Patents by Inventor Chao-Hong Wang

Chao-Hong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of soldering component to substrate and electronic device made by the same
    Publication number: 20070262121
    Abstract: A method for soldering an electronic component to a substrate is provided. The method includes the steps of forming a metal layer on the substrate; applying a solder material on the metal layer; and performing a thermal process to transfer the solder material into a solder joint so as to connect the electronic component with the substrate. During the thermal process, a portion of the metal layer is introduced into the solder joint, thereby elevating the eutectoid temperature of the solder joint. This invention also provides an electronic device made by this method.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 15, 2007
    Inventors: Sinn-Wen Chen, Chao-Hong Wang, Po-Yin Chen, Zhien-Chi Chen