Patents by Inventor Charalampos Fragkiadakis

Charalampos Fragkiadakis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210126187
    Abstract: The present invention relates to an electrical element comprising a multilayer thin film ceramic member which is a dielectric exhibiting piezoelectric/electrostrictive properties which make it suitable for use in microelectromechanical systems.
    Type: Application
    Filed: November 5, 2020
    Publication date: April 29, 2021
    Inventors: Peter MARDILOVICH, Song Won KO, Susan TROLIER-MCKINSTRY, Charalampos FRAGKIADAKIS, Wanlin ZHU
  • Publication number: 20210036215
    Abstract: A method of poling piezoelectric elements of an actuator comprises applying an electric pulse heating waveform to the piezoelectric element(s) in order to increase the temperature thereof to a poling temperature (S202), applying an electric field poling waveform to the piezoelectric element(s) for a poling time period (S203), and apply an electric field holding poling waveform to the piezoelectric element(s) to maintain poling whilst the temperature of the actuator decreases (S204).
    Type: Application
    Filed: January 31, 2019
    Publication date: February 4, 2021
  • Publication number: 20150061019
    Abstract: Embodiments of the present invention provide methods of fabricating features of a semiconductor device array, the method including patterning a dielectric layer deposited on a conductive carrier, wherein patterning comprises forming a trench pattern defining at least one device contact, electrodepositing metal into the patterned trenches, transferring the dielectric layer and the electrodeposited metal to a substrate and removing the conductive carrier, and the method further comprising lithographically fabricating one or more further features of the semiconductor device array overlying the dielectric layer and electrodeposited metal.
    Type: Application
    Filed: April 20, 2012
    Publication date: March 5, 2015
    Inventors: John Christopher Rudin, Charalampos Fragkiadakis