Abstract: The present disclosure provides a method of forming a device structure. The method comprises providing at least one device component having front and rear device component surfaces and having at least one electrically conductive region on at least one of the device component surfaces. The method further comprises providing at least one contact sheet comprising a polymeric material and at least one electrically conductive element that has a non-circular cross-sectional shape and is embedded in the polymeric material in a manner such that a surface portion of the at least one electrically conductive element is exposed. The method also comprises applying a bonding material to either one or both of the exposed surface portion and at least one of the electrically conductive regions on the at least one of the device component surfaces.