Abstract: Chip packages and methods for forming the same are provided. The chip package includes a substrate having a stepped sidewall, a first surface, and a second surface. The first surface and the second surface are opposite each other. The first surface and the second surface adjoin the stepped sidewall. The chip package also includes a capping layer having a first surface and a second surface opposite each other. The first surface of the capping layer faces the second surface of the substrate. The chip package further includes a dam structure and an adhesive layer. The dam structure bonds the capping layer to the substrate, and surrounds a sensing region in the substrate. The adhesive layer surrounds the dam structure and has a concave-tapered sidewall that extends along the outer edge of the dam structure in the direction from the second surface of the substrate to the capping layer.

Abstract: A ratchet wrench tool set includes a box, tool bits receivable in the box, two side boards mounted to two sides of the box, and a ratcheting device. The ratcheting device includes a rotary connection plate to which a ratcheting head is mounted. The rotary connection plate is rotatably mounted to the two side boards and rotatable between an operation position and a storage position and includes a constraint step section. The slidable constraint cover has a front end that forms a constraint projection section and is slidably mounted between the two side boards. When the slidable constraint cover is moved frontwards, the constraint projection section engages the constraint step section to retain the ratcheting device in the operation position and when the slidable constraint cover is moved rearward, the constraint projection section disengages from the constraint step section to allow the ratcheting device to rotate to the storage position.

Abstract: A ratchet wrench tool set includes a box, tool bits receivable in the box, two side boards mounted to two sides of the box, and a ratcheting device. The ratcheting device includes a rotary connection plate to which a ratcheting head is mounted. The rotary connection plate is rotatably mounted to the two side boards and rotatable between an operation position and a storage position and includes a constraint step section. The slidable constraint cover has a front end that forms a constraint projection section and is slidably mounted between the two side boards. When the slidable constraint cover is moved frontwards, the constraint projection section engages the constraint step section to retain the ratcheting device in the operation position and when the slidable constraint cover is moved rearward, the constraint projection section disengages from the constraint step section to allow the ratcheting device to rotate to the storage position.

Abstract: The transformer has a bobbin, a coil assembly and a magnetic core assembly. The bobbin is mounted in the magnetic core assembly and has multiple connecting pins being formed on at least one side of a bottom surface of the bobbin. Each connecting pin has a top surface as a soldering surface that corresponds to a solder pad on a back of a circuit board. At least one fastener is further formed on the bottom surface of the circuit board. Therefore, when the transformer is mounted through the circuit board, the connecting pins are soldered on the back of the circuit board to reduce the total thickness of the combination of the transformer and the circuit board.

Abstract: The transformer has a bobbin, a coil assembly and a magnetic core assembly. The bobbin is mounted in the magnetic core assembly and has multiple connecting pins being formed on at least one side of a bottom surface of the bobbin. Each connecting pin has a top surface as a soldering surface that corresponds to a solder pad on a back of a circuit board. At least one fastener is further formed on the bottom surface of the circuit board. Therefore, when the transformer is mounted through the circuit board, the connecting pins are soldered on the back of the circuit board to reduce the total thickness of the combination of the transformer and the circuit board.