Patents by Inventor Charles Baab

Charles Baab has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for using universal cavity wafer in wafer level packaging
    Patent number: 10418249
    Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: September 17, 2019
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Maurice Karpman, Michael Rickley, Andrew Mueller, Nicole Mueller, Jeffrey Thompson, Charles Baab
  • METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVEL PACKAGING
    Publication number: 20180108533
    Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.
    Type: Application
    Filed: December 19, 2017
    Publication date: April 19, 2018
    Applicant: The Charles Stark Draper Laboratory, Inc.
    Inventors: Maurice Karpman, Michael Rickley, Andrew Mueller, Nicole Mueller, Jeffrey Thompson, Charles Baab
  • Method and apparatus for using universal cavity wafer in wafer level packaging
    Patent number: 9847230
    Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: December 19, 2017
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Maurice Karpman, Michael Rickley, Andrew Mueller, Nicole Mueller, Jeffrey Thompson, Charles Baab
  • METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVEL PACKAGING
    Publication number: 20160365321
    Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.
    Type: Application
    Filed: June 9, 2016
    Publication date: December 15, 2016
    Inventors: Maurice Karpman, Michael Rickley, Andrew Mueller, Nicole Mueller, Jeffrey Thompson, Charles Baab