Abstract: An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive frame. The frame is configured as having a generally C-shaped cross-sectional profile and includes an elongate end wall having an interior an exterior surface, and a pair of oppositely-disposed side walls extending from the end wall interior surface. Each of the side walls has an outer surface, one of which is disposable about the opening of the enclosure in electrically-conductive adjacency with the surface thereof, and an inner surface spaced-apart a first predetermined distance from the inner surface of the other of the side walls. The outer periphery of the medium is received intermediate the inner surfaces of the side walls such that each extends over a corresponding edge portion of the medium faces.

Abstract: An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive frame. The frame is configured as having a generally C-shaped cross-sectional profile and includes an elongate end wall having an interior an exterior surface, and a pair of oppositely-disposed side walls extending from the end wall interior surface. Each of the side walls has an outer surface, one of which is disposable about the opening of the enclosure in electrically-conductive adjacency with the surface thereof, and an inner surface spaced-apart a first predetermined distance from the inner surface of the other of the side walls. The outer periphery of the medium is received intermediate the inner surfaces of the side walls such that each extends over a corresponding edge portion of the medium faces.

Abstract: An electromagnetic interference (EMI) shielded vent panel construction for disposition over an opening of an electronics enclosure. The panel includes an electrically-conductive medium having an outer periphery supported within an electrically-conductive frame. The frame is configured as having a generally C-shaped cross-sectional profile and includes an elongate end wall having an interior an exterior surface, and a pair of oppositely-disposed side walls extending from the end wall interior surface. Each of the side walls has an outer surface, one of which is disposable about the opening of the enclosure in electrically-conductive adjacency with the surface thereof, and an inner surface spaced-apart a first predetermined distance from the inner surface of the other of the side walls. The outer periphery of the medium is received intermediate the inner surfaces of the side walls such that each extends over a corresponding edge portion of the medium faces.