Patents by Inventor Chao Yuan Wang

Chao Yuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166622
    Abstract: Disclosed are compounds, compositions, and methods for treating diseases, disorders, or medical conditions that are affected by the modulation of DHODH. Such compounds are represented by Formula (I) as follows: wherein X, Y, R1a, R1b, Z1, Z2, Z3, R2, and R3, are defined herein.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 23, 2024
    Inventors: Justin Cisar, Scott Kuduk, Aihua Wang, Zhuming Zhang, Chao-yuan Wang
  • Publication number: 20220323455
    Abstract: The application describes fused heterocycle derivative compounds, pharmaceutical compositions comprising these compounds, chemical processes for preparing these compounds and their use in the treatment of diseases associated with HBV infection.
    Type: Application
    Filed: May 27, 2020
    Publication date: October 13, 2022
    Inventors: Scott D. KUDUK, Lindsey Graham DERATT, Chao-Yuan WANG, Jan Martin BERKE
  • Publication number: 20220089568
    Abstract: Disclosed are compounds, compositions and methods for treating diseases, disorders, or medical conditions that are affected by the modulation of DHODH. Such compounds are represented by Formula (I) as follows: wherein R1a, R1b, R2, and R3, are defined herein.
    Type: Application
    Filed: January 10, 2020
    Publication date: March 24, 2022
    Inventors: Justin Cisar, Scott Kuduk, Chao-yuan Wang, Yvan Rene Ferdinand Simonnet, Colleen Elizabeth Keohane, Edgar Jacoby
  • Publication number: 20180207901
    Abstract: The present invention provides a heat spreading structure comprising a first conductive layer and a composite layer that sequentially comprises a structured adhesive layer and a second conductive layer having a coating on the first conductive layer, wherein the structured adhesive layer comprises at least one polymeric region and at least one void region. The composite layer further has a grounding opening exposing a part of the first conductive layer for grounding purposes. The present invention also provides a heat spreading tape and a method for forming the same.
    Type: Application
    Filed: July 20, 2015
    Publication date: July 26, 2018
    Inventors: Pei Tien, Chao-Yuan Wang, Ching-Yi Liu
  • Patent number: 9353245
    Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 31, 2016
    Assignee: 3M Innovative Properties Company
    Inventors: Pei Tien, Chao-Yuan Wang, Mei-Chin Liao, Wei-Yu Chen
  • Publication number: 20160120068
    Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.
    Type: Application
    Filed: May 12, 2014
    Publication date: April 28, 2016
    Inventors: Pei Tien, Mihee Lee, Chao-Yuan Wang, Han-Yi Chung, Ching-Yi Liu, Kuo-Chung Lin, Wei-Yu Chen
  • Publication number: 20160046791
    Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 18, 2016
    Inventors: Pei Tien, Chao-Yuan Wang, Mei-Chin Liao, Wei-Yu Chen
  • Publication number: 20140240928
    Abstract: A thermally conductive grease includes a carrier oil, at least one dispersant, and thermally conductive particles. The thermally conductive particles have a D50 (Vol. Average) particle size of no greater than about 11 microns and the thermally conductive particles in the thermally conductive grease contain less than 3% by volume of particles having a particle size of 0.7 microns or less, based on the total volume of thermally conductive particles in the thermally conductive grease.
    Type: Application
    Filed: September 28, 2012
    Publication date: August 28, 2014
    Inventors: Pei Tien, Chia Hui Lin, Chao-Yuan Wang, Ravi K. Sura
  • Patent number: 5487018
    Abstract: A physical information database is utilized as an interface between a datapath cell library and a number of electronic design automation tools, such as a datapath synthesis tool, a chip estimator, an HDL generation tool, and a datapath compilation tool. The physical information database includes global parameters applicable to every cell in the datapath cell library and local parameters defining attributes that are associated with individual cells in the datapath cell library. The physical information database includes a standard format allowing uniform access by the electronic design automation tools.
    Type: Grant
    Filed: August 13, 1993
    Date of Patent: January 23, 1996
    Assignee: VLSI Technology, Inc.
    Inventors: Joann Loos, Chao-Yuan Wang, Mossaddeg Mahmood
  • Patent number: D439895
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: April 3, 2001
    Assignee: Enlight Corporation
    Inventor: Chao Yuan Wang
  • Patent number: D692011
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 22, 2013
    Assignee: Esoterism Co. Ltd.
    Inventors: Da-chung Wu, An-Tung Su, Chih-Yao Lin, Chao-Yuan Wang