Abstract: A vented cover includes a pair of cross-flow ventilation ducts each including an acoustic noise reduction lining. The ducts are “cross-flow” in that they cross and bypass one another. The cover is affixed to an enclosure containing components of a computer system and abuts against a panel of the enclosure having an airflow aperture. An air moving device (AMD) passes air through the enclosure from the ducts if the cover is an intake cover, and/or into the ducts if the cover is an exhaust cover. The ducts increase the air path length, and the acoustic absorbing surface, thereby increasing acoustic attenuation. Airflow resistance is reduced by reducing surfaces perpendicular and close to the area where air enters and by reducing sharp turns in the ducts. The cover has a relatively thin depth because the ducts cross and bypass each other in a very space efficient manner.

Abstract: A vented cover includes a pair of cross-flow ventilation ducts each including an acoustic noise reduction lining. The ducts are “cross-flow” in that they cross and bypass one another. The cover is affixed to an enclosure containing components of a computer system and abuts against a panel of the enclosure having an airflow aperture. An air moving device (AMD) passes air through the enclosure from the ducts if the cover is an intake cover, and/or into the ducts if the cover is an exhaust cover. The ducts increase the air path length, and the acoustic absorbing surface, thereby increasing acoustic attenuation. Airflow resistance is reduced by reducing surfaces perpendicular and close to the area where air enters and by reducing sharp turns in the ducts. The cover has a relatively thin depth because the ducts cross and bypass each other in a very space efficient manner.

Abstract: A vented cover includes a pair of cross-flow ventilation ducts each including an acoustic noise reduction lining. The ducts are “cross-flow” in that they cross and bypass one another. The cover is affixed to an enclosure containing components of a computer system and abuts against a panel of the enclosure having an airflow aperture. An air moving device (AMD) passes air through the enclosure from the ducts if the cover is an intake cover, and/or into the ducts if the cover is an exhaust cover. The ducts increase the air path length, and the acoustic absorbing surface, thereby increasing acoustic attenuation. Airflow resistance is reduced by reducing surfaces perpendicular and close to the area where air enters and by reducing sharp turns in the ducts. The cover has a relatively thin depth because the ducts cross and bypass each other in a very space efficient manner.

Abstract: Polyketone resins are used as an ingredient of the release coating for a flexible pressure-sensitive tape. The release coatings are printable and at the same time remain effective as release agents due to the presence of the polyketone resins. The polyketone resins are blended with a monomeric or polymeric release agent and an elastomeric or resinous film former to give the improved properties.

Abstract: Improved high temperature and high humidity resistant release agents for pressure sensitive tapes are provided. Reaction products of (1) a polyanhydride resin and (2) water or an amine or an alcohol are applied as a thin coating to the tape to permit easy unwinding of the tape, even though it may have been stored at elevated temperature or humidity.

Abstract: A solvent-free pressure-sensitive hot-melt adhesive contains:A. a block copolymer having the general configuration A--B--A wherein A is a polymer block of vinyl arene and B is a polymer block of conjugated diene,B. a tackifying resin system,C. a naphthenic process oil plasticizer having a naphthenic content between 52% and 75% and less than 5% aromatic by total carbon types of the process oil,D. a curing agent,E. a filler, andF. an antioxidant.The hot-melt adhesive described above can be applied to a number of backings without the use of solvents. The adhesive is rendered fluid by the use of heat and mechanical working. Adhesive tape made using the hot melt of the present formulation has all of the advantages inherent in the prior art tapes based upon solvent applied adhesives. The use of the hot-melt adhesive described above prevents air pollution which was inherent in the solvent removal step necessary in the prior art use of solvent based adhesive systems.