Abstract: An apparatus for forming composite, fiber/resin components with fibrous, resin-impregnated tape is disclosed. The apparatus employs a gantry for positioning a tape dispensing head assembly over a mold structure, which defines a mold surface of planar or contoured configuration. A control system is employed having sensing devices for generating signals indicative of relative positions of components of the apparatus in several axes of permissible movement, and tape application is effected by means of major and secondary command inputs to appropriate servomotor devices. Primary and initial movement is controlled in accordance with a sequence command program in cooperation with a resident program in a digital computer, and a second, adaptive control system is alternatively employed for enabling the tape dispensing head to follow vertical contours of the mold surface during X-Y movement across the surface.

Abstract: Disclosed is a means and method for evaluating a bond between first and second structures bonded together by an intermediate layer of adhesive. Means are provided for transmitting a pulse of ultrasonic wave energy into the bonded structures whereby a first reflected pulse may be reflected from a first surface of the first structure, a second reflected pulse reflected from the layer of adhesive, and a third pulse possibly reflected from the surface of the second structure adjacent the adhesive layer. Circuit means are provided for sensing the first, second, and third reflected pulses and for providing an indication of the quality of the bond by comparing the amplitudes of the reflected pulses and determining if the ratios lie within predetermined ranges.

Abstract: Disclosed is an apparatus and method for evaluating a bond between first and second structures bonded together by an intermediate layer of adhesive. Apparatus is provided for transmitting a pulse of ultrasonic wave energy that has a duration at least as short as 1.5 wave cycles into the bonded structures whereby a first reflected pulse may be reflected from a first surface of the first structure, a second reflected pulse reflected from the layer of adhesive, and a third pulse possibly reflected from the surface of the second structure adjacent the adhesive layer. Circuits are provided for sensing the first, second, and third reflected pulses and for providing an indication of the quality of the bond by comparing the amplitudes of the reflected pulses and determining if the ratios lie within predetermined ranges.