Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.

Abstract: SRAM designs based on GAA transistors are disclosed that provide flexibility for increasing channel widths of transistors at scaled IC technology nodes and relax limits on SRAM performance optimization imposed by FinFET-based SRAMs. GAA-based SRAM cells described have active region layouts with active regions shared by pull-down GAA transistors and pass-gate GAA transistors. A width of shared active regions that correspond with the pull-down GAA transistors are enlarged with respect to widths of the shared active regions that correspond with the pass-gate GAA transistors. A ratio of the widths is tuned to obtain ratios of pull-down transistor effective channel width to pass-gate effective channel width greater than 1, increase an on-current of pull-down GAA transistors relative to an on-current of pass-gate GAA transistors, decrease a threshold voltage of pull-down GAA transistors relative to a threshold voltage of pass-gate GAA transistors, and/or increases a ? ratio of an SRAM cell.

Abstract: Chip packages and methods for forming the same are provided. The chip package includes a substrate having a stepped sidewall, a first surface, and a second surface. The first surface and the second surface are opposite each other. The first surface and the second surface adjoin the stepped sidewall. The chip package also includes a capping layer having a first surface and a second surface opposite each other. The first surface of the capping layer faces the second surface of the substrate. The chip package further includes a dam structure and an adhesive layer. The dam structure bonds the capping layer to the substrate, and surrounds a sensing region in the substrate. The adhesive layer surrounds the dam structure and has a concave-tapered sidewall that extends along the outer edge of the dam structure in the direction from the second surface of the substrate to the capping layer.

Abstract: A ratchet wrench tool set includes a box, tool bits receivable in the box, two side boards mounted to two sides of the box, and a ratcheting device. The ratcheting device includes a rotary connection plate to which a ratcheting head is mounted. The rotary connection plate is rotatably mounted to the two side boards and rotatable between an operation position and a storage position and includes a constraint step section. The slidable constraint cover has a front end that forms a constraint projection section and is slidably mounted between the two side boards. When the slidable constraint cover is moved frontwards, the constraint projection section engages the constraint step section to retain the ratcheting device in the operation position and when the slidable constraint cover is moved rearward, the constraint projection section disengages from the constraint step section to allow the ratcheting device to rotate to the storage position.

Abstract: A ratchet wrench tool set includes a box, tool bits receivable in the box, two side boards mounted to two sides of the box, and a ratcheting device. The ratcheting device includes a rotary connection plate to which a ratcheting head is mounted. The rotary connection plate is rotatably mounted to the two side boards and rotatable between an operation position and a storage position and includes a constraint step section. The slidable constraint cover has a front end that forms a constraint projection section and is slidably mounted between the two side boards. When the slidable constraint cover is moved frontwards, the constraint projection section engages the constraint step section to retain the ratcheting device in the operation position and when the slidable constraint cover is moved rearward, the constraint projection section disengages from the constraint step section to allow the ratcheting device to rotate to the storage position.

Abstract: The transformer has a bobbin, a coil assembly and a magnetic core assembly. The bobbin is mounted in the magnetic core assembly and has multiple connecting pins being formed on at least one side of a bottom surface of the bobbin. Each connecting pin has a top surface as a soldering surface that corresponds to a solder pad on a back of a circuit board. At least one fastener is further formed on the bottom surface of the circuit board. Therefore, when the transformer is mounted through the circuit board, the connecting pins are soldered on the back of the circuit board to reduce the total thickness of the combination of the transformer and the circuit board.

Abstract: The transformer has a bobbin, a coil assembly and a magnetic core assembly. The bobbin is mounted in the magnetic core assembly and has multiple connecting pins being formed on at least one side of a bottom surface of the bobbin. Each connecting pin has a top surface as a soldering surface that corresponds to a solder pad on a back of a circuit board. At least one fastener is further formed on the bottom surface of the circuit board. Therefore, when the transformer is mounted through the circuit board, the connecting pins are soldered on the back of the circuit board to reduce the total thickness of the combination of the transformer and the circuit board.