Abstract: This application relates to wearable devices and sound pickup methods. An example method includes: displaying a first interface in response to a first operation, where the first interface is used to configure a sound pickup direction; and determining a target sound pickup direction in response to a second operation detected on the first interface. In some instances, the electronic device can provide a sound pickup direction configuration function by using the first interface, so that a user can select the target sound pickup direction based on an actual application situation, and the electronic device can directly pick up a sound signal based on the target sound pickup direction in a subsequent sound pickup process, or perform signal enhancement processing on a picked-up original sound signal based on the target sound pickup direction to obtain an enhanced sound signal in the target sound pickup direction in the original sound signal.

Abstract: This disclosure provides a map data updating method, a map data updating apparatus and an electronic device, and relates to the field of map technology. The method includes: obtaining update information of first map data, and a mapsheet in the first map data that corresponds to the update information; performing, based on a spatial update range of the update information, clipping processing on target data of the mapsheet to obtain first target mapsheet data, the first target mapsheet data including data in the target data that is within the spatial update range; updating, based on the first target mapsheet data and the update information, the first map data.

Abstract: A high-efficiency and high-precision combined machining apparatus for a diamond wafer sheet and a combined high-efficiency and high-precision method for machining a diamond wafer sheet are disclosed. The apparatus can comprise a machining motion platform component installed on a base, a laser machining component, a grinding component, a polishing component and a detection component installed on a support frame. In operation, a high-energy laser beam of the laser machining component can focus on the surface of the diamond wafer sheet to be machined and perform a straight reciprocating irradiation on the diamond wafer sheet, thereby realizing the planarization machining of the diamond wafer sheet. Further, the grinding component and the polishing component realize further high-precision grinding planarization and finishing polishing machining under the action of the laser machining component.