Patents by Inventor Chaoyong ZHENG

Chaoyong ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240203653
    Abstract: Disclosed are a glass-packaged ceramic feedthrough filter and a preparation method thereof, which includes a guide needle and a metal shell sleeved in the middle of the guide needle; the bottom of the metal shell is encapsulated by a glass body; a gasket sleeved on the guide needle is arranged above the glass body; a disc-shaped multilayer ceramic capacitor is sleeved on the guide needle above the gasket; a first gap is formed between the bottom of the disc-shaped multilayer ceramic capacitor and the top of the glass body; a second gap is formed between the capacitor and the inner wall of the metal shell; and the first gap is communicated with the second gap. The size of the first gap is increased through the gasket, a second gap is reserved between the capacitor and the metal shell, so that the first gap is communicated with the second gap.
    Type: Application
    Filed: April 13, 2022
    Publication date: June 20, 2024
    Applicant: FUJIAN OUZHONG ELECTRONICS CO., LTD
    Inventors: Chaoyong ZHENG, Bin YE
  • Publication number: 20240055189
    Abstract: Disclosed is a highly reliable multilayer ceramic through-hole capacitor. It includes a multilayer ceramic through-hole capacitor body, which has at least one inner hole for inserting a first controlled expansion alloy tube. A guide pin is inserted into the first controlled expansion alloy tube, which undergoes annealing and surface electroplating treatment. The guide pin, first controlled expansion alloy tube, and inner hole are all fixed using lead-free solder. By welding the first controlled expansion alloy tube with the inner hole of the disk-shaped multilayer ceramic capacitor, the stress resistance capability of the capacitor is improved. This eliminates the need for lead-containing soldering materials with high ductility in the production process, allowing the capacitor to withstand multiple temperature changes without ceramic cracking. As a result, the multilayer ceramic through-hole capacitor achieves high reliability even in harsh external environments.
    Type: Application
    Filed: April 12, 2021
    Publication date: February 15, 2024
    Applicant: FUJIAN OUZHONG ELECTRONICS CO., LTD
    Inventors: Chaoyong ZHENG, Bin YE