Abstract: A method for manufacturing semiconductor device may include the following steps: performing an etching process to remove a sacrificial layer from a first composite structure, wherein the first composite structure includes a first substrate structure; performing a heat treatment to release a gas from the first composite structure; performing a cleaning process to remove an oxide layer from the first composite structure; and combining the first composite structure with a second composite structure that includes a second substrate structure and an electronic component positioned on the second substrate substructure, such that the first substrate structure is combined with the second substrate structure to form an enclosure structure that encloses the electronic component.

Abstract: A semiconductor device includes a bottom substrate, wherein a front-end device including a microelectromechanical systems (MEMS) device and an inductor is disposed on the bottom substrate, and a top substrate bonded to the bottom substrate so as form a cavity enclosing the front-end device. The semiconductor device further includes an adsorption layer disposed on a portion of the top substrate facing the front-end device, wherein the adsorption layer and the inductor do not overlap in a vertical direction.

Abstract: Embodiments of translation verification testing are provided. An aspect includes reading a symbol table and a syntax tree to which source code corresponds. Widget objects and widget object methods are obtained in the symbol table. The widget objects and widget object methods are organized into a widget structure tree according to a code calling order in the syntax tree. An index file corresponding to the source code is generated by using the symbol table, the widget structure tree and resource files, where the index file records relationships between the widget objects.

Abstract: A semiconductor device may include an enclosure structure. The semiconductor device may further include a getter for absorb gas molecules. The getter may be positioned (and enclosed) inside the enclosure structure and may overlap a first portion of a surface of the enclosure structure. The semiconductor device may further include an inductor. The inductor may be positioned (and enclosed) inside the enclosure structure and may overlap a second portion of the surface of the enclosure structure without overlapping the getter in a direction perpendicular to the first surface of the enclosure structure.

Abstract: A method for forming, a MEMS device is provided, The method includes providing a first wafer and a second wafer. The first wafer has a trench on a top surface of the first wafer and a fixed electrode on the bottom of the trench, and the second wafer has a polishing stop layer, a sacrificial layer, and a movable electrode. The method also includes bonding the first wafer and the second wafer with the top surface of the first wafer facing the top surface of Me second wafer and the movable electrode on the second wafer located above the trench on the first wafer; removing the second wafer by polishing the second wafer from a backside of the second wafer until reaching the polishing stop layer; and releasing the movable electrode by removing a portion of the polishing stop layer and the sacrificial layer to form the MEMS device.

Abstract: A semiconductor device may include an enclosure structure. The semiconductor device may further include a getter for absorb gas molecules. The getter may be positioned (and enclosed) inside the enclosure structure and may overlap a first portion of a surface of the enclosure structure. The semiconductor device may further include an inductor. The inductor may be positioned (and enclosed) inside the enclosure structure and may overlap a second portion of the surface of the enclosure structure without overlapping the getter in a direction perpendicular to the first surface of the enclosure structure.

Abstract: A method of fabricating a micro electrical-mechanical system (MEMS) microphone on a substrate includes forming a sacrificial layer on a front surface of the substrate, forming a membrane within the sacrificial layer, forming a fixed plate on the sacrificial layer at a location corresponding to a location of the membrane, performing a laser cutting on the back surface of the substrate at a location corresponding to an edge region of the fixed plate until a surface of the sacrificial layer is expose to form an opening, forming a patterned photoresist layer on the back surface exposing a region within the boundary of the opening, removing a portion of the back surface using the patterned photoresist layer as a mask to form a cavity, and removing a portion of the sacrificial layer above and below the membrane to form an air gap between the membrane and the fixed plate.

Abstract: A semiconductor device includes a bottom substrate, wherein a front-end device including a microelectromechanical systems (MEMS) device and an inductor is disposed on the bottom substrate, and a top substrate bonded to the bottom substrate so as form a cavity enclosing the front-end device. The semiconductor device further includes an adsorption layer disposed on a portion of the top substrate facing the front-end device, wherein the adsorption layer and the inductor do not overlap in a vertical direction.

Abstract: A method for manufacturing semiconductor device may include the following steps: performing an etching process to remove a sacrificial layer from a first composite structure, wherein the first composite structure includes a first substrate structure; performing a heat treatment to release a gas from the first composite structure; performing a cleaning process to remove an oxide layer from the first composite structure; and combining the first composite structure with a second composite structure that includes a second substrate structure and an electronic component positioned on the second substrate substructure, such that the first substrate structure is combined with the second substrate structure to form an enclosure structure that encloses the electronic component.

Abstract: A semiconductor device may include an enclosure structure. The semiconductor device may further include a getter for absorb gas molecules. The getter may be positioned (and enclosed) inside the enclosure structure and may overlap a first portion of a surface of the enclosure structure. The semiconductor device may further include an inductor. The inductor may be positioned (and enclosed) inside the enclosure structure and may overlap a second portion of the surface of the enclosure structure without overlapping the getter in a direction perpendicular to the first surface of the enclosure structure.

Abstract: A wafer processing method is provided. The method includes providing a to-be-processed wafer having a first surface with a plurality of the device regions and dicing groove regions between adjacent device regions and a second surface; and providing a capping wafer having a first surface and a second surface. The method also includes bonding the first surface of the capping wafer with the first surface of the to-be-processed wafer. Further, the method includes performing an edge trimming process onto the to-be-processed wafer to cause a radius of the to-be-processed wafer to be smaller than a radius of the capping wafer; and grinding the second surface of the capping wafer. Further, the method also includes cleaning the second surface of the capping wafer; and etching a portion of the grinded and cleaned capping wafer to expose the dicing groove regions on the first surface of the to-be-processed wafer.

Abstract: Aspects include controlling asynchronous call return in a program. At least one asynchronous call is detected in the program. Execution of the program is stopped at a breakpoint in response to detecting that the breakpoint is set in the program. At least one callback corresponding to the at least one asynchronous call is obtained. The at least one callback is inserted into one or more specified positions of the program respectively according to a user selection. Execution of the program continues from the breakpoint in response to the insertion of the at least one callback into the program.

Abstract: A carbon product is made of mesocarbon microbeads and graphite. Preferably, the weight percent of mesocarbon microbeads is 50-99% and the weight percent of graphite is 1-50%. Preferably, when the graphite is carbon-graphite, the carbon product has a density in the range of 1.6-1.8 g/cm3 and a resistivity in the range of 2000-8000 ??·cm. Preferably, when the graphite is electro-graphite, the carbon product has a density in the range of 1.85-1.95 g/cm3 and a resistivity in the range of 500-2000 ??·cm. The carbon product may be a carbon brush, a carbon bearing, a carbon seal or a brush contact member for a commutator of an electric motor.

Abstract: Embodiments of this disclosure belong to the data processing field and disclose a method and apparatus for data transmission. The method comprises sending a first request to a server in response to a first file locally cached having expired. The first request is for obtaining a first file in a new version, and the first request containing a first version identifier. The first version identifier being for indicating a version of the first file locally cached. Receiving a first response includes difference information and a second version identifier. The difference information makes it possible to obtain the first file in the new version based on the first file locally cached, and the second version identifier is for indicating the new version. The first file in the new version is obtained based on the difference information and the first file locally cached. Using the technical solution provided by the present embodiment(s), pressures on network transmission are reduced.

Abstract: Techniques are described for copying data using a throttling mechanism to achieve a desired time delay. A request is received to copy a data portion from a source location of a first physical device to a target location of a second physical device. A desired average delay time is determined in accordance with a plurality of values including a throttle value affecting a rate at which data is copied from the source location to the target location. The request is partitioned into subrequests. The data portion is partitioned into a subportions. Each of the subrequests copies one of the subportions. The subrequests are performed whereby a time delay is introduced between at least two of the plurality of subrequests and whereby an average time delay with respect to each pair of consecutively issued subrequests is the desired average time delay.

Abstract: Embodiments of this disclosure belong to the data processing field and disclose a method and apparatus for data transmission. The method comprises sending a first request to a server in response to a first file locally cached having expired. The first request is for obtaining a first file in a new version, and the first request containing a first version identifier. The first version identifier being for indicating a version of the first file locally cached. Receiving a first response includes difference information and a second version identifier. The difference information makes it possible to obtain the first file in the new version based on the first file locally cached, and the second version identifier is for indicating the new version. The first file in the new version is obtained based on the difference information and the first file locally cached. Using the technical solution provided by the present embodiment(s), pressures on network transmission are reduced.

Abstract: A carbon commutator, for an electric motor, has a plurality of segments forming a brush contact surface and a hub supporting the segments. Each segment has a connector having a terminal for connection of a lead wire, a carbon layer forming the brush contact surface, and a connecting layer fixed to the carbon layer and electrically connecting the carbon layer to the connector. A plurality of micro structures is formed at the interface between the connecting layer and the carbon layer.

Abstract: Embodiments of translation verification testing are provided. An aspect includes reading a symbol table and a syntax tree to which source code corresponds. Widget objects and widget object methods are obtained in the symbol table. The widget objects and widget object methods are organized into a widget structure tree according to a code calling order in the syntax tree. An index file corresponding to the source code is generated by using the symbol table, the widget structure tree and resource files, where the index file records relationships between the widget objects.

Abstract: A multi-layer brush for making sliding contact with a commutator of an electric motor, includes a body and a shunt. The body includes a first electrically conductive layer, a second electrically conductive layer, and a partition layer disposed between the first and second conductive layers and electrically separating the first and second conductive layers. The shunt is coupled to the first conductive layer. The first conductive layer has a thickness greater than a thickness of the second conductive layer and the partition layer has a lateral leakage resistance greater than the longitudinal resistance of the first and second conductive layers.

Abstract: Aspects include controlling asynchronous call return in a program. At least one asynchronous call is detected in the program. Execution of the program is stopped at a breakpoint in response to detecting that the breakpoint is set in the program. At least one callback corresponding to the at least one asynchronous call is obtained. The at least one callback is inserted into one or more specified positions of the program respectively according to a user selection. Execution of the program continues from the breakpoint in response to the insertion of the at least one callback into the program.