Abstract: Embodiments provide a device structure and method of forming a device structure including an infill structure to capture solder materials within confines of openings of the infill structure. Metal pillars of one device can penetrate through a non-conductive film and contact solder regions of another device. A separate underfill is not needed.

Abstract: A communication method and communication system using two-dimensional primary synchronization signals are provided. The communication system includes a base station and a user equipment. The communication method includes: providing a two-dimensional synchronization array collection having a zero correlation zone; generating plural primary synchronization signals (PSSs) in accordance with the two-dimensional synchronization array collection; generating a synchronization signal block (SSB) in accordance with the primary synchronization signals, in which the synchronization signal block is adapted for new radio (NR) technology, and each one of the primary synchronization signals corresponds to plural orthogonal frequency division multiplexing (OFDM) symbols and plural subcarrier signals; and performing a communication operation by using the synchronization signal block.

Abstract: An electronic apparatus including a package substrate and a structure disposed on and electrically connected to the package substrate through conductive bumps is provided. The material of the conductive bumps includes a bismuth (Bi) containing alloy or an indium (In) containing alloy. In some embodiments, the bismuth (Bi) containing alloy includes Sn—Ag—Cu—Bi alloy. In some embodiments, a concentration of bismuth (Bi) contained in the Sn—Ag—Cu—Bi alloy ranges from about 1 wt % to about 10 wt %. Methods for forming the Sn—Ag—Cu—Bi alloy are also provided.

Abstract: A display apparatus and an fingerprint sensing method thereof are provided. A display panel of the display apparatus has a pixel circuit array, an in-display touch sensor array, and an in-display fingerprint sensor array. A driving circuit drives the in-display fingerprint sensor array to read a fingerprint image. A current display frame period is divided into a plurality of unit periods, each of the unit periods includes at least one fingerprint sensing period and one or both of a display driving period and a touch sensing period. The driving circuit resets a current fingerprint sensor in the in-display fingerprint sensor array during a first fingerprint sensing period among these fingerprint sensing periods of the first display frame period. The driving circuit reads a sensing result of the current fingerprint sensor during a second fingerprint sensing period succeeding to the first fingerprint sensing period.

Abstract: An adapter for a charging cradle includes: a perimeter wall defining a channel between first and second ends; a first device interface on an inner surface of the perimeter wall in communication with the first end, the first device interface configured to receive and align a first mobile device configuration with the charging cradle; a second device interface on the inner surface of the perimeter wall in communication with the second end, the second device interface configured to receive and align a second mobile device configuration with the charging cradle; a cradle interface on an outer surface of the perimeter wall, and configured to couple the adapter to the charging cradle in one of (i) a first orientation to expose a connector of the charging cradle via the first end of the channel, and (ii) a second orientation to expose the connector via the second end of the channel.

Abstract: An acoustic package structure includes a substrate, a covering structure and an acoustic chip. The covering structure is disposed on the substrate and has a plurality of first openings. The acoustic chip is disposed between the substrate and the covering structure, wherein the acoustic chip includes a membrane.

Abstract: An acoustic package structure includes a substrate, a covering structure and an acoustic chip. The covering structure is disposed on the substrate and has a plurality of first openings. The acoustic chip is disposed between the substrate and the covering structure, wherein the acoustic chip includes a membrane.

Abstract: An embodiment is a device including a substrate comprising conductive pads, a package component bonded to the conductive pads of the substrate with solder connectors, the package component comprising an integrated circuit die, the integrated circuit die comprising die connectors, one of the solder connectors coupled to each of the die connectors and a corresponding conductive pad of the substrate, a first dielectric layer laterally surrounding each of the die connectors and a portion of the solder connectors, and a second dielectric layer being between the first dielectric layer and the substrate, the second dielectric layer laterally surrounding each of the conductive pads of the substrate.

Abstract: A semiconductor device includes a fin extending from a substrate and including a first fin end, a separation structure separating the first fin end from an adjacent fin end of another fin, a dummy gate spacer along sidewalls of the separation structure and the fin, a first epitaxial source/drain region in the fin and adjacent the separation structure, and a residue of a dummy gate material in a corner region between the dummy gate spacer and the first fin end. The first fin end protrudes from the dummy gate spacer into the separation structure. The residue of the dummy gate material separates the first epitaxial source/drain region from the separation structure and is triangle shaped.

Abstract: A backlight keyboard includes a first keyswitch, a first backlight source, a light guide plate and a first board having first and second holes. The light guide plate is applied to the backlight keyboard and a second backlight keyboard including a second keyswitch, a second backlight source and a second board having third and fourth holes. The second keyswitch on the second backlight keyboard is shifted transversely relative to the first keyswitch on the backlight keyboard to make the first and fourth holes have a first overlapping area. The light guide plate has a first dot structure corresponding to the first and third holes and a second dot structure corresponding to the second and fourth holes except the first overlapping area for guiding light to symbols on the first and second keyswitches. The first dot structure is less than the second dot structure in dot intensity.

Abstract: A radio frequency (RF) communication assembly includes an RF communication circuit and a compensator apparatus. The compensator apparatus receives an input including an I-component of a pre-compensated signal, a Q-component of the pre-compensated signal, and encoded operating conditions of the RF communication circuit. The RF communication circuit includes RF circuit components causing signal impairments. The compensator apparatus perform neural network computing on the input, and the RF communication assembly generates a compensated output signal that compensates for at least a portion of the signal impairments.

Abstract: A lighting keyboard includes a backlight module and at least one keyswitch. The backlight module includes a lighting unit, a light guide panel, and a lighting board for illuminating a keycap of the keyswitch. The light guide panel includes a panel hole to accommodate the lighting unit. The light guide panel further includes plural slots intervally surrounding the lighting unit. The lighting board includes a micro-structure region facing toward the light guide panel. Each of the slots of the light guide panel has a bulge portion protruding to the lighting unit. At two sides of the bulge portion, each of the slots forms two slots walls with an obtuse angle, thereby expanding the transmitting angle for the multi-color lights from the lighting unit and enhancing the light-mixing uniformity while illuminating the keycap.

Abstract: A backlit-module-embedded illuminated keyswitch structure includes a baseplate, a mask film disposed below the baseplate and having a first coating for substantially reflecting a light and a second coating for substantially blocking the light, a light guide sheet at one side of the mask film and having a light source hole, and a reflective layer at one side of the light guide sheet opposite to the mask film. The second coating includes a second main coating region and a plurality of second coating sub-regions, which extends outward from the second main coating region and is arranged along the periphery of the second main coating region to form a plurality of intermediary regions therebetween. The first coating and the second coating are disposed right above the light source hole. The first coating is at least partially located in the intermediary regions.

Abstract: A back light module is applied to a lighting keyboard with a plurality of keyswitches and includes a lighting unit, a light guide plate, a light penetrating membrane, a light calibration layer and an adhering component. The light guide plate has an opening used to accommodate the lighting unit. The light penetrating membrane is located on the light guide plate. The light penetrating membrane is located on the light penetrating membrane and has a second contour. The adhering component is located between the light guide plate and the light penetrating membrane, and has a first contour greater than the second contour. The adhering component includes a front region, a rear region and a hollow region. The front region is covered by the light calibration layer. The rear region is partly covered or not covered by the light calibration layer. The hollow region corresponds to and is larger than the opening.

Abstract: An acoustic device includes a first sound producing component and a back cavity structure. The first sound producing component has a first front side and a first back side, wherein the first sound producing component is a high frequency sound unit, and the first front side faces a sound propagating opening of the acoustic device. The back cavity structure is connected to the first back side of the first sound producing component. The first sound producing component produces a first acoustic wave from the first front side towards the sound propagating opening, and the first sound producing component produces a second acoustic wave from the first back side towards a back cavity of the back cavity structure. The back cavity structure is configured to flatten a peak or a dip of a frequency response of the first sound producing component.

Abstract: An acoustic device includes a first sound producing component and a back cavity structure. The first sound producing component has a first front side and a first back side, wherein the first sound producing component is a high frequency sound unit, and the first front side faces a sound propagating opening of the acoustic device. The back cavity structure is connected to the first back side of the first sound producing component. The first sound producing component produces a first acoustic wave from the first front side towards the sound propagating opening, and the first sound producing component produces a second acoustic wave from the first back side towards a back cavity of the back cavity structure. The back cavity structure is configured to flatten a peak or a dip of a frequency response of the first sound producing component.

Abstract: A lighting keyboard includes a backlight module and at least one keyswitch. The backlight module includes a lighting unit, a light guide panel, and a lighting board for illuminating a keycap of the keyswitch. The light guide panel includes a panel hole to accommodate the lighting unit. The light guide panel further includes plural slots intervally surrounding the lighting unit. The lighting board includes a micro-structure region facing toward the light guide panel. Each of the slots of the light guide panel has a bulge portion protruding to the lighting unit. At two sides of the bulge portion, each of the slots forms two slots walls with an obtuse angle, thereby expanding the transmitting angle for the multi-color lights from the lighting unit and enhancing the light-mixing uniformity while illuminating the keycap.

Abstract: A backlight keyswitch includes a backlight module and a keyswitch body having a cap with a symbol. The backlight module disposed under the cap includes a light guide plate, a light-blocking sheet, a backlight circuit board having first, third, and second lighting units disposed in the light guide plate and arranged sequentially along a longitudinal direction for emitting first, third, and second color lights respectively, and a micro optical layer. The light-blocking sheet is located above the backlight circuit board and has a transparent region. The light guide plate is located between the light-blocking sheet and the backlight circuit board. The micro optical layer is parallel to the light guide plate and formed corresponding to the transparent region to guide the first, second, and third color lights to the symbol and has first and second clearance regions respectively adjacent to the first and second lighting units in the longitudinal direction.

Abstract: A backlight keyswitch includes a board, a backlight module and a keyswitch body having a cap with a symbol formed thereon. The backlight module disposed under the cap includes first and second ink layers, a light guide plate, a light-blocking sheet having a transparent region corresponding to the cap, and a backlight circuit board having first, third, and second lighting units disposed in the light guide plate and arranged sequentially along a longitudinal direction for emitting first, third, and second color lights respectively to be incident to the transparent region after light mixing. The first and second ink layers are formed on the light-blocking sheet and located outside the first and second lighting units. Colors of the first and second ink layers at least correspond to colors of the second and first color lights respectively to achieve a mixed color.

Abstract: A backlight keyswitch includes a keycap, a support plate, a membrane circuit board and a backlight module. The support plate is disposed under the keycap. The membrane circuit board is disposed in parallel to the keycap and the support plate. The backlight module is disposed under the support plate, which includes a shielding sheet, a light guide panel, a lighting board and a protrusion structure. The shielding sheet includes a light permeable area corresponding to the keycap. The light guide panel is disposed under the shielding sheet. The lighting board is disposed under the light guide panel and includes a light source. The protrusion structure protrudes toward the light source and is formed on one of the support plate, the membrane circuit board and the shielding sheet. The protrusion structure reflects at least partial light of the light source to enter the light guide panel for lateral transmission.