Patents by Inventor Chaomin GAO

Chaomin GAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting unit and display device
    Patent number: 10223963
    Abstract: The present disclosure provides a light-emitting unit and a display device. The light-emitting includes a micro-LED element and a bonding pad. The micro-LED element includes an element pin, the bonding pad includes a bonding pin, in each welding pair of the element pin and the bonding pin, a length of the element pin is greater than a width of the bonding pin, and a non-zero angle is formed between the extending direction of the element pin and the extending direction of the bonding pin. When the element pin is deviated from the bonding pin in a certain range, the element pin can still be aligned accurately with the bonding pin. Thus, a requirement on the alignment precision between the micro-LED element and the bonding pad is lowered in a certain extent, thereby improving the yield.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: March 5, 2019
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Chaomin Gao, Yuan Ding, Fei Li
  • LIGHT-EMITTING UNIT AND DISPLAY DEVICE
    Publication number: 20190019447
    Abstract: The present disclosure provides a light-emitting unit and a display device. The light-emitting includes a micro-LED element and a bonding pad. The micro-LED element includes an element pin, the bonding pad includes a bonding pin, in each welding pair of the element pin and the bonding pin, a length of the element pin is greater than a width of the bonding pin, and a non-zero angle is formed between the extending direction of the element pin and the extending direction of the bonding pin. When the element pin is deviated from the bonding pin in a certain range, the element pin can still be aligned accurately with the bonding pin. Thus, a requirement on the alignment precision between the micro-LED element and the bonding pad is lowered in a certain extent, thereby improving the yield.
    Type: Application
    Filed: January 9, 2018
    Publication date: January 17, 2019
    Inventors: Chaomin GAO, Yuan DING, Fei LI