Abstract: An optical system is provided. The optical system is used for disposing on an electronic device. The optical system includes a movable portion, a fixed portion, a first driving assembly, and a support module. The movable portion is used for connecting to an optical module. The fixed portion is affixed on the electronic device, and the movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion through the support module.

Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.

Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The movable part includes a connecting assembly configured to position the optical element.

Abstract: An optical element driving mechanism is provided in the present disclosure. The optical element driving mechanism includes a fixed portion and a movable portion. The movable portion moves relative to the fixed portion. The movable portion includes a first movable assembly and a second movable assembly. The first movable assembly is connected to a first optical element. The second movable assembly is connected to a second optical element. The first movable assembly and the second movable assembly are movable relative to each other.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A radio frequency (RF) communication assembly includes an RF communication circuit and a compensator apparatus. The compensator apparatus receives an input including an I-component of a pre-compensated signal, a Q-component of the pre-compensated signal, and encoded operating conditions of the RF communication circuit. The RF communication circuit includes RF circuit components causing signal impairments. The compensator apparatus perform neural network computing on the input, and the RF communication assembly generates a compensated output signal that compensates for at least a portion of the signal impairments.

Abstract: According to at least one aspect, a communication system is provided. The communication system includes a first switch device configured to receive a first plurality of radio frequency (RF) signals detected by an antenna array and provide an RF signal selected from among the first plurality of RF signals to a receiver circuit, the first plurality of RF signals comprising a first RF signal in a first frequency range and a second RF signal in a second frequency range that is different from the first frequency range; and a second switch device configured to receive a second plurality of RF signals detected by the antenna array and provide an RF signal selected from among the second plurality of RF signals to the receiver circuit, the second plurality of RF signals comprising a third RF signal in the first frequency range and a fourth RF signal in the second frequency range.

Abstract: According to at least one aspect, a communication system is provided. The communication system includes a first switch device configured to receive a first plurality of radio frequency (RF) signals detected by an antenna array and provide an RF signal selected from among the first plurality of RF signals to a receiver circuit, the first plurality of RF signals comprising a first RF signal in a first frequency range and a second RF signal in a second frequency range that is different from the first frequency range; and a second switch device configured to receive a second plurality of RF signals detected by the antenna array and provide an RF signal selected from among the second plurality of RF signals to the receiver circuit, the second plurality of RF signals comprising a third RF signal in the first frequency range and a fourth RF signal in the second frequency range.

Abstract: A filtering system includes a first filtering module, which includes a first frequency translating device and a first filter. The first frequency translating device includes a center frequency control end that receives a first control signal and an input end that receives an input signal, and performs a first frequency translation on the input signal by utilizing a first control frequency of the first control signal as a center frequency. The first filter performs a first filter on the input signal according to equivalent impedance of a circuit coupled to the input end, and generates in collaboration with the first frequency translating device a first filtered input signal at an output end of the filtering system. The equivalent impedance determines a bandwidth of the first filtered input signal.

Abstract: A filtering system includes a first filtering module, which includes a first frequency translating device and a first filter. The first frequency translating device includes a center frequency control end that receives a first control signal and an input end that receives an input signal, and performs a first frequency translation on the input signal by utilizing a first control frequency of the first control signal as a center frequency. The first filter performs a first filter on the input signal according to equivalent impedance of a circuit coupled to the input end, and generates in collaboration with the first frequency translating device a first filtered input signal at an output end of the filtering system. The equivalent impedance determines a bandwidth of the first filtered input signal.

Abstract: The invention discloses the variable attenuator with characteristics, comprising wide attenuation ranges; syntheses on group delays, and low variation of the group delay. The building blocks, which construct the variable attenuator, comprise internal matching networks, external matching networks, delay networks, protecting networks, biasing network, a power combining network, and variable impedance networks. The elements, which realize the internal matching networks, external matching networks, signal combining networks, comprise resistor, inductor, capacitor, and transmission lines. The elements, which realize the variable impedance networks, comprise n-channel field-effect transistor (FET), p-channel FET, n-type bipolar junction transistor (BJT), and p-type BJT. The elements of the variable attenuator can be either integrated on a semiconductor chip by using system-on-chip (SOC) technologies.

Abstract: The invention discloses the variable attenuator with characteristics, comprising wide attenuation ranges; syntheses on group delays, and low variation of the group delay. The building blocks, which construct the variable attenuator, comprise internal matching networks, external matching networks, delay networks, protecting networks, biasing network, a power combining network, and variable impedance networks. The elements, which realize the internal matching networks, external matching networks, signal combining networks, comprise resistor, inductor, capacitor, and transmission lines. The elements, which realize the variable impedance networks, comprise n-channel field-effect transistor (FET), p-channel FET, n-type bipolar junction transistor (BJT), and p-type BJT. The elements of the variable attenuator can be either integrated on a semiconductor chip by using system-on-chip (SOC) technologies.

Abstract: A system and method for customizing functions of a mobile phone provides different operation modes for different users of the mobile phone. The system and method further provides different function features under the different operation modes.

Abstract: A chip antenna has a dielectric material layer, a first meandered strip, a second meandered strip and several bended strips. The first meandered strip is meandered in one direction and disposed on the dielectric material layer. The second meandered strip is meandered in another direction and disposed on the dielectric material layer. The first meandered strip is connected to the second meandered strip. The bended strips are connected to the turns of the meandered strips.