Patents by Inventor Chaochao DUN

Chaochao DUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nanocomposite comprising semiconductor and metal nanoparticles, and assemblies
    Patent number: 11631795
    Abstract: Composite nanoparticle compositions and associated nanoparticle assemblies are described herein which, in some embodiments, exhibit enhancements to one or more thermoelectric properties including increases in electrical conductivity and/or Seebeck coefficient and/or decreases in thermal conductivity. In one aspect, a composite nanoparticle composition comprises a semiconductor nanoparticle including a front face and a back face and sidewalls extending between the front and back faces. Metallic nanoparticles are bonded to at least one of the sidewalls establishing a metal-semiconductor junction.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: April 18, 2023
    Inventors: David L. Carroll, Chaochao Dun, Corey Hewitt, Robert Summers
  • COMPOSITE NANOPARTICLE COMPOSITIONS AND ASSEMBLIES
    Publication number: 20230110366
    Abstract: Composite nanoparticle compositions and associated nanoparticle assemblies exhibit enhancements to one or more thermoelectric properties including increases in electrical conductivity and/or Seebeck coefficient and/or decreases in thermal conductivity. A composite nanoparticle composition comprises a semiconductor nanoparticle including a front face and a back face and sidewalls extending between the front and back faces. Metallic nanoparticles are bonded to at least one of the sidewalls establishing a metal-semiconductor junction.
    Type: Application
    Filed: July 1, 2022
    Publication date: April 13, 2023
    Inventors: David L. CARROLL, Chaochao DUN, Corey HEWITT, Robert SUMMERS
  • COMPOSITE NANOPARTICLE COMPOSITIONS AND ASSEMBLIES
    Publication number: 20200013939
    Abstract: Composite nanoparticle compositions and associated nanoparticle assemblies are described herein which, in some embodiments, exhibit enhancements to one or more thermoelectric properties including increases in electrical conductivity and/or Seebeck coefficient and/or decreases in thermal conductivity. In one aspect, a composite nanoparticle composition comprises a semiconductor nanoparticle including a front face and a back face and sidewalls extending between the front and back faces. Metallic nanoparticles are bonded to at least one of the sidewalls establishing a metal-semiconductor junction.
    Type: Application
    Filed: February 16, 2018
    Publication date: January 9, 2020
    Inventors: David L. CARROLL, Chaochao DUN, Corey HEWITT, Robert SUMMERS