Patents by Inventor Charles Allen Devries
Charles Allen Devries has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12347603Abstract: A molded inductor includes a winding having leads configured for attaching leads of the winding to pads on a package substrate, having a magnetic core with a body disposed within the winding, wherein the magnetic core has at least one mold flow enhancing feature that enhances a filling of a magnetic mold material as compared to a filling provided by a uniform cylindrical body. The magnetic mold material encases the winding and the magnetic core to form either a standalone discrete inductor component, or the magnetic component of an output filter of an integrated switching power converter module.Type: GrantFiled: December 28, 2018Date of Patent: July 1, 2025Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Joel Nathan Brassfield, Charles Allen DeVries, Jr., Kristen Nguyen Parrish
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Patent number: 11855540Abstract: A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.Type: GrantFiled: March 26, 2019Date of Patent: December 26, 2023Assignee: Texas Instruments IncorporatedInventors: Charles Allen DeVries, Jr., Kyle Brent Norell, Kristen Nguyen Parrish
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Patent number: 11798900Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.Type: GrantFiled: June 13, 2022Date of Patent: October 24, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Naweed Anjum, Michael Gerald Amaro, Charles Allen Devries, Jr.
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Patent number: 11744020Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.Type: GrantFiled: November 30, 2021Date of Patent: August 29, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Kyle Brent Norell, Claude Albert Fernandez, Charles Allen DeVries
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Publication number: 20230171894Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.Type: ApplicationFiled: November 30, 2021Publication date: June 1, 2023Inventors: Kyle Brent Norell, Claude Albert Fernandez, Charles Allen DeVries
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Publication number: 20230013938Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.Type: ApplicationFiled: September 19, 2022Publication date: January 19, 2023Inventors: Yuki Sato, Kenji Otake, Takafumi Ando, Jeffrey Morroni, Charles Allen Devries, JR., Kristen Nguyen Parrish
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Patent number: 11495549Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.Type: GrantFiled: February 25, 2021Date of Patent: November 8, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Naweed Anjum, Michael Gerald Amaro, Charles Allen Devries, Jr.
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Publication number: 20220310535Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Inventors: Naweed Anjum, Michael Gerald Amaro, Charles Allen Devries
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Patent number: 11456262Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.Type: GrantFiled: December 30, 2020Date of Patent: September 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yuki Sato, Kenji Otake, Takafumi Ando, Jeffrey Morroni, Charles Allen Devries, Jr., Kristen Nguyen Parrish
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Publication number: 20220270984Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.Type: ApplicationFiled: February 25, 2021Publication date: August 25, 2022Applicant: Texas Instruments IncorporatedInventors: Naweed Anjum, Michael Gerald Amaro, Charles Allen Devries, JR.
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Publication number: 20210343662Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.Type: ApplicationFiled: December 30, 2020Publication date: November 4, 2021Inventors: Yuki Sato, Kenji Otake, Takafumi Ando, Jeffrey Morroni, Charles Allen Devries, JR., Kristen Nguyen Parrish
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Publication number: 20200313555Abstract: A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.Type: ApplicationFiled: March 26, 2019Publication date: October 1, 2020Inventors: Charles Allen DeVries, JR., Kyle Brent Norell, Kristen Nguyen Parrish
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Patent number: 7224153Abstract: A power regulator has an output for regulated power that is connected to supply power to a load. The load can have various electrical characteristics, including requiring a rapid transient response. The transient response amplitude for the power regulator is decreased by adding capacitance at the output, but that slows the response time of the power regulator by lowering the crossover frequency and the phase margin at the crossover frequency. An adjustable gain element imbedded in the feedback network provides an input to permit a builder or user of the power regulator to vary the effective value of impedance elements in the feedback network. The builder or user selectively connects an impedance to the input of the adjustable gain element to thereby adjust the frequency characteristics of the feedback network to thereby adjust output characteristics of the power regulator to compensate for the effects of capacitance added to the power regulator output.Type: GrantFiled: April 26, 2005Date of Patent: May 29, 2007Assignee: Texas Instruments IncorporatedInventors: Charles Allen DeVries, Jr., Joseph Gerard Renauer, Michael G. Amaro