing. The auxiliary display module includes an auxiliary display unit and an input unit. The auxiliary display unit is used for displaying a user interface, and the input unit is used for receiving a user input. The processor is coupled to the input unit, and performs a corresponding function according to the user input.

Abstract: A navigation input mechanism is provided. The navigation input mechanism is disposed on an electronic device. The navigation input mechanism further includes a switch sheet and a biometric recognition module. The switch sheet has a first penetrating hole and includes a plurality of switches. The switches are disposed on an upper surface of the switch sheet and surround a peripheral region of the first penetrating hole. The biometric recognition module includes a sensing unit. The sensing unit, capable of reading a biometric recognition signal, is accommodated in the first penetrating hole, and the upper surface of the sensing unit is exposed outside the first penetrating hole.

Abstract: This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method.

Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Abstract: An image capture apparatus is provided. The apparatus includes an image capture, a memory unit, a sampling unit, and an image coder. The image capture captures a plurality of image data. The memory unit is coupled to the image capture and stores the image data output by the image capture. The sampling unit is coupled to the memory unit to sample the stored image data and outputs a sampling image data. The image coder is coupled to the sampling unit to code and compress the sampling image data.

Abstract: This invention discloses a chip heat dissipation system for chip heat dissipation and a manufacturing method and structure of heat dissipation device thereof. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. The heat dissipation device is used for receiving a waste heat from the chip, and the heat dissipation device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element; the heat exchange device is used for discharging the waste heat; the at least two pipes are used for connecting at least two joints of the heat dissipation device and the heat exchange device; and the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the at least two pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency.

Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from a chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the heat conduction efficiency. The corresponding manufacturing method for this heat conduction material can be made by chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and can also be mixed into the metal.

Abstract: This invention discloses a manufacturing method and the structure for a surface coating film on a heat dissipation metal. The surface coating film structure on the heat dissipation metal includes a heat dissipation metal and a thin film. The surface coating film structure on the heat dissipation metal is often used in dissipation the waste heat from the electronic apparatuses. The thin film is composed of a bracket structure of carbon element which has high thermal conductivity, so as to improve the efficiency of heat dissipation of the heat dissipation metal. The corresponding manufacturing method for the thin film can be made with chemical vapor deposition, physical vapor deposition or the other material preparation methods.

Abstract: This invention discloses a process method and structure for an adhesion material. The adhesion material is employed for a heat dissipation device that includes several heat sink fins, a heat dissipation slip and a heat pipe. The heat pipe connects several heat sink fins and a heat dissipation slip by the adhesion material. The metal is combed with a bracket structure of carbon element, which has high thermal conductivity, so as to improve the heat conduction efficiency; the adhesion material can be made. The corresponding process method for the adhesion material can be made with a mode of process to form melting stuff, including the metal and a bracket structure of carbon element, and then uses a mode of draw to form the adhesion material. The bracket structure of carbon element can be mixed into the metal.

Abstract: This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.

Abstract: This invention discloses a chip heat dissipation system for a chip in heat dissipating and a manufacturing method and a structure of heat dissipation device. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. This heat dissipation device is used for receiving waste heat generate from the chip, then heat exchange device is used for discharging waste heat. Moreover, the heat exchange device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element. Also, the pipes are used for connecting at least two connection ends of the heat dissipation device and the heat exchange device and then the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency.