Abstract: A nail polish removal device, especially an efficient toenail polish removal device from a user's feet, is disclosed. The device includes a housing with foot placement assembly having a first area and a second area adapted for receiving the toenails of both feet simultaneously. The device includes a reciprocating sponge assembly, coupled to the foot placement assembly such that the toenails are positioned in contact with the sponge assembly. The device further comprises a filler to receive nail polish removal fluid, which is in fluid communication with the reciprocating and rotating sponge assembly, via one or more tubes, to aid in the removal of nail polish from the toenails of the user's foot. The device further comprises a switch and other electronic components to actuate and reciprocate the sponge assembly, thereby enabling the user to remove the nail polish conveniently without scrubbing the nail polish manually.