Abstract: Described are systems, devices, and methods useful in the prevention and/or detection of liquid intrusion into ultrasound equipment. Ultrasound transducers and associated ultrasound circuitry, which can be located in an interior of an ultrasound system or device can be adversely affected by exposure to liquids. As described herein, ultrasound systems and devices can comprise a multilayer seal, for example, wherein the multilayer seal comprises one or more layers for preventing liquid intrusion and one or more layers for detection of liquid intrusion (e.g., wherein the one or more layers for detection of liquid intrusion comprise an indicator material capable of changing color when exposed to a liquid).

Abstract: Described are acoustic absorber materials with high acoustic attenuation and high thermal conductivity comprising an inorganic, porous foam and an absorbing material within at least a portion of the pores of the foam, ultrasound transducers and devices including the same, as well as methods of making the materials.

Abstract: A method for forming an acoustical stack for an ultrasound probe comprises partly dicing a single crystal piezoelectric material to form single crystal pieces that are partly separated by a plurality of kerfs. The single crystal piezoelectric material comprises a carrier layer. The kerfs are filled with a kerf filling material to form a single crystal composite and the carrier layer is removed. At least one matching layer is attached to the single crystal composite, and dicing within the kerfs is accomplished to form separate acoustical stacks from the single crystal composite.

Abstract: An acoustical stack for an ultrasound probe comprises a piezoelectric layer having top and bottom sides and a plurality of matching layer sections forming a matching layer structure. Each of the matching layer sections comprises a spring layer comprising a first material and a mass layer comprising a second material that is different than the first material. The spring layer within the matching layer section that is positioned closest to the piezoelectric layer is thinner than the spring layer within the other matching layer sections.

Abstract: An acoustical stack for an ultrasound probe comprises a piezoelectric layer having top and bottom sides and a plurality of matching layer sections forming a matching layer structure. Each of the matching layer sections comprises a spring layer comprising a first material and a mass layer comprising a second material that is different than the first material. The spring layer within the matching layer section that is positioned closest to the piezoelectric layer is thinner than the spring layer within the other matching layer sections.

Abstract: A method for forming an acoustical stack for an ultrasound probe comprises partly dicing a single crystal piezoelectric material to form single crystal pieces that are partly separated by a plurality of kerfs. The single crystal piezoelectric material comprises a carrier layer. The kerfs are filled with a kerf filling material to form a single crystal composite and the carrier layer is removed. At least one matching layer is attached to the single crystal composite, and dicing within the kerfs is accomplished to form separate acoustical stacks from the single crystal composite.

Abstract: A method to fabricate a catheter tip that encapsulates a mechanically actuated ultrasound transducer assembly is provided.

Abstract: A catheter tip (50, 170) is provided that is adapted for mating attachment to a catheter body (90, 300). In an embodiment, the catheter tip (50,170) comprises a transducer array (32, 60, 110, 210) in electrical communication with an interconnect (120, 220) and in a mechanical driven relationship with an actuator (80), also in the catheter tip (50, 170), via a drive shaft (38, 82). Oscillating back and forth motion of the transducer array (32, 60, 110, 210) provides ultrasonic imaging functionality that may include real time three-dimensional imaging. Other embodiments of the catheter tip (50, 170) and methods of fabrication also are provided.

Abstract: A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.

Abstract: A catheter apparatus includes a catheter having an electroactive polymer inside. The electroactive polymer is configured to control either or both shape and/or direction of the catheter in a vessel as the electroactive polymer is electrically activated. The apparatus further includes a computer which may be denoted as a “control computer.” The computer includes a memory and a processor configured to store vascular information and determine voltages to be applied to activate the electroactive polymer to steer the catheter to a desired site after it is inserted into a body. Also included is an electrical source responsive to the computer and configured to apply the determined voltages to the electroactive polymer.

Abstract: A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.

Abstract: A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

Abstract: A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.

Abstract: The present technique provides for the manufacture and/or use of an ultrasound probe configured to acquire non-imaging data in addition to imaging data. In particular, the ultrasound probe includes a micro-machined ultrasound transducer formed on the surface of a substrate using micro-electric mechanical systems techniques or other techniques associated with semiconductor processing. Non-imaging sensors are formed on the substrate, either on the surface or the interior, or on a substrate proximate to the substrate upon which the transducer is formed. The non-imaging sensors may be used to acquire non-imaging data in conjunction with the acquisition of imaging data by the transducer.

Abstract: The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

Abstract: A method, system, and storage medium for providing web-based supplier performance data across a supply chain is disclosed. The method includes gathering customer data and supplier data and storing it in a data repository, parsing purchase order data from a plurality of purchase orders and storing parsed purchase order data in the data repository, and parsing shipping receipt data from a plurality of shipping receipts and storing parsed shipping receipt data in the data repository. The method also includes receiving a request for supplier performance metrics from a requester. The request includes at least one supplier selection, at least one customer selection, and a report type selection. The method further includes retrieving data corresponding to the request from the data repository, processing the data in accordance with the report type selection resulting in a supplier performance report, and presenting the supplier performance report to the requester over a network.

Abstract: A fine-pitch acoustic transducer array that has a backing made of acoustically attenuative material. The backing material is prepared by homogeneously combining a matrix component and filler components having an average particle size less than one-fifth (preferably less than one-tenth) of the smallest dimension of the elements making up the array. In certain embodiments, the acoustically attenuative material comprises 25-45 wt. % tungsten particles, 15-35 wt. % silicone particles and 40-60 wt. % epoxy.

Abstract: A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

Abstract: Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers are electrically connected to form interdigitated electrodes. The total electrical impedance of a multi-layer stack comprised of piezoelectric layers connected in this manner is inversely related to the square of the number of layers in the stack. This provides for better matching of the acoustic stack impedance to that of the electrical cable and improved acoustic element sensitivity.

Abstract: A method for bonding one surface to a gold surface comprises the following steps: (a) mixing a solution containing sulfur-containing alkoxysilane; (b) treating the gold surface with the solution; (c) adding sulfur-containing alkoxysilane to an adhesive material; (d) applying the adhesive material with additive on one of both surfaces; and (e) pressing the surfaces against each other while the adhesive material therebetween sets.