Abstract: Polyketone resins are used as an ingredient of the release coating for a flexible pressure-sensitive tape. The release coatings are printable and at the same time remain effective as release agents due to the presence of the polyketone resins. The polyketone resins are blended with a monomeric or polymeric release agent and an elastomeric or resinous film former to give the improved properties.

Abstract: Improved high temperature and high humidity resistant release agents for pressure sensitive tapes are provided. Reaction products of (1) a polyanhydride resin and (2) water or an amine or an alcohol are applied as a thin coating to the tape to permit easy unwinding of the tape, even though it may have been stored at elevated temperature or humidity.

Abstract: A solvent-free pressure-sensitive hot-melt adhesive contains:A. a block copolymer having the general configuration A--B--A wherein A is a polymer block of vinyl arene and B is a polymer block of conjugated diene,B. a tackifying resin system,C. a naphthenic process oil plasticizer having a naphthenic content between 52% and 75% and less than 5% aromatic by total carbon types of the process oil,D. a curing agent,E. a filler, andF. an antioxidant.The hot-melt adhesive described above can be applied to a number of backings without the use of solvents. The adhesive is rendered fluid by the use of heat and mechanical working. Adhesive tape made using the hot melt of the present formulation has all of the advantages inherent in the prior art tapes based upon solvent applied adhesives. The use of the hot-melt adhesive described above prevents air pollution which was inherent in the solvent removal step necessary in the prior art use of solvent based adhesive systems.