Abstract: A memory device is provided. The memory device includes a memory cell array having a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of columns include a first plurality of memory cells connected to a first bit line and a second bit line. A pre-charge circuit is connected to the memory cell array. The pre-charge circuit pre-charges each of the first bit line and the second bit line from a first end. A pre-charge assist circuit is connected to the memory cell array. The pre-charge assist circuit pre-charges each of the first bit line and the second bit line from a second end, the second end being opposite the first end.

Abstract: A semiconductor device includes a first semiconductor fin that is formed over a substrate and extends along a first lateral axis. The semiconductor device includes a second semiconductor fin that is also formed over the substrate and extends along the first lateral axis. At least a tip portion of the first semiconductor fin and at least a tip portion of the second semiconductor fin bend toward each other along a second lateral axis that is perpendicular to the first lateral axis.

Abstract: A memory device is provided. The memory device includes a memory cell array having a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of columns include a first plurality of memory cells connected to a first bit line and a second bit line. A pre-charge circuit is connected to the memory cell array. The pre-charge circuit pre-charges each of the first bit line and the second bit line from a first end. A pre-charge assist circuit is connected to the memory cell array. The pre-charge assist circuit pre-charges each of the first bit line and the second bit line from a second end, the second end being opposite the first end.

Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: A method for signal optimization between a user equipment and a reconfigurable intelligence surface includes a phase optimization step having: generating at least one modified phase combination in the state that a performance index of a current phase combination is smaller than a preset performance threshold value; evaluating whether a corresponding performance index of the modified phase combination is not smaller than the preset performance threshold value or evaluating whether the performance index of the modified phase combination is larger than the corresponding performance index of the current phase combination, to determine an optimized phase combination, enabling a corresponding performance index to be not smaller than the preset performance threshold value or not smaller than the performance index of any modified phase combination in the phase optimization step; and replacing the current phase combination by the optimized phase combination to form an updated current phase combination.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.

Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.

Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.

Abstract: A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

Abstract: An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.

Abstract: A heat pipe (10) includes a metal casing (12) having an evaporator section (121) and a condenser section (122). A major wick structure (14) is disposed on an inner wall of the casing. At least one assistant wick structure (16) is disposed in and contacts with the major wick structure, and working medium fills in the casing and saturates the major wick structure and the at least one assistant wick structure. An average pore size of the major wick structure corresponding to the evaporator section is smaller than that of the major wick structure corresponding to the condenser section. A diameter of a cross section of the at least one assistant wick structure is smaller than a diameter of a cross section of the major wick structure, and thus the at least one assistant wick structure has a linear contact with the major wick structure.

Abstract: A heat pipe (10) includes a casing (11) and a composite wick structure (14). The casing includes an evaporator section (15) and a condenser section (16). The wick structure includes a plurality of grooves (142, 143) and an artery mesh (145). The grooves at the evaporator section each have a smaller groove width and a smaller apex angle (A1) than those of each of the grooves at the condenser section. A method for manufacturing the heat pipe includes: providing a casing with a plurality of grooves axially defined therein; shrinking a diameter of one portion of the casing to obtain an evaporator section of the heat pipe; placing an artery mesh to contact with an inner wall of the casing; vacuuming the casing and placing a working fluid in the casing; sealing the casing to obtain the heat pipe.

Abstract: A heat dissipation apparatus includes a heat sink (30) and a heat spreader (10). The heat spreader includes a heating area (11) and a cooling area (13), and defines a vapor chamber (16) therein. A plurality of artery meshes (151) are arranged in the vapor chamber and extend from the heating area towards the cooling area. A working medium is contained in the artery meshes. The artery meshes are located between wick structures (15a, 15b) attached to a top cover (14) and a base plate (12) of the heat spreader, respectively, and contact therewith.

Abstract: A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Abstract: An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

Abstract: A heat pipe (10) includes a casing (11), a plurality of grooves (12, 13) defined in the casing, and working fluid contained in the casing. The casing includes a first portion (14) and a second portion (15) having a smaller diameter than the first portion. The grooves (12) at the first portion of the casing have greater apex angles and smaller groove width than those of the grooves (13) at the second portion. A method for manufacturing the heat pipe includes the steps of: providing a casing with a plurality of grooves defined in an inner wall thereof; shrinking a diameter of one portion of the casing to enable the portion to function as an evaporator section of the heat pipe; vacuuming and placing a predetermined quantity of working fluid in the casing; sealing the casing to obtain the heat pipe.