Abstract: A method of forming a microelectronic package, and a package formed according to the method. The method includes: providing a microelectronic substrate including bonding pads and solder bumps on respective ones of the bonding pads; providing a microelectronic die including bumping sites thereon; providing solder caps on the bumping sites; positioning the die onto the substrate to form a die-substrate combination, positioning including placing respective ones of the solder caps on the die in registration with corresponding ones of the solder bumps on the substrate; and bonding the die to the substrate by subjecting the die-substrate combination to reflow to form solder joints from the solder caps and solder bumps.