Abstract: A planar magnetron sputtering device has an extended flat circular target source in opposed spaced parallel relationship with a generally flat article to be coated, placed within an evacuated coating chamber. Crossed electric and magnetic fields in the chamber are established in order to set up a plasma adjacent the target. The magnetic field is provided by a magnetic assembly of permanent magnets on the non-vacuum side of the target. The magnetic assembly is smaller in diameter than the target, but is mounted to a means for moving the assembly laterally over the entire area of the target. This means for moving sweeps the magnetic assembly in an eccentric path generally centered on the target center, with the path being non-reentrant and precessing about the target center with time. In this manner, the path sweeps different areas on successive rotations about the center, and a given area of target is exposed to the magnetic field at many successively different orientations.

Abstract: An automatic sputtering apparatus for coating semiconductor wafers uses shuttle wafer carriers and elevators to handle wafers within the apparatus. The wafer carrier has a hole in the center. One side of the wafer carrier is opened, thereby forming a throat in the shuttle wafer carrier in the form of the letter C. The elevator has a cantilevered shaft. The upper part of the shaft of the elevator is centered under the wafer while the lowest part of the cantilevered shaft is under a point outside the wafer carrier. The connecting portion of the shaft passes through the throat of the wafer carrier as the wafer is lifted. Since the lifting portion of the shaft is outside the wafer carrier, the shuttle can move with the elevator in the up position. The pedestal for holding the wafer on the elevator is equipped with arms which project upward at an angle to the horizontal, thereby confining the wafer to a pedestal.

Abstract: An automatic sputtering apparatus for coating semiconductor wafers uses shuttle wafer carriers and elevators to handle wafers within the apparatus. The wafer carrier has a hole in the center. One side of the wafer carrier is opened, thereby forming a throat in the shuttle wafer carrier in the form of the letter C. The elevator has a cantilevered shaft. The upper part of the shaft of the elevator is centered under the wafer while the lowest part of the cantilevered shaft is under a point outside the wafer carrier. The connecting portion of the shaft passes through the throat of the wafer carrier as the wafer is lifted. Since the lifting portion of the shaft is outside the wafer carrier, the shuttle can move with the elevator in the up position. The pedestal for holding the wafer on the elevator is equipped with arms which project upward at an angle to the horizontal, thereby confining the wafer to a pedestal.

Abstract: A planar magnetron etching device having a movable magnetic source which is moved with respect to a substrate to cause lines magnetic flux parallel to the surface of the substrate to sweep above the surface of the substrate during the etching process.

Abstract: A wafer transport system for use in in-line sputtering systems having a first magnet exterior to a process chamber and a second magnet in the process chamber connected to wafer support arms carrying wafers such that the magnetic coupling between the magnets permits the positioning of the wafer support arms in a desired location by movement of the exterior magnet.

Abstract: A planar magnetron sputtering device having a movable magnetic source which is hydraulically moved with respect to a target and substrate to cause lines magnetic flux parallel to the surface of the target to sweep over the surface of the target during the sputtering process.

Abstract: A granular composition is comprised of primary carrier particles that are mixed with a liquid containing an active ingredient which saturates, by adsorption, the surface of each particle. A second carrier material is then mixed in so that secondary carrier particles adhere to the surface of each primary particle to form an agglomerate. The secondary carrier adsorbs additional liquid in the composition so that the composition may be handled as a granular mass.